MEMS aluminum and germanium bonding structure and manufacturing method thereof

A technology of aluminum-germanium bonding and manufacturing method, which is applied in the field of MEMS, can solve problems such as easy extension and flow of aluminum-germanium, low production efficiency at bonding temperature, and overall performance of devices destroyed, so as to optimize bonding quality and increase effective tube The number of cores and the effect of reducing the layout area
CN103979481AActive Publication Date: 2014-08-13HANGZHOU SILAN INTEGRATED CIRCUIT
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HANGZHOU SILAN INTEGRATED CIRCUIT
Publication Date
2014-08-13

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Abstract

The invention provides an MEMS aluminum and germanium bonding structure and a manufacturing method thereof. The structure comprises a device silicon chip and a sealing cap silicon chip, wherein the device silicon chip is provided with a micro mechanical structure area and an aluminum bonding layer; the sealing cap silicon chip is provided with a germanium bonding layer, and the germanium bonding layer is in bonding with the aluminum bonding layer. The sealing cap silicon chip is further provided with a pitch column extending out of the sealing cap silicon chip, and the end of the pitch column is in contact with the device silicon chip. The MEMS aluminum and germanium bonding structure can control aluminum and germanium horizontal extension quantity caused by bonding pressure in the bonding process, and an aluminum and germanium bonding layer with a preset thickness is obtained.
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Description

technical field

[0001] The invention relates to the technical field of MEMS, in particular to a MEMS aluminum-germanium bonding structure and a manufacturing method thereof. Background technique

[0002] MEMS technology is known as a revolutionary high-tech in the 21st century. Its development began in the 1960s. MEMS is the abbreviation of Micro Electro Mechanical System in English, that is, a micro-electromechanical system, which is an ingenious combination of microelectronics and micromechanics. Micro-electro-mechanical systems (MEMS) technology will have a revolutionary impact on human life in the future. The basic technology of MEMS mainly includes silicon anisotropic etching technology, / Silicon bonding technology, surface micro-mechanical technology, LIGA technology, etc., have become indispensable core technologies for the development and production of MEMS.

[0003] In the silicon-based MEMS processing technology, some products such as accelerometers, gyroscopes,...

Claims

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