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Negative ion soybean formaldehyde-free adhesive

A formaldehyde-free adhesive, soybean adhesive technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of not being suitable for large-scale industrial production, and achieve good economic value and social value, mechanical strength improvement, and the effect of avoiding formaldehyde release

Active Publication Date: 2017-08-04
宁波朝露新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although there are many reports on formaldehyde-free soybean adhesives, there are some problems and they are not suitable for large-scale industrial production.
And so far, there is no report of a formaldehyde-free soybean adhesive that can release substances beneficial to the human body

Method used

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  • Negative ion soybean formaldehyde-free adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Add 100 parts by weight of water and 0.7 parts by weight of sodium hydroxide into a 1000ml beaker to form a sodium hydroxide solution, then add 60 parts by weight of silane coupling agent KH570, and finally add 2.4 parts by weight of tourmaline powder , and stirred for 10 min to obtain a mixed solution. Add 80 parts by weight of defatted soybean protein powder to the mixed liquid, stir for 30 minutes, mix and disperse evenly, and obtain an anionic soybean formaldehyde-free adhesive.

[0027] The prepared negative ion soybean glue is used for the bonding of five-layer eucalyptus boards, and the amount of glue on one side is 180-240g / m 2 After gluing, quickly cold press at 1.2Mpa for 20min, and then hot press at 130°C and 1.0Mpa for 20min. After forming, cool and put it aside, saw the board into the corresponding size, and test the bonding strength, elastic modulus, and negative ions. Determination of release, etc.

Embodiment 2

[0029] Add 100 parts by weight of water and 4.0 parts by weight of urea in a 1000ml beaker to form a urea solution, then add 60 parts by weight of ethylene glycol diglycidyl ether to the urea solution, and finally add 2.0 parts by weight of tourmaline powder and 0.4 parts by weight of kielite powder, stirred for 15 minutes to obtain a mixed solution. Add 65 parts by weight of soybean defatted soybean flour to the mixed liquid, stir for 25 minutes, mix and disperse evenly, and obtain an anionic soybean formaldehyde-free adhesive.

[0030] The prepared negative ion soybean glue was used for the bonding of five-layer eucalyptus boards. Process is identical with embodiment 1.

Embodiment 3

[0032] In the 1000ml beaker, add the water of 100 parts by weight and the sodium lauryl sulfonate of 0.1 parts by weight, be configured into solution, then add the waterborne epoxy resin of 60 parts by weight wherein, at last, add the seagull stone powder of 2.0 parts by weight, Stir for 12 min to obtain a mixed solution. Add 50 parts by weight of defatted soybean protein powder to the mixture, stir for 35 minutes, mix and disperse evenly, and obtain an anionic soybean formaldehyde-free adhesive.

[0033] The prepared negative ion soybean glue was used for the bonding of five-layer eucalyptus boards. Process is identical with embodiment 1.

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Abstract

The invention discloses a negative ion soybean formaldehyde-free adhesive. The negative ion soybean formaldehyde-free adhesive is prepared from the following raw materials in parts by weight: 10 to 100 parts of soybean derivative, 0.1 to 10 parts of modifier, 30 to 100 parts of crosslinking agent, 100 parts of water and 0.1 to 10 parts of negative ion additive. An artificial board made of the negative ion soybean formaldehyde-free adhesive prepared by the invention has the advantages that the formaldehyde is completely not released, and the air negative ion which is beneficial for a human body can be released; by adding the negative ion, the initial adhering property and bonding strength of the soybean adhesive are improved.

Description

technical field [0001] The invention relates to the field of adhesives for wood-based panels, in particular to a negative ion soybean formaldehyde-free adhesive. Background technique [0002] In the production of wood-based panels, the most commonly used adhesives are "trialdehyde glues", namely urea-formaldehyde glue (UF), phenolic glue (PF) and melamine-formaldehyde glue (MF). However, the use of "trialdehyde glue" as an adhesive in the production of wood-based panels usually releases a large amount of volatile organic compounds, such as formaldehyde and phenol. Formaldehyde is recognized by the World Health Organization as a harmful chemical substance that is poisonous to the human body, easily carcinogenic, and teratogenic. The release of formaldehyde in wood-based panel adhesives will not only endanger human health, but also cause great pollution to the indoor environment. Although there have been industry researchers, considerable research has been done on reducing t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J189/00C09J163/00C09J11/04C09J11/06
CPCC08K3/22C08K3/38C08K5/21C08K5/5425C08K13/02C09J11/04C09J11/06C09J163/00C09J189/00C08L63/00C08L89/00C08K5/42
Inventor 陈涛桂成胜刘小青陈建新徐俊朱锦徐益忠
Owner 宁波朝露新材料科技有限公司
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