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Film material and preparation method thereof

A thin-film, one-sided technology, applied in the field of thin-film materials and their preparation, can solve the problems of high production cost, broken substrates, and large limitations, and achieve the effects of reducing the risk of separation, facilitating subsequent processing, and reducing production costs.

Pending Publication Date: 2020-05-05
江苏晶华新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The release force of the UV release layer and the UV texture layer fluctuates greatly, and there is a large release force when the film is torn off, and the PET substrate is pulled off
[0006] 2. When the product with radian and rounded corners below 3.0 is injection molded, the stretched PET material is easy to break
[0007] 3. The mobile phone back cover film is only suitable for the field of in-film injection molding, and cannot match other plastic parts such as glass and PC at the same time
[0008] Generally speaking: the yield rate of the post-processing process of this technology is low, the production cost is high, and it has great limitations

Method used

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  • Film material and preparation method thereof
  • Film material and preparation method thereof
  • Film material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The film in this embodiment includes a multilayer structure arranged in sequence, and the multilayer structure includes at least a hot-melt adhesive layer with a thickness of 6 μm (note that the hot-melt adhesive layer here is bonded with glass / PC and then peeled off. Force > 20N, low-temperature hot-melt adhesive with working temperature of 75-100°C, boiled in water for 30 minutes without delamination and no whitening); polyether-type TPU substrate layer, its thickness is 100 μm; UV adhesive microstructure coating, of which UV The glue microstructure coating has a surface microstructure, and the microstructure includes wire drawing; the NCVM coating is a tin coating, the thickness of the NCVM coating is 200nm, and an ink layer. The polyurethane used here is polyurethane Costro / Covestro U4299.2wt.%, defoamer BYK011 0.1 wt.%, and wetting agent BYK348 0.7 wt.%.

[0047] The preparation method is as follows:

[0048] Select suitable TPU base material and hot melt adhesive...

Embodiment 2

[0053] The film in this embodiment includes a multilayer structure arranged in sequence, and the multilayer structure includes at least a hot melt adhesive layer with a thickness of 7 μm (note that the hot melt adhesive layer here is bonded with glass / PC and then peeled off. Force > 20N, low-temperature hot-melt adhesive with working temperature of 75-100°C, boiled in water for 30 minutes without delamination and whitening); polyether-type TPU substrate layer, its thickness is 97 μm; UV adhesive microstructure coating, of which UV The glue microstructure coating has a surface microstructure, and the microstructure includes concavo-convex patterns; the NCVM coating is an indium coating, the thickness of the NCVM coating is 300 nm, and an ink layer. The polyurethane used here is polyurethane Costro / Covestro U4299.2wt.%, defoamer BYK011 0.2 wt.%, and wetting agent BYK348 0.6 wt.%.

[0054] The preparation method is as follows:

[0055] Select suitable TPU base material and hot m...

Embodiment 3

[0060] The film in this embodiment includes a multilayer structure arranged in sequence, and the multilayer structure includes at least a hot-melt adhesive layer with a thickness of 6.5 μm (note that the hot-melt adhesive layer here is bonded with glass / PC Peeling force > 20N, low-temperature hot melt adhesive with working temperature of 75-100°C, boiled in water for 30 minutes without delamination and whitening); polyether-type TPU substrate layer, the thickness of which is 95 μm; UV adhesive microstructure coating, of which The UV glue microstructure coating has a surface microstructure, and the microstructure includes a CD pattern; the NCVM coating is an indium coating, the thickness of the NCVM coating is 250nm, and an ink layer. The polyurethane used here is polyurethane Costro / Covestro U4299.4wt.%, defoamer BYK011 0.3 wt.%, and wetting agent BYK348 0.3 wt.%.

[0061] The preparation method is as follows:

[0062] Select suitable TPU base material and hot melt adhesive, ...

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Abstract

A film disclosed by the invention comprises a multilayer structure which is arranged in sequence. The multilayer structure at least comprises a hot melt adhesive layer, a TPU substrate layer and a UVadhesive microstructure coating, wherein the UV adhesive microstructure coating is provided with a surface microstructure, and the microstructure comprises CD lines or drawn wires or concave-convex lines, an NCVM plating layer and an ink layer. The film provided by the scheme of the invention has good toughness, is beneficial to subsequent processing, and has good matching and fitting performancefor PC, glass materials and other materials.

Description

technical field [0001] The invention relates to a thin film material and a preparation method thereof, in particular to a thin film which can be at least applied to the back cover of an electronic product and a preparation scheme thereof. Background technique [0002] With the development of 5G Internet technology and new market demands: under the premise of ensuring that the mobile phone signal is not interfered, consumers have shifted their attention from the protection of the mobile phone screen to the curvature of the mobile phone back cover structure and the decoration of the mobile phone back cover. At present, this kind of film with decorative effect and can match the radian of the structure of the back cover of the mobile phone is adopted by major mobile phone manufacturers. [0003] The film of the prior art uses a 50-75 micron PET substrate, and uses a UV embossing method to transfer the release layer (roll-to-roll coating) on ​​the PET substrate surface, and then ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/25C09J7/35C09J175/04
CPCC09J7/25C09J7/35C09J175/04C09J2475/006C09J2475/00C09J2400/16
Inventor 张伟黄链周晓南
Owner 江苏晶华新材料科技有限公司
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