Conductive silver paste, method for preparing same and surface metallization method for microwave dielectric ceramics

A technology of microwave dielectric ceramics and conductive silver paste, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., to increase surface adhesion, improve physical and chemical properties and production efficiency.

Active Publication Date: 2012-09-12
ANHUI TATFOOK M&E TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, since the sintered silver layer will be oxidized when exposed to the air, various methods are adopted for storage, such as special storage boxes, special antifouling paper materials or vacuum bags, etc., but the above methods cannot avoid the silver layer being oxidized during use. oxidation

Method used

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  • Conductive silver paste, method for preparing same and surface metallization method for microwave dielectric ceramics
  • Conductive silver paste, method for preparing same and surface metallization method for microwave dielectric ceramics
  • Conductive silver paste, method for preparing same and surface metallization method for microwave dielectric ceramics

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Experimental program
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Effect test

Embodiment 1

[0030] A conductive silver paste, which comprises conductive silver powder, glass powder and an organic carrier, wherein, the mass percentage of each component in the conductive silver paste is: conductive silver powder 70-80%; glass powder 3-9%; organic carrier 15-27% %, the particle size distribution range of the conductive silver paste is 0.2-2 μm. In this embodiment, the mass percentage of each component in the conductive silver paste is: conductive silver powder 78%; glass powder 5%; organic vehicle 17%.

[0031] Conductive silver paste is an electronic functional material integrating metallurgy, chemical industry and electronic technology. It is mainly composed of functional phase, adhesive phase and temporary adhesive phase. It is widely used in the manufacture of thick film integrated circuits, resistors, and resistor networks. , capacitors, chip multilayer ceramic capacitors (MLCC), solar cell electrodes, PDP electrodes, printed and high-resolution conductors, membran...

Embodiment 2

[0037] A kind of preparation method implementing the conductive silver paste of benefit one, it comprises:

[0038] Step 1: Put at least one of the above analytically pure bismuth oxide, boron oxide, silicon oxide and zinc oxide in a corundum crucible and heat it to 1200-1500°C, stir it evenly, cool it in cold water, and ball mill it after quenching. After sieving, glass powder is obtained.

[0039] Wherein, since the raw material does not contain lead, the obtained glass powder is lead-free glass powder, which will not cause harm to the environment compared with the traditional glass powder containing lead which is more toxic.

[0040] Step 2, after mixing the organic solvent, surfactant, defoamer, anti-settling agent, thickener, coupling agent and plasticizer, place in a constant temperature water bath and stir fully to obtain an organic carrier, wherein the temperature of the water bath is 55~65℃.

[0041]Among them, due to the influence of many factors such as density di...

Embodiment 3

[0045] see figure 1 , figure 1 It is the flow chart of the surface metallization method of the microwave dielectric ceramic of the third embodiment of the present invention. The conductive silver paste of the first embodiment is adopted, and the method flow comprises the following steps:

[0046] In step S101, the microwave dielectric ceramic is precisely ground.

[0047] Wherein, the microwave dielectric ceramics are fixed on the turntable of the precision grinding machine by vacuum adsorption for precision grinding, and the time is 8-10 minutes. After precise grinding, the microwave dielectric ceramic can be thinned by 1-2mm. In other alternative embodiments, other fixing methods may be used to fix the microwave dielectric ceramic.

[0048] Step S102, finely polishing the precisely ground microwave dielectric ceramics under the action of abrasives.

[0049] Wherein, the precisely ground microwave dielectric ceramics are placed on a grinding disc of a fine polishing machi...

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Abstract

The invention discloses conductive silver paste and a method for preparing the same. The conductive silver paste comprises components including, by mass percent, from 70 to 80% of conductive silver powder, from 3 to 9% of glass powder and from 15 to 27% of an organic carrier. The invention further discloses a surface metallization method for microwave dielectric ceramics. The surface metallization method includes precisely grinding, precisely polishing, ultrasonically cleaning and primarily drying the microwave dielectric ceramics; carrying out screen printing by the aid of the conductive silver paste; carrying out secondary drying; sintering a silver skin and the like. The preparation of the conductive silver paste is optimized, the microwave dielectric ceramics are precisely ground and precisely polished before the conductive silver skin is printed, then the conductive silver skin is sintered to form a silver layer by means of controlling a sintering process, surface adhesion of the metallized silver layer on the surface of the microwave dielectric ceramics can be improved, and physiochemical property and production efficiency of a metallized electrode made of the microwave dielectric ceramics are enhanced.

Description

technical field [0001] The invention relates to the field of ceramic materials, in particular to a conductive silver paste, a preparation method thereof, and a surface metallization method of microwave dielectric ceramics. Background technique [0002] Microwave dielectric ceramics refer to ceramic materials with excellent dielectric properties applied in the microwave frequency range of 300MHz to 300GHz and used in microwave frequency circuits as dielectric materials to complete one or more functions. New functional electronic ceramic materials, in the microwave The circuit plays the functions of dielectric isolation, dielectric waveguide and dielectric resonance. [0003] At present, the surface metallization methods of microwave dielectric ceramics mainly include screen printing sintering method, electroplating method, chemical etching deposition method (including electroless and electrolytic deposition) and secondary metallization method. Commonly used metallized electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/16H01B13/00H01P11/00
Inventor 赵可沦申风平郑正德
Owner ANHUI TATFOOK M&E TECH
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