Flame-resistant and heat-resistant copper clad laminate preparation method

A copper-clad laminate, heat-resistant technology, applied in chemical instruments and methods, lamination, electronic equipment, etc., can solve the problems of high water absorption, high dielectric constant, low heat and humidity resistance, low shrinkage, etc., to achieve good fluidity , Improve compatibility, narrow particle size distribution

Inactive Publication Date: 2015-12-23
SUZHOU YIKETAI ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the reactive phosphorus-based flame retardants widely used in the field of copper clad laminates are mainly DOPO compounds, mainly phosphorus-containing epoxy resins and phosphorus-containing phenolic resins, and the phosphorus content is between 2-10%. However, practical applications It was found that DOPO compounds have a large water absorption rate and a high dielectric constant, and the board made of it has low moisture and heat resistance.
Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric properties (dielectric coefficient: 2.8-3.2; dielectric loss factor: 0.002-0.003), high Heat resistance (glass transition temperature: 280 ~ 295 ° C), while cyanate resin also has low shrinkage, excellent mechanical properties and bonding properties, etc., but also due to defects such as insufficient curing and brittleness, it has not been used in copper clad laminates. A large number of applications in the field

Method used

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  • Flame-resistant and heat-resistant copper clad laminate preparation method
  • Flame-resistant and heat-resistant copper clad laminate preparation method
  • Flame-resistant and heat-resistant copper clad laminate preparation method

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0030] Synthesis example 1 preparation of filler

[0031] Disperse 1Kg of nano-silica foam in deionized water, then add 200g of dodecylbenzenesulfonic acid, 200g of bismuth nitrate pentahydrate and 350g of methyltrichlorosilane; then hydrothermally react at 150°C for 2 hours; then filter the reaction Liquid, the filter cake was added to ethanol, dispersed evenly and then added 50g of polyoxyethylene sorbitan monooleate, stirred at 60°C for 2 hours, and finally dried to obtain filler (particle size: 560-880nm).

Embodiment 1

[0032] Embodiment 1 A method for preparing a flame-retardant and heat-resistant copper-clad laminate, comprising the following steps:

[0033] Mix 5g DOPO and 100g bisphenol A cyanate monomer, stir at 95°C for 25 minutes, add 20g phenol compound, continue stirring for 30 minutes; then add 8g m-nitrobenzenesulfonic acid pyridinium salt, 58g Cyclopentyl ether, continue to stir for 20 minutes; add 9g dimethyl phosphite, stir at 100°C for 30 minutes; obtain resin prepolymer; add 32g filler to 12g diglycidyl phthalate, stir at 125°C 1 hour, obtain active filler; With 100g resin prepolymer and 9g indole compound (R 1 for hydrogen, R 2 is methyl, R 3 Amino) mixed, stirred at 120°C for 30 minutes; then added active filler, stirred at 130°C for 30 minutes; then added 1.5g of isomeric undecyl alcohol polyoxyethylene ether phosphate potassium salt, stirred at 140°C for 50 minutes to obtain a compound system; the above composite system was dissolved in a butanone / ethylene glycol methyl...

Embodiment 2

[0034] Embodiment 2 A method for preparing a flame-retardant and heat-resistant copper-clad laminate, comprising the following steps:

[0035] Mix 5g DOPO and 100g bisphenol A cyanate monomer, stir at 95°C for 25 minutes, add 30g phenolic compound, and continue stirring for 30 minutes; then add 8.2g m-nitrobenzenesulfonic acid pyridinium salt, 63g Pentyl cyclopentyl ether, continue stirring for 20 minutes; add 12g dimethyl phosphite, stir at 100°C for 30 minutes; obtain resin prepolymer; add 45g filler to 14g diglycidyl phthalate, 125°C Stir for 1 hour to obtain active filler; 100g resin prepolymer and 8.5g indole compound (R 1 for hydrogen, R 2 is methyl, R 3 For cyano group) mixed, stirred at 120°C for 30 minutes; then added active filler, stirred at 130°C for 30 minutes; then added 1.5g of isomeric undecyl alcohol polyoxyethylene ether phosphate potassium salt, stirred at 140°C for 50 minutes to obtain Composite system; the above composite system is dissolved in a butano...

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Abstract

The present invention relates to a flame-resistant and heat-resistant copper clad laminate preparation method, which comprises: adopting nanometer silica foam, dodecyl benzenesulfonic acid, bismuth nitrate pentahydrate, methyl trichlorosilane and polyoxyethylene sorbitan monooleate as a raw materials to obtain a filler; adopting DOPO, a bisphenol A cyanate ester monomer, a phenol compound, a m-nitrobenzene sulfonic acid pyridine salt, 2,3-epoxy cyclopentyl cyclopentyl ether and dimethyl phosphonate as raw materials to obtain a resin prepolymer; adding the filler to o-phthalic acid diglycidyl este to obtain an active filler; mixing the resin prepolymer and an indole compound, and then adding the active filler and isomeric undecanol polyoxyethylene ether phosphate potassium salt to obtain a composite system; and carrying out hot pressing molding on the composite system, a reinforced material and metal foil to obtain the flame-resistant and heat-resistant copper clad laminate, wherein the flame-resistant and heat-resistant copper clad laminate has characteristics of excellent flame retardant property and excellent heat resistance, and meets the development applications of the flame-resistant and heat-resistant copper clad laminate.

Description

technical field [0001] The invention belongs to the technical field of electronic composite materials, and in particular relates to a method for preparing a flame-retardant and heat-resistant copper-clad laminate. The obtained product can be used in the fields of aerospace, signal transmission and electronic communication. Background technique [0002] With the continuous development of science and technology, the application of polymer matrix composites is becoming more and more extensive. At the same time, various application fields also put forward higher requirements for different materials. Especially in cutting-edge science and technology fields such as the aerospace industry, the performance requirements of materials are more stringent. For example, they require composite materials to have high specific strength, high specific stiffness, high temperature resistance, and ablation resistance. Composite materials are materials with new properties composed of two or more...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/20B32B27/04B32B15/08B32B37/06B32B37/10C08L79/04C08L63/00C08L71/02C08K13/06C08K9/08C08K5/00C08G73/06C08G59/62C08G59/40
CPCB32B27/20B32B2250/03B32B2250/40B32B2260/02B32B2260/046B32B2264/102B32B2270/00B32B2307/3065B32B2457/08C08L2201/02C08L2201/08C08L79/04C08L71/02C08K13/06C08K9/08C08K5/0091C08L63/00
Inventor 彭代信宋晓静江铁成
Owner SUZHOU YIKETAI ELECTRONICS MATERIAL
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