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A kind of room temperature curing instantaneous high temperature resistant high flexibility epoxy adhesive and preparation method thereof

An epoxy adhesive, room temperature curing technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of difficult to withstand instantaneous high temperature, poor flexibility of room temperature curing epoxy resin, etc., to improve heat resistance , Improve flexibility and increase strength

Inactive Publication Date: 2017-03-01
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the problems of poor flexibility and difficulty in resisting instantaneous high temperature of the existing room temperature curing epoxy resin, and provides a room temperature curing and transient high temperature resistant highly flexible epoxy adhesive and a preparation method thereof

Method used

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  • A kind of room temperature curing instantaneous high temperature resistant high flexibility epoxy adhesive and preparation method thereof
  • A kind of room temperature curing instantaneous high temperature resistant high flexibility epoxy adhesive and preparation method thereof
  • A kind of room temperature curing instantaneous high temperature resistant high flexibility epoxy adhesive and preparation method thereof

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specific Embodiment approach 1

[0042] Specific implementation mode one: This implementation mode is a kind of room temperature curing instantaneous high temperature resistant high flexible epoxy adhesive consisting of 50-100 parts by weight of polyether modified epoxy resin, 60-120 parts of flexible curing agent, 10-100 parts by weight. It is prepared by 30 parts of boron phenolic resin, 1-3 parts of accelerator and 1-3 parts of coupling agent.

[0043] The principle of this implementation mode:

[0044] In this embodiment, the flexibility of the epoxy resin matrix is ​​improved by modifying the epoxy resin with polyether; at the same time, the polyether amine and the polyamide are linked together by using the multifunctional epoxy resin to prepare a flexible curing agent; The obtained flexible curing agent cures the polyether modified epoxy resin, and the room temperature curing high flexible epoxy adhesive can be prepared; the multifunctional epoxy resin is provided in the room temperature curing transient ...

specific Embodiment approach 2

[0051] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the accelerator is DMP-30, 2-methylimidazole, triethanolamine, resorcinol or 2-ethyl-4-methyl imidazole. Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0052] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the coupling agent is γ-glycidyl etheroxypropyl trimethoxysilane, isopropyl tri(dioctyl coke One or more mixtures of phosphate acyloxy) titanate, monoalkoxy unsaturated fatty acid titanate and bis(dioctyloxypyrophosphate) ethylene titanate. Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention provides a normal-temperature solidification instant-high-temperature-resistant high-flexibility epoxy adhesive and a preparing method thereof and relates to an epoxy adhesive and a preparing method thereof. The epoxy adhesive and the preparing method thereof aim at solving the problems that existing normal-temperature solidification epoxy resin is poor in flexibility and cannot resist instant high temperatures. The normal-temperature solidification instant-high-temperature-resistant high-flexibility epoxy adhesive is prepared from, by weight, 50-100 parts of polyether modified epoxide resin, 60-120 parts of flexible curing agent, 10-30 parts of phenolic resin, 1-3 parts of accelerant, 1-3 parts of coupling agent. The preparing method comprises the steps that firstly, materials are weighed; secondly, the polyether modified epoxide resin and the phenolic resin are mixed and then ground through a three-roller grinding machine, then the flexible curing agent, the accelerant and the coupling agent are added and evenly mixed, and the normal-temperature solidification instant-high-temperature-resistant high-flexibility epoxy adhesive is obtained. The normal-temperature solidification instant-high-temperature-resistant high-flexibility epoxy adhesive can be obtained.

Description

technical field [0001] The invention relates to an epoxy adhesive and a preparation method thereof. Background technique [0002] Epoxy resin has excellent mechanical and adhesive properties and low price, and has been widely used in many fields. Due to the disadvantages of poor flexibility of epoxy resin, its peel strength and impact resistance are poor, and it is prone to cracking due to mechanical stress or temperature changes during use. At the same time, due to the limitation of structure and curing process, the temperature resistance of room temperature curing epoxy resin is insufficient, and the maximum service temperature does not exceed 250 ° C, which limits the application of epoxy adhesives. CN 102732209 invention patent discloses a room temperature curing high temperature resistant flexible adhesive and its preparation method. The patent uses silicone resin and liquid polysulfide rubber to improve the flexibility of the adhesive. The shear strength of the prepar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J187/00C09J11/06C08G81/00C08G18/48C08G8/28C08G59/60C08G59/62
Inventor 李坚辉薛刚王磊张斌孙明明张绪刚赵明宋彩雨刘彩召李奇力史利利张雪梅格
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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