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Nonaqueous dispersion of fluororesin, fluororesin-containing thermosetting resin composition using same and cured product thereof

A technology of thermosetting resin and resin composition, applied in the field of non-aqueous dispersion of fluorine-based resin, thermosetting resin composition of fluorine-containing resin using the same, and cured product thereof, can solve the problem of cover film, flexible printed circuit Influence of insulation on board electrical characteristics, relative dielectric constant, deterioration of dielectric loss angle, unsuitability for high-speed communication, high-speed processing, etc., to achieve the effects of excellent storage stability, low dielectric constant, and excellent processability

Active Publication Date: 2021-05-28
MITSUBISHI PENCIL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0034] However, the colored polyimide materials such as the colored polyimide films described in the above-mentioned Patent Documents 9 to 14 have the following problems: when colored with coloring materials such as organic pigments and inorganic pigments, the color of the cover film and the flexible printed circuit board is affected. Electrical properties (relative permittivity, dielectric loss tangent), insulation influence
[0035] In particular, when carbon black is used for black coloring, not only the insulation properties are lowered, but also the relative permittivity and dielectric loss tangent are deteriorated, so there are problems such as being unsuitable for applications such as high-speed communication and high-speed processing.

Method used

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  • Nonaqueous dispersion of fluororesin, fluororesin-containing thermosetting resin composition using same and cured product thereof
  • Nonaqueous dispersion of fluororesin, fluororesin-containing thermosetting resin composition using same and cured product thereof
  • Nonaqueous dispersion of fluororesin, fluororesin-containing thermosetting resin composition using same and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1、2 and comparative example 1～3

[0415] [Examples 1 and 2 and Comparative Examples 1 to 3: Preparation of thermosetting resin composition of fluorine-containing resin]

[0416] Using the obtained dispersions 1 to 4, a thermosetting resin composition of a fluorine-containing resin was produced with the compounding recipe shown in Table 3 below. In addition, Comparative Example 3 was produced as a composition consisting only of a resin to which no PTFE dispersion was added.

[0417] After mixing in the compounding ratios shown in Examples 1 and 2 and Comparative Examples 1 to 3, the PTFE dispersion and the resin were stirred and mixed uniformly using a disperser to obtain a thermosetting resin composition of a fluorine-containing resin .

[0418] Here, any compounding of Examples 1 and 2, and Comparative Examples 1 and 2 showed a very uniform state, and aggregates of PTFE and the like were not observed.

[0419] [table 3]

[0420] (parts by mass)

[0421]

Embodiment 3、4 and comparative example 4～6

[0422] [Examples 3 and 4 and Comparative Examples 4 to 6: Preparation of thermosetting resin cured products of fluorine-containing resins]

[0423] Using a coater, apply the thermosetting resin compositions of fluorine-containing resins obtained in Examples 1, 2, and Comparative Examples 1 to 3 to polyamide so that the thickness after drying becomes about 25 μm and becomes uniform. The entire surface of one side of the imide film (thickness: 25 μm) was dried at about 120° C. for about 10 minutes, and then cured by heating at 180° C. for 60 minutes to prepare a sample for relative permittivity evaluation.

[0424] 〔Evaluation of Relative Permittivity〕

[0425] The relative permittivity was measured at 1 GHz using an impedance analyzer (Impedence Analyzer) in accordance with the test standard of JIS C6481-1996.

[0426] [Evaluation of adhesion strength]

[0427] Copper foil (thickness 18 μm) roughened on one side was covered with a 100 μm thick sieve as a spacer, and the fluor...

Embodiment 5、6 and comparative example 7～9

[0446] [Examples 5 and 6 and Comparative Examples 7 to 9: Preparation of thermosetting resin compositions of fluorine-containing resins]

[0447] Using the obtained dispersions 5 to 8, a thermosetting resin composition of a fluorine-containing resin was produced with the compounding recipe shown in Table 7 below. In addition, Comparative Example 9 was produced as a composition consisting only of a resin to which no PTFE dispersion was added.

[0448] After mixing at the compounding ratios shown in Examples 5 and 6 and Comparative Examples 7 to 9, the PTFE dispersion and the resin were stirred and mixed uniformly using a disperser to obtain a thermosetting resin composition of a fluorine-containing resin .

[0449] Here, the compounds of Examples 5 and 6, and Comparative Examples 7 and 8 all showed a very uniform state, and aggregates of PTFE and the like were not observed.

[0450] [Table 7]

[0451] (parts by mass)

[0452]

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Abstract

The invention relates to a nonaqueous dispersion of fluororesin, afluororesin-containing thermosetting resin composition using the same and a cured product thereof. Provided are a nonaqueous dispersion of fluororesin, a fluororesin-containing thermosetting resin composition using the same, a polyimide precursor solution composition, and the like, wherein the nonaqueous dispersion of the fluororesin is suitable for use in an insulating layer of a printed circuit board, an adhesive for a circuit substrate, a laminate for a circuit substrate, a coverlay film, and prepreg, which has a minute particle diameter, low viscosity, and excellent storage stability, can be properly mixed with a resin material such as a thermosetting resin composition or the like, and can suppress the degradation of adhesion strength and bonding strength while achieving a low dielectric constant and a low dielectric tangent. The nonaqueous dispersion of the fluororesin at least contains micro-powder of fluororesin, a urethane particle, a compound represented by the following formula (I) (in Formula (I) l, m, and n are positive integers.), and a non-aqueous solvent.

Description

[0001] This application is filed on May 25, 2017, the application number is 201710377232.2, and the title of the invention is a non-aqueous dispersion of fluorine-based resin, a thermosetting resin composition using the fluorine-containing resin and its cured product. Divisional application. technical field [0002] The present invention relates to a non-aqueous dispersion of a fluorine-based resin having a fine particle size, low viscosity, and excellent storage stability, a thermally curable resin composition of a fluorine-containing resin using the same, a cured product thereof, and a polyimide precursor solution combination things etc. Background technique [0003] In recent years, along with the advancement of high-speed electronic equipment, high-function, etc., high-speed communication speed and the like are required. Among them, low dielectric constant and low dielectric loss tangent are required for various electronic equipment materials, and low dielectric constan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D127/18C09D5/25C09D7/65C08J7/04C08L79/08
CPCC09D163/00C09D5/00C08J2379/08C08J2463/00C08L2201/08C08L2205/035C08L2205/025C08L2203/20C09D7/65C08J7/04C08L27/18C08L29/14C08J3/09C08L75/04C08L101/04C08G73/105
Inventor 佐藤厚志阿部寛史阪上正史铃木孝典
Owner MITSUBISHI PENCIL CO LTD
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