Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

8results about How to "Improve initial viscosity" patented technology

High-strength mildew-proof vegetable protein adhesive as well as preparation method and application thereof

ActiveCN119119953AAchieve water-resistant gluingConducive to energy saving and emission reductionNon-macromolecular adhesive additivesProtein adhesivesAdhesiveVegetable Proteins
The invention belongs to the technical field of adhesives, and particularly relates to a high-strength mildew-proof vegetable protein adhesive as well as a preparation method and application thereof. The plant protein water-based paint comprises the following components: 10-30% of plant protein, 50-80% of water, 1-6% of a thickening agent, 0.25-2.5% of an activating agent, 0.25-2.5% of a stabilizing agent, 1-4% of a polymer mildew preventive, 0.25-0.5% of a nano reinforcing agent and 0-7% of a pH value regulator. The plant protein adhesive disclosed by the invention can be cured under an ambient temperature condition, realizes water-resistant gluing, is high in viscosity, and does not contain toxic and harmful substances such as free formaldehyde and free benzene compounds, so that the adhesive is completely green, and the problem of volatile organic compound pollution caused by artificial boards and wood products thereof is effectively solved; in addition, agriculture and forestry biomass raw materials are effectively utilized, green energy conservation and emission reduction of the plywood industry are achieved, and the method has huge application value.
Owner:INST OF WOOD INDUDTRY CHINESE ACAD OF FORESTRY

Food-grade modified starch glue for corrugating and laminating and preparation method thereof

PendingCN122628687ANo migration riskHigh paper breakage rateCellulosePolymer science
This invention discloses a food-grade alkali-free modified starch adhesive for corrugated paper lamination and its preparation method, belonging to the field of adhesive technology. The modified starch adhesive comprises, by weight, 150-250 parts starch, 250-350 parts water, 4-10 parts hydrogen peroxide, 1-5 parts defoamer, 5-10 parts preservative, and 150-200 parts modified ethylene-vinyl acetate copolymer emulsion; wherein the modified ethylene-vinyl acetate copolymer emulsion is prepared by blending cellulose aqueous solution, PVA, filler, and ethylene-vinyl acetate emulsion in a specific ratio. This invention does not use caustic soda or borax throughout the process; all raw materials are food-grade, and the finished product is weakly alkaline, meeting the requirements of GB4806.15-2024. Through synergistic oxidation modification and emulsion compounding, it significantly improves initial tack, bonding strength, and drying speed, resulting in a low scrap rate, good resistance to damp heat and freeze-thaw cycles, and is suitable for high-speed, room-temperature lamination production of food-grade and ordinary corrugated paper.
Owner:SHANGHAI ZIDAN PACKAGING & TECH CO LTD +1

Thermal viscosity-reducing adhesive tape for semiconductor cutting and preparation method of thermal viscosity-reducing adhesive tape

The thermal viscosity-reducing adhesive tape for semiconductor cutting comprises a release layer and an adhesive layer, the release layer comprises a first release layer and a second release layer, and the first release layer and the second release layer are respectively adhered to two sides of the adhesive layer; the adhesive layer comprises a basic copolymer, a thermal initiator, a curing agent and an auxiliary agent. The method for preparing the thermal-viscosity-reducing adhesive tape for semiconductor cutting comprises the following steps: reacting the stabilizer, the curing agent, the catalyst and methacrylic acid at a constant temperature, and then adding an acetone solvent to obtain a prepolymer; adding lauryl acrylate, bisphenol A epoxy resin, 3, 4-epoxy cyclohexyl formate, styrene, acrylic acid-2-hydroxyethyl ester, a flatting agent and a photoinitiator into the prepolymer to obtain a heat reducing adhesive; and coating the first release layer with the heat-reducing adhesive, covering the surface of the heat-reducing adhesive with the second release layer, and curing to obtain the heat-reducing adhesive tape for semiconductor cutting. The preparation process is simple, the crosslinking degree is high, the prepared adhesive tape has high initial viscous force, and adhesive residues can be reduced after stripping.
Owner:JIANGSU BOLITAI NEW MATERIAL TECHNOLOGY CO LTD

A high-strength mildew-proof plant protein adhesive and its preparation method and application

The present invention belongs to the technical field of adhesives, and specifically relates to a high-strength mildew-proof plant protein adhesive and its preparation method and application. It includes the following components: 10-30% plant protein, 50-80% water, 1-6% thickener, 0.25-2.5% activator, 0.25-2.5% stabilizer, 1-4% polymer mildew-proof agent, 0.25-0.5% nano-enhancer and 0-7% pH regulator. The plant protein adhesive of the present invention can be cured under ambient temperature conditions and achieve water-resistant bonding, and has high viscosity, and the adhesive does not contain toxic and harmful substances such as free formaldehyde and free benzene compounds, so that the adhesive is completely green, effectively solving the volatile organic pollution problem caused by artificial boards and their wood products; and the present invention effectively utilizes agricultural and forestry biomass raw materials, realizes green energy conservation and emission reduction in the plywood industry, and has great application value.
Owner:INST OF WOOD INDUDTRY CHINESE ACAD OF FORESTRY

