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3results about How to "Improve initial viscosity" patented technology

Food-grade modified starch glue for corrugating and laminating and preparation method thereof

PendingCN122628687ANo migration riskHigh paper breakage rateCellulosePolymer science
This invention discloses a food-grade alkali-free modified starch adhesive for corrugated paper lamination and its preparation method, belonging to the field of adhesive technology. The modified starch adhesive comprises, by weight, 150-250 parts starch, 250-350 parts water, 4-10 parts hydrogen peroxide, 1-5 parts defoamer, 5-10 parts preservative, and 150-200 parts modified ethylene-vinyl acetate copolymer emulsion; wherein the modified ethylene-vinyl acetate copolymer emulsion is prepared by blending cellulose aqueous solution, PVA, filler, and ethylene-vinyl acetate emulsion in a specific ratio. This invention does not use caustic soda or borax throughout the process; all raw materials are food-grade, and the finished product is weakly alkaline, meeting the requirements of GB4806.15-2024. Through synergistic oxidation modification and emulsion compounding, it significantly improves initial tack, bonding strength, and drying speed, resulting in a low scrap rate, good resistance to damp heat and freeze-thaw cycles, and is suitable for high-speed, room-temperature lamination production of food-grade and ordinary corrugated paper.
Owner:SHANGHAI ZIDAN PACKAGING & TECH CO LTD +1

Adhesive label preparation method based on gel state transfer coating

PendingCN121999675AImprove surface stickinessImprove initial viscosityStampsIdentification meansPolymer sciencePolymer chemistry
The invention discloses a self-adhesive label preparation method based on gel state transfer coating, which comprises the following steps: coating a first release carrier with a hot-melt pressure-sensitive adhesive heated to a melt flow temperature to form a melt adhesive layer on the surface of the first release carrier; cooling the molten glue layer to a gelation temperature in a gradient manner, and gelating the molten glue layer from outside to inside to form a gel-state glue film; after the gel-state adhesive film and the label plane material are laminated, the first release carrier is stripped, so that the gel-state adhesive film on the first release carrier is transferred to the label plane material, and an adhesive surface layer is formed on the surface of the label plane material; and compounding the adhesive surface layer with a second release carrier to obtain the self-adhesive label. The phenomenon of glue overflowing is effectively avoided, long-time high-temperature curing or preparation of middle double-sided adhesive tape needed by a traditional hot melt glue process is not needed, and online continuous efficient production from coating to finished product can be achieved.
Owner:GUANGDONG JINLIN COMPOSITE NEW MATERIALS CO LTD

Controllable dense gradient boron nitride semi-solid heat conducting insulating adhesive film and preparation method thereof

PendingCN122278412Ainhibition orientationImprove wettingHexagonal boron nitrideMicrosphere
This invention belongs to the technical field of thermal management and insulation materials for electronic and power equipment. Specifically, it discloses a controllable dense gradient boron nitride semi-cured thermally conductive and insulating film and its preparation method. This invention adopts a formulation-structure-process synergistic approach, in which multi-morphological hexagonal boron nitride (microspheres / sheets / nanotubes) after plasma activation and silane coupling treatment are hierarchically filled into a resin matrix, and then a multi-layer gradient structure film material is formed through controllable densification. This results in a film material that simultaneously possesses high thermal conductivity in the thickness direction, excellent electrical insulation, structural adhesion, and mass production processability. It is suitable for photovoltaic inverters, traction / auxiliary inverters for new energy vehicles, IGBT / SiC / GaN power modules, and interface thermal management and structural adhesion between PCBs and heat sinks.
Owner:SHANGHAI BORON MOMENT NEW MATERIAL TECH CO LTD