Resin composition, thermosetting film using same, resin cured product, laminate, printed wiring board and semiconductor device

A technology of resin composition and resin cured product, which is applied in the direction of printed circuit, printed circuit parts, circuit substrate materials, etc., and can solve the problems of insufficient bonding strength and the like

Active Publication Date: 2019-06-21
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the adhesive strength of the adhesive film de...

Method used

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  • Resin composition, thermosetting film using same, resin cured product, laminate, printed wiring board and semiconductor device
  • Resin composition, thermosetting film using same, resin cured product, laminate, printed wiring board and semiconductor device
  • Resin composition, thermosetting film using same, resin cured product, laminate, printed wiring board and semiconductor device

Examples

Experimental program
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Embodiment 1～11

[0107] (Examples 1-11, Comparative Examples 1-4)

[0108] According to the formula shown in the following table, measure the specified amount of each resin (A-1, A-2, A-3, B-1, B-2, B-3, B-4 and B- 5) and a specified amount of toluene. Next, after heating and dissolving the mixture of the resin and toluene using a heating stirrer, it was cooled to room temperature. Next, predetermined amounts of imidazole compounds and the like (C-1, C'-1, C'-2, C'-3, and C'-4) are thrown into the mixture. Then, the obtained mixture of (A) component, (B) component, and (C) or (C') component was stirred and mixed with a self-rotating or revolving mixer (MAZERUSTAR (trade name), manufactured by Kurabo Bosho Co., Ltd.) 3 minutes, thereby preparing a resin composition. However, in Example 11, fused spherical silica filler (manufactured by Ronsen Co., Ltd. MP-15EF, average particle diameter: 1.5 μm) was also added to the resin composition as an inorganic filler, and then, using a bead mill, The...

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Abstract

Provided are: a thermosetting film which has excellent bonding strength to a metal foil contained in wiring lines of a printed wiring board and a substrate material such as a polyimide, while exhibiting dielectric characteristics in a high frequency region, specifically, a low dielectric constant (epsilon) and a low dielectric loss tangent (tan(delta)) in a frequency region of 1-100 GHz; and a resin composition which is used for the production of this thermosetting film. A resin composition which contains (A) an epoxy resin, (B) a resin that has a dielectric loss tangent (tan(delta)) of less than 0.005 in a frequency region of 1-100 GHz and (C) an imidazole compound wherein a side chain having an alkyl group with 5 or more carbon atoms is present at the 1-position of a heterocyclic ring.

Description

technical field [0001] The present invention relates to a resin composition, a thermosetting film using the same, a resin cured product, a laminate, a printed circuit board, and a semiconductor device. Background technique [0002] In recent years, the miniaturization, weight reduction, and performance enhancement of electrical and electronic equipment have progressed. Accordingly, printed wiring boards used in these devices, especially multilayer printed wiring boards, are required to have higher multilayer, higher density, thinner, lighter, higher reliability, moldability, and the like. In addition, with the recent demand for higher speed of transmission signals on printed circuit boards, the high frequency of transmission signals has been significantly advanced. Therefore, materials used for printed wiring boards are required to be able to reduce electrical signal loss in a high-frequency region, specifically, a region with a frequency of 1 GHz or higher. [0003] For i...

Claims

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Application Information

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IPC IPC(8): C08L101/12B32B15/08B32B15/092C08K5/3445C08L63/00H05K1/03
CPCB32B15/08B32B15/092C08K5/3445C08L63/00C08L101/12H05K1/03C08G59/5073C08J5/18H05K1/0326C08J2363/00
Inventor 佐藤淳也黑川津与志吉田真树
Owner NAMICS CORPORATION
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