Anti-static shading adhesive tape

The utility model provides an anti-static shading adhesive tape, which relates to the technical field of adhesive tapes and comprises a plastic tube, an adhesive tape body is arranged on the plastic tube, a protective component is arranged in the plastic tube, the adhesive tape body comprises a base material layer, a conductive layer is arranged on the base material layer, a shading layer is arranged on the conductive layer, and an adhesive layer is arranged on the shading layer. An adhesive layer is arranged on the base material layer, a protective layer is arranged on the adhesive layer, the protective assembly comprises a first protective tube and a second protective tube, and the base material layer with a polyvinyl chloride material, the conductive layer with an antistatic agent material, the shading layer with carbon black and a metal oxide material, and the adhesive layer with acrylic acid, rubber and a hot melt adhesive material are arranged on the protective assembly. The protective layer with the low-density polyethylene film, the polypropylene film and the silicone oil material is compounded to form a complete adhesive tape structure, and the compounded adhesive tape is cut to obtain a product with a required size, so that the anti-static and shading effects of the adhesive tape are realized.
Owner:SUZHOU JINCHENG ELECTRONICS & TECH CO LTD

Waterproof mortar for repairing outer wall and preparation method thereof

PendingCN119241170AImprove waterproof and anti-seepage performanceImprove water resistanceSolid waste managementHazardous substanceCellulose fiber
The invention relates to waterproof mortar for repairing an outer wall and a preparation method of the waterproof mortar. The waterproof mortar is mainly prepared from the following components: cement, nonmetal tailing sand powder particles subjected to dipping treatment by organic silicon treatment liquid, sodium silicate, cellulose ether, cellulose fibers, white carbon black and latex powder, wherein the particle size of the non-metal tailing sand powder particles is 70-400 [mu] m; the organic silicon treating fluid is an organic silicon water repellent which is diluted by 10 times by using environment-friendly solvent oil; the non-metal tailing sand powder particulate matter is non-metal tailing sand powder particulate matter with the heavy metal content meeting the standard of GB18582-2020 Limit of Harmful Substances in Wall Coating for Building. The problem that a large number of existing urban old community outer walls need to be repaired in a waterproof mode is solved, non-metal tailing sand powder particles with the optimized particle size and subjected to dipping treatment through organic silicon treatment liquid are adopted, the proportion of cement, sodium silicate and latex powder is optimized, and the non-metal tailing sand powder particles are matched with other optimized component types and dosage proportions in a system in a synergistic mode; the anti-seepage waterproof coating has the advantages of good anti-seepage waterproof effect and environmental protection.
Owner:SKSHU PAINT

Adhesive label preparation method based on gel state transfer coating

PendingCN121999675AImprove surface stickinessImprove initial viscosityStampsIdentification meansPolymer sciencePolymer chemistry
The invention discloses a self-adhesive label preparation method based on gel state transfer coating, which comprises the following steps: coating a first release carrier with a hot-melt pressure-sensitive adhesive heated to a melt flow temperature to form a melt adhesive layer on the surface of the first release carrier; cooling the molten glue layer to a gelation temperature in a gradient manner, and gelating the molten glue layer from outside to inside to form a gel-state glue film; after the gel-state adhesive film and the label plane material are laminated, the first release carrier is stripped, so that the gel-state adhesive film on the first release carrier is transferred to the label plane material, and an adhesive surface layer is formed on the surface of the label plane material; and compounding the adhesive surface layer with a second release carrier to obtain the self-adhesive label. The phenomenon of glue overflowing is effectively avoided, long-time high-temperature curing or preparation of middle double-sided adhesive tape needed by a traditional hot melt glue process is not needed, and online continuous efficient production from coating to finished product can be achieved.
Owner:GUANGDONG JINLIN COMPOSITE NEW MATERIALS CO LTD

Controllable dense gradient boron nitride semi-solid heat conducting insulating adhesive film and preparation method thereof

PendingCN122278412Ainhibition orientationImprove wettingHexagonal boron nitrideMicrosphere
This invention belongs to the technical field of thermal management and insulation materials for electronic and power equipment. Specifically, it discloses a controllable dense gradient boron nitride semi-cured thermally conductive and insulating film and its preparation method. This invention adopts a formulation-structure-process synergistic approach, in which multi-morphological hexagonal boron nitride (microspheres / sheets / nanotubes) after plasma activation and silane coupling treatment are hierarchically filled into a resin matrix, and then a multi-layer gradient structure film material is formed through controllable densification. This results in a film material that simultaneously possesses high thermal conductivity in the thickness direction, excellent electrical insulation, structural adhesion, and mass production processability. It is suitable for photovoltaic inverters, traction / auxiliary inverters for new energy vehicles, IGBT / SiC / GaN power modules, and interface thermal management and structural adhesion between PCBs and heat sinks.
Owner:SHANGHAI BORON MOMENT NEW MATERIAL TECH CO LTD