High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof

Abstract

The invention discloses a high-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate which comprises copper foil, an insulated thermal conductivity adhesive layer, a binder layer and an aluminum plate, wherein the surface layer of the aluminum plate is subjected to anodic oxidation to form a ceramic protection layer, the insulated conductive adhesive layer is formed by performing high-temperature baking and semi-solidifying on a thermal conductivity adhesive solution, and the copper foil, the insulated thermal conductivity adhesive layer, the binder layer and the aluminum plate are laminated and pressed for formation in sequence. The high-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate has the following advantages that 1, the surface adhesion force of the insulated thermal conductivity adhesive layer and the aluminum plate is increased through adding the binder layer and a coupling agent to reduce the difference influence on hot pressing caused by different expansion coefficients; 2, the oxidation resistance of the product is improved through the ceramic protection layer, and meanwhile, the bonding force of the insulated thermal conductivity adhesive layer and the aluminum plate is further enhanced; 3, the flexibility of an adhesive film is increased through adding a flexibilizer to solve the brittleness problem; 4, aluminum oxide, silicon dioxide, silicon carbide and the like are used as thermal conductive filler, so that the technical defect of poor heat dissipation performance is overcome.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to an aluminum-based copper-clad laminate with high thermal conductivity and high pressure resistance. Background technique [0002] As we all know, aluminum-based copper-clad laminate is a plate-shaped material belonging to the aluminum substrate. It is made of electronic glass fiber cloth or other reinforcing materials impregnated with resin, coated with copper foil on the surface and hot-pressed. It is usually called clad. Copper-clad laminates, referred to as aluminum-based copper-clad laminates, can be widely used in high-power, high-heat dissipation electronic products such as vehicle igniters and frequency conversion power supplies. As the substrate material in the manufacture of printed circuit boards, aluminum-based copper-clad laminates mainly play the role of interconnection, conduction, insulation and support for printed circuit boards, and have a great influence ...

AI Technical Summary

Problems solved by technology

This technical solution directly replaces the thermally conductive adhesive film with a thermally conductive adhesive. The disadvantage is that the thermally conductive substrate layer cannot effectively dissipate heat under high temperature conditions, resulting in malfunction and affecting work efficiency.

Although the aluminum substrate prepared by this technical scheme has certain advantages in thermal conductivity and pressure resistance, its disadvantages are: ①The composition of the thermal conductive adhesive film is complex and the production cost is high; ②Due to the difference between the insulating layer and the aluminum alloy substrate The expansion coefficients are different, so the bonding force between the two is poor during high-temperature hot pressing, and there are quality risks such as easy delamination of the sheet metal and chipping, which virtually reduces the pass rate of the product; The thermal conductivity of aluminum substrate products has not been greatