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Composite microwave dielectric material, printed circuit board base material made of it and manufacturing method thereof

A microwave dielectric material and printed circuit board technology, applied in printed circuits, dielectric materials, printed circuit components, etc., can solve the problems of poor mechanical properties, low flexural strength, and large thermal expansion coefficient of polytetrafluoroethylene resin. The effect of improving mechanical properties, reducing thermal expansion coefficient, and avoiding circuit failure problems

Active Publication Date: 2019-04-02
上海安缔诺科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, polytetrafluoroethylene resin has a large thermal expansion coefficient, soft texture, low bending strength and poor mechanical properties, which limit its application in the printed circuit board industry.

Method used

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  • Composite microwave dielectric material, printed circuit board base material made of it and manufacturing method thereof
  • Composite microwave dielectric material, printed circuit board base material made of it and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Such as figure 1 As shown, in this embodiment, the printed circuit board base material includes a composite microwave dielectric material plate 200 and metal foils 100 laminated on both sides thereof. In this application, the thickness of the metal foil and the thickness of the composite microwave dielectric material plate can be customized according to product requirements. In this embodiment of the present application, the metal foil layer 100 is a low-profile electrolytic copper foil, and the thickness of the metal foil layer 100 is 35 um. The thickness of the composite microwave dielectric material plate 200 is 0.25 mm. Its electrical performance parameters are shown in Table 1.

[0045] The manufacturing method of the printed circuit board base material of the present embodiment comprises the following steps:

[0046] Take by weighing 500 grams of PTFE emulsion (Daikin D210, PTFE solid content 60%), 700 grams of microwave dielectric ceramic powder filler (BaO-Sm...

Embodiment 2

[0054] Such as figure 1 As shown, in this embodiment, the printed circuit board base material includes a composite microwave dielectric material plate 200 and metal foils 100 laminated on both sides thereof. The metal foil layer 100 is a low-profile electrolytic copper foil, and the thickness of the metal foil layer 100 is 35um. The thickness of the composite microwave dielectric material plate 200 is 0.25 mm. Its electrical performance parameters are shown in Table 1.

[0055] The manufacturing method of the printed circuit board base material of the present embodiment comprises the following steps:

[0056] Take by weighing 100 grams of FEP emulsion (Daijin, FEP solid content 50%), 410 grams of PTFE emulsion (Daikin D210, PTFE solid content 60%) microwave dielectric ceramic powder filler 444 grams (BaO-ZnO-TiO 2 system, D50 particle size 5um, dielectric constant 36), use a mixer to mix for 1 hour, the speed is 1500 rpm, to obtain a uniformly mixed glue.

[0057] Add 200m...

Embodiment 3

[0064] Such as figure 1 As shown, in this embodiment, the printed circuit board base material includes a composite microwave dielectric material plate 200 and metal foils 100 laminated on both sides thereof. The metal foil layer 100 is a low-profile electrolytic copper foil, and the thickness of the metal foil layer 100 is 35um. The thickness of the composite microwave dielectric material plate 200 is 0.25mm. Its electrical performance parameters are shown in Table 1.

[0065] The manufacturing method of the printed circuit board base material of the present embodiment comprises the following steps:

[0066] Take by weighing 120 grams of PFA emulsion (Daikin, PFA solid content 50%), PTFE emulsion 400 grams (Daikin D210, PTFE solid content 60%) 200 grams of microwave dielectric ceramic powder filler (CaO-B 2 o 3 -SiO 2 system, D50 particle size 5um, dielectric constant 4.5), using a mixer to mix for 1 hour at a speed of 1500 rpm to obtain a uniformly mixed glue.

[0067] ...

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Abstract

The invention discloses a composite microwave dielectric material. The composite microwave dielectric material is prepared from the following components in parts by weight: 25 to 35 parts of a fluorine-containing polymer and 20 to 70 parts of microwave dielectric ceramic powder. According to the composite microwave dielectric material, fluororesin is adopted as a carrier material and blended with the microwave dielectric ceramic powder, and the dielectric loss angle tangent of a composite material and a high-frequency circuit substrate can be reduced; a radiation crosslinking technology is adopted to perform crosslinking processing on the fluorine-containing polymer to further reduce the coefficient of thermal expansion of the material; the expansion factor of a printed circuit board base material is close to the expansion factor of hole copper; the circuit fault problem in the process of use are avoided; and the irradiation crosslinking also improves the mechanical performance of the printed circuit board base material.

Description

technical field [0001] The invention relates to the field of printed circuit board materials, in particular to a printed circuit board base material and a preparation method thereof. Background technique [0002] With the revolution of modern information technology, digital circuits have gradually entered the stage of high-speed information processing and high-frequency signal transmission. In order to process increasing data, the frequency of electronic equipment has become higher and higher. Therefore, on the basis of meeting the traditional design and manufacturing requirements, new requirements are put forward for the performance of microwave dielectric circuit substrate materials. In view of the fact that the signals applied to the printed circuit board must use high frequency, how to reduce the transmission loss and signal delay on the circuit board has become a difficult problem in the design and manufacture of high-frequency circuits. Microwave and microwave composi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L27/18C08K3/22C08K3/38C08K3/36H05K1/03
CPCC08K3/22C08K2003/2206C08K2003/2241C08L27/18H05K1/0353H05K2201/015C08K2003/2296C08K3/38C08K3/36
Inventor 余若冰
Owner 上海安缔诺科技有限公司
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