Non-substrate easy-to-pull removable adhesive tape as well as preparation and use method thereof

A technology without base material and adhesive tape, which is applied in the direction of adhesives, film/sheet adhesives, rosin adhesives, etc. To adjust the limited space and other issues, to achieve the effect of improving initial adhesion and peel strength, high tensile elongation, and convenient after-sales maintenance

Active Publication Date: 2018-09-25
SUZHOU SHIHUA NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above problems, the purpose of the present invention is to overcome the limited adjustable space and cumbersome preparation process of the easy-pull removable adhesive tape with substrate in the prior art, and the coating process of the existing non-substrate adhesive tape is also relatively cumbersome. , the lack of relatively low adhesion of the obtained easy-to-pull tape provides a non-substrate easy-to-pull tape with simple preparation process, low cost, convenient use, and high tensile strength, adhesive force, and tensile elongation. Removable tape, the non-backing tape is a double-sided fixed tape with high bonding strength. It can be used after peeling off the release paper or release film during use. When it needs to be removed, just pass through Stretch the tape, it can be removed, easy to use and simple, it can bring great convenience to the staff in the repair and maintenance of electronic components

Method used

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  • Non-substrate easy-to-pull removable adhesive tape as well as preparation and use method thereof
  • Non-substrate easy-to-pull removable adhesive tape as well as preparation and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0033] The rubber-type glue used to prepare the easy-to-pull removable tape contains the following raw materials in parts by weight: thermoplastic rubber (the block ratio of styrene segment (PS) / isoprene segment (PI) is about 30 / 70, such as SIS1209) 80 parts, tackifying resin (rosin ester: softening point is 103 ℃, acid value 12, such as GB100) 70 parts, toluene 200 parts, liquid rosin ester (softening point is 12 ℃, acid value 9, such as Arizona chemical SYLVATAC ™ RE 12) 15 parts, 3 parts of color paste, 0.4 parts of leveling agent; dissolve rosin ester with toluene first, then add thermoplastic rubber, liquid rosin ester, color paste, leveling agent in turn, and get glue after stirring evenly; adjust Coating thickness, apply the glue on the release paper or release film, dry, and stick it with release paper or release film to obtain a substrate-free easy-to-pull removable tape with a thickness of 20 μm.

[0034] No base material, easy-pull removable tape, just peel off the ...

example 2

[0036]The rubber-type glue used to prepare the easy-to-pull removable tape contains the following raw materials in parts by weight: thermoplastic rubber (the block ratio of styrene segment (PS) / isoprene segment (PI) is about 30 / 70, such as SIS1209) 100 parts, tackifying resin (rosin ester: softening point is 105 °C, acid value 21, such as Arakawa Chemical GH100) 120 parts, toluene 250 parts, liquid rosin ester (softening point is 12 °C, acid value is 9, such as Arizona Chemical SYLVATAC™ RE 12) 20 parts, 6 parts of color paste, 0.55 parts of leveling agent; first dissolve rosin ester with toluene, then add thermoplastic rubber, liquid rosin ester, color paste, and leveling agent in sequence, and mix well to obtain glue ;Adjust the coating thickness, apply the glue on the release paper or release film, dry it, and stick it with release paper or release film to obtain a substrate-free easy-to-pull removable tape with a thickness of 90 μm .

[0037] No base material, easy-pull r...

example 3

[0039] The rubber-type glue used to prepare the easy-to-pull removable tape contains the following raw materials in parts by weight: thermoplastic rubber (the block ratio of styrene segment (PS) / isoprene segment (PI) is about 20 / 80, such as Yueyang Petrochemical SIS1188) 100 parts, tackifying resin (rosin ester: softening point is 100 ℃, acid value 12, such as GB100 of Wuzhou Arakawa Chemical) 120 parts, toluene 150 parts, liquid rosin ester (softening point is 25 ℃, acid value 15, such as SYLVATAC™ RE 25) 15 parts, 5 parts of color paste, 0.45 parts of leveling agent; first dissolve rosin ester with toluene, then add thermoplastic rubber, liquid rosin ester, color paste, and leveling agent in sequence, and stir evenly Finally, the glue is obtained; adjust the coating thickness, apply the glue on the release paper or film, dry, and stick it with the release paper or film to obtain a substrate-free roll-up with a thickness of 130 μm Remove the tape.

[0040] No base material, ...

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Abstract

The invention discloses a non-substrate easy-to-pull removable adhesive tape. The adhesive tape has a thickness of 20 to 300 mu m, is prepared from the following components in parts by mass: 80 to 150parts of thermoplastic rubber, 60 to 150 parts of tackifying resin, 100 to 330 parts of toluene, 1 to 30 parts of softener, 1 to 10 parts of color paste, and 0.1 to 1 part of leveling agent. The non-substrate adhesive tape is a double-sided fixing tape with high bonding strength, can be used without pretreatment, and can be used after just peeling off the release paper or the release film. When the adhesive tape needs to be removed, the adhesive tape is only stretched to remove. The adhesive tape can bring great convenience to the staff during the maintenance of the electronic components.

Description

technical field [0001] The invention belongs to the field of double-sided adhesive fixing tapes, and in particular relates to a substrate-free, easy-to-pull, removable double-sided adhesive fixing tape. Background technique [0002] With the rapid development of modern technology, more and more electronic products appear in our life and play an irreplaceable role. As an indispensable item in the field of electronic products, adhesive tape is widely used in the bonding and fixing of screens, batteries and other components. However, many electronic components are difficult to disassemble after being fixed by tape. When the product needs to be reworked due to quality problems during the assembly process, temporary fixing is required during the product processing process, and the product needs to be disassembled for after-sales maintenance or recycling. To great inconvenience and cause certain economic loss. Therefore, in the process of using the adhesive tape, the adhesive pe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J7/30C09J153/02C09J193/04C09J145/00C09J11/08
CPCC08L2205/025C08L2205/03C08L2207/04C09J11/08C09J145/00C09J153/02C09J193/04C09J7/10C09J7/30C09J2301/308C09J2301/312C09J2301/408C09J2301/414C08L45/00C08L93/04C08L53/02
Inventor 顾正青代光计建荣
Owner SUZHOU SHIHUA NEW MATERIAL TECH
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