Resin composition, thermosetting film using same, resin cured product, laminated board, printed circuit board and semiconductor device
A technology of resin composition and resin cured product, which is applied in the direction of printed circuit, printed circuit parts, circuit substrate materials, etc., can solve the problem of insufficient bonding strength, and achieve the effect of excellent bonding strength
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[0107] (Examples 1-11, Comparative Examples 1-4)
[0108] According to the formula shown in the following table, measure the specified amount of each resin (A-1, A-2, A-3, B-1, B-2, B-3, B-4 and B- 5) and a specified amount of toluene. Next, after heating and dissolving the mixture of the resin and toluene using a heating stirrer, it was cooled to room temperature. Next, predetermined amounts of imidazole compounds and the like (C-1, C'-1, C'-2, C'-3, and C'-4) are thrown into the mixture. Then, the obtained mixture of (A) component, (B) component, and (C) or (C') component was stirred and mixed with a self-rotating or revolving mixer (MAZERUSTAR (trade name), manufactured by Kurabo Bosho Co., Ltd.) 3 minutes, thereby preparing a resin composition. However, in Example 11, fused spherical silica filler (manufactured by Ronsen Co., Ltd. MP-15EF, average particle diameter: 1.5 μm) was also added to the resin composition as an inorganic filler, and then, using a bead mill, The...
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