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Thermosetting resin composition and application thereof

A resin composition, thermosetting technology, applied in synthetic resin layered products, electrical components, printed circuits, etc., can solve the problems of low glass transition temperature, low heat resistance, and low product qualification rate of cured products

Inactive Publication Date: 2015-09-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the copper-clad laminate composition uses cyanate resin and styrene maleic anhydride and its derivatives to improve the glass transition temperature of the epoxy resin system and has excellent high-frequency dielectric properties, but the system used There are acid anhydride groups in the molecular structure of the styrene-maleic anhydride copolymer, which can generate carboxyl groups with poor thermal stability and heat and humidity resistance; Used together, it will further deteriorate the heat and humidity resistance
Although the resistance to heat and humidity has been improved to a certain extent by adding epoxy resin, the improvement is limited and cannot be fundamentally eliminated. In this way, during the PCB manufacturing process, the board is easily corroded by moisture and delaminated and exploded, and the product is qualified. very low rate
[0009] Japanese Patent Laid-Open No. 2003-252958 discloses a biphenyl type epoxy resin and active ester composition, which has excellent dielectric constant and dielectric loss tangent after curing, but due to the use of a bifunctional Biphenyl epoxy resin and active ester have low crosslinking density, and have the disadvantages of low glass transition temperature and low heat resistance of the cured product

Method used

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  • Thermosetting resin composition and application thereof
  • Thermosetting resin composition and application thereof
  • Thermosetting resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079]Using 35 parts of active ester 1 containing styrene structure (m / n=8, produced by SHINA, model: SAP820), 30 parts of HP7200, 15 parts of BT93, 20 parts of SC2050, 0.1 part of catalyst 2-MI, the above compound was synthesized using MEK Dissolved and adjusted to a suitable viscosity glue. Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample. The sum of the mass parts of the styrene structure active ester, HP7200, BT93 and SC2050 is 100 parts.

[0080] Eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil are stacked together and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0 degrees / minute; 2. The pressure is set at 20kg / cm 2 ; 3. The curing temperature is 190 ℃, and keep this temperature for 90 minutes. The co...

Embodiment 2

[0082] Use 50 parts of active ester 1 containing styrene structure (m / n=8, produced by SHINA, model: SAP820), 25 parts of EPPN501H epoxy resin, 20 parts of SAYTEX8010 decabromodiphenylethane, 5 parts of kaolin, 0.075 parts of catalyst For N,N-dimethyl-pyridinamine, use toluene to dissolve the above compound and prepare a glue with a suitable viscosity. Use a polyester non-woven fabric to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample. The sum of the mass parts of the styrene structure active ester, EPPN501H epoxy resin, decabromodiphenylethane and kaolin is 100 parts.

[0083] Eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil are stacked together and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80-120 degrees, the heating rate is controlled at 1.0-3.0 degrees / minute; 2. The pressure is set at 20kg / cm ...

Embodiment 3

[0085] Use 60 parts of active ester 1 containing styrene structure (m / n=8, produced by SHINA, model: SAP820), 30 parts of AG-80 epoxy resin, 10 parts of polytetrafluoroethylene powder, 0.1 part of catalyst butyltriphenyl Phosphine chloride, use DMF to dissolve the above compound, and prepare a glue with a suitable viscosity. Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample. The sum of the mass parts of the styrene structure active ester and the AG-80 epoxy resin polytetrafluoroethylene powder is 100 parts.

[0086] Eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil are stacked together and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0 degrees / minute; 2. The pressure is set at 20kg / cm 2 ; 3. The curing temper...

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Abstract

The present invention discloses a thermosetting resin composition, which comprises epoxy resin with 2 or more than 2 epoxy groups in each resin molecule; and active ester containing styrene structure. The thermosetting resin composition is used to prepare resin sheet, resin composite metal copper foil, prepreg, laminate, copper clad laminate, printed circuit board and the like. The thermosetting resin composition significantly reduces the probability of delamination in PCB substrate, and the obtained resin composition has excellent thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and excellent flame retardancy.

Description

technical field [0001] The present invention relates to a kind of resin composition, specifically, the present invention relates to a kind of thermosetting resin composition and its application in resin sheet, resin composite metal foil, prepreg, laminated board, metal foil clad laminated board and printed circuit board in the application. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of computers and information communication equipment, in order to transmit and process large-capacity information at high speed, the operating signal tends to be high-frequency, so the circuit substrate is moving towards high-layer, high- The development of wiring density puts forward new requirements for the substrate materials used. These requirements include: 1. Good dielectric properties (that is, low dielectric constant and low dielectric loss tangent), and can be used in a wide range 2. It can withstand the impa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C08G59/42C08G59/20C08K5/03C08K3/34C08L63/00C08L27/18B32B27/38
CPCC08L63/04C08J2363/04C08L2201/02C08L63/00C08L2203/20C08J2363/10C08L63/08C08J5/24C08J2363/00H05K1/0373H05K2201/012H05K2201/0209C08G59/42C08G59/4261C08J5/244C08J5/249C08L25/04C08L25/18C08K3/013C08G59/686C08G59/688C08K5/02C08K5/49
Inventor 陈勇
Owner GUANGDONG SHENGYI SCI TECH
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