Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resin composition, thermosetting film using same, resin cured product, laminated board, printed circuit board and semiconductor device

A technology of resin composition and resin cured product, which is applied in the direction of printed circuit, printed circuit parts, circuit substrate materials, etc., can solve the problem of insufficient bonding strength, and achieve the effect of excellent bonding strength

Active Publication Date: 2021-04-27
NAMICS CORPORATION
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the adhesive strength of the adhesive film described in Patent Document 1 may not necessarily be sufficient.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition, thermosetting film using same, resin cured product, laminated board, printed circuit board and semiconductor device
  • Resin composition, thermosetting film using same, resin cured product, laminated board, printed circuit board and semiconductor device
  • Resin composition, thermosetting film using same, resin cured product, laminated board, printed circuit board and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～11

[0107] (Examples 1-11, Comparative Examples 1-4)

[0108] According to the formula shown in the following table, measure the specified amount of each resin (A-1, A-2, A-3, B-1, B-2, B-3, B-4 and B- 5) and a specified amount of toluene. Next, after heating and dissolving the mixture of the resin and toluene using a heating stirrer, it was cooled to room temperature. Next, predetermined amounts of imidazole compounds and the like (C-1, C'-1, C'-2, C'-3, and C'-4) are thrown into the mixture. Then, the obtained mixture of (A) component, (B) component, and (C) or (C') component was stirred and mixed with a self-rotating or revolving mixer (MAZERUSTAR (trade name), manufactured by Kurabo Bosho Co., Ltd.) 3 minutes, thereby preparing a resin composition. However, in Example 11, fused spherical silica filler (manufactured by Ronsen Co., Ltd. MP-15EF, average particle diameter: 1.5 μm) was also added to the resin composition as an inorganic filler, and then, using a bead mill, The...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
peel strengthaaaaaaaaaa
thicknessaaaaaaaaaa
peel strengthaaaaaaaaaa
Login to View More

Abstract

The present invention provides a substrate having excellent adhesive strength to substrate materials such as metal foil and polyimide contained in the wiring of a printed circuit board, and has dielectric properties in a high-frequency region, specifically, a frequency of 1 to 100 GHz. A thermosetting film exhibiting a low dielectric constant (ε) and a low dielectric loss tangent (tanδ) in the region, and a resin composition used for producing the thermosetting film. The resin combination includes (A) an epoxy resin, (B) a resin having a dielectric loss tangent (tanδ) of less than 0.005 in the frequency range of 1 to 100 GHz, and (C) a carbon atom number in the 1-position of a heterocyclic ring. An imidazole compound having a side chain of an alkyl group having 5 or more.

Description

technical field [0001] The present invention relates to a resin composition, a thermosetting film using the same, a resin cured product, a laminate, a printed circuit board, and a semiconductor device. Background technique [0002] In recent years, the miniaturization, weight reduction, and performance enhancement of electrical and electronic equipment have progressed. Accordingly, printed wiring boards used in these devices, especially multilayer printed wiring boards, are required to have higher multilayer, higher density, thinner, lighter, higher reliability, moldability, and the like. In addition, with the recent demand for higher speed of transmission signals on printed circuit boards, the high frequency of transmission signals has been significantly advanced. Therefore, materials used for printed wiring boards are required to be able to reduce electrical signal loss in a high-frequency region, specifically, a region with a frequency of 1 GHz or higher. [0003] For i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L101/12B32B15/08B32B15/092C08K5/3445C08L63/00H05K1/03
CPCB32B15/08B32B15/092C08K5/3445C08L63/00C08L101/12H05K1/03C08G59/5073C08J5/18H05K1/0326C08J2363/00
Inventor 佐藤淳也黑川津与志吉田真树
Owner NAMICS CORPORATION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com