4results about How to "Meet bonding needs" patented technology

The present application relates to the low temperature curing high-strength benzoxazine type silicone adhesive formula and use method, the formula includes the benzoxazine group containing organic silicon compound and organic alkali compound, the mass ratio of benzoxazine group containing organic silicon compound, organic alkali compound is 100:0.1-20.The adhesive of the present application is based on the cooperation between the benzoxazine group containing organic silicon compound and the basic catalyst, can be cured at low temperature, realize the higher strength bonding.The benzoxazine type silicone adhesive formula provided by the present application can be directly used as adhesive, and the bonding strength is high;It can also be used as a basic formula, used as an adhesive after adding other fillers, to meet the different needs of various special occasions.

The utility model discloses a bonding tool for a composite material co-curing test panel, which comprises an equipment bottom box, the top surface of the equipment bottom box is provided with a bearing groove in a penetrating manner, the inner bottom surface of the equipment bottom box is fixedly connected with a supporting column, the top end of the supporting column is fixedly connected with a supporting disc, the edge of the bearing groove in the top surface of the equipment bottom box is fixedly connected with a bearing ring, and the bearing ring is fixedly connected with a supporting plate. A bearing strip is arranged between the supporting disc and the bearing ring in the radial direction, an adjusting sliding groove is formed in the bearing strip in a penetrating mode, an adjusting sliding block is slidably connected into the adjusting sliding groove, and a clamping groove column is fixedly connected to the top face of the adjusting sliding block. The relative positions of the four groups of bearing strips and the positions of the clamping groove columns can be flexibly adjusted through the sliding fit of the bearing strips, the outer sliding grooves, the outer sliding blocks, the inner sliding grooves and the inner sliding blocks and the sliding of the adjusting sliding blocks in the adjusting sliding grooves.

The application relates to an antibacterial adhesive material and application thereof, relates to the technical field of adhesive materials, and solves the problem that the existing adhesive material is not good in function in a wet state environment. The coagulum formed after mixing cationic hydrochloride and anionic small-molecule sodium thioctic acid salt in a buffer solution and centrifugation is prepared through dehydration and solidification; the sodium thioctic acid salt is obtained through the following steps: dissolving sodium hydroxide in deionized water, adding alpha-thioctic acid into the solution in batches under intense stirring, filtering the obtained mixture with a polytetrafluoroethylene syringe filter, and freeze-drying; the cationic hydrochloride is polylysine hydrochloride, polyhexamethylene biguanide hydrochloride or branched polyethyleneimine hydrochloride. The application can be applied to medical antibacterial dressings, tissue adhesives or cultural relic restoration, and the adhesion is activated by physiological saline, a buffer solution or water before use.

This invention discloses a coating solution for preparing high-temperature resistant and high-thermal-conductivity epoxy-based conductive films, its preparation method, and its application. By weight, it comprises the following raw material components: 70-85 parts liquid epoxy resin, 15-30 parts solid epoxy resin, 5-35 parts latent curing agent, 0.5-5 parts accelerator, 300-600 parts conductive filler, 15-30 parts thermoplastic resin, 0.5-2 parts coupling agent, and 30-60 parts solvent. The thermoplastic resin is a phenoxy resin with a special chemical structure and a molecular weight of 20,000-65,000 g / mol. This invention, by introducing a high-temperature resistant thermoplastic resin into the coating solution formulation, enables the prepared conductive film product to possess excellent comprehensive properties such as toughness, adhesion characteristics, and high-temperature stability.