The invention discloses a high-thermal-
conductivity and high-pressure-resistance aluminum-based
copper-clad plate which comprises
copper foil, an insulated
thermal conductivity adhesive layer, a binder layer and an aluminum plate, wherein the
surface layer of the aluminum plate is subjected to
anodic oxidation to form a
ceramic protection layer, the insulated conductive
adhesive layer is formed by performing high-temperature baking and semi-solidifying on a
thermal conductivity adhesive solution, and the
copper foil, the insulated
thermal conductivity adhesive layer, the binder layer and the aluminum plate are laminated and pressed for formation in sequence. The high-thermal-
conductivity and high-pressure-resistance aluminum-based copper-clad plate has the following advantages that 1, the surface
adhesion force of the insulated thermal
conductivity adhesive layer and the aluminum plate is increased through adding the binder layer and a
coupling agent to reduce the difference influence on
hot pressing caused by different expansion coefficients; 2, the
oxidation resistance of the product is improved through the
ceramic protection layer, and meanwhile, the bonding force of the insulated thermal conductivity adhesive layer and the aluminum plate is further enhanced; 3, the flexibility of an adhesive film is increased through adding a flexibilizer to solve the
brittleness problem; 4, aluminum
oxide,
silicon dioxide,
silicon carbide and the like are used as thermal conductive filler, so that the technical defect of poor heat dissipation performance is overcome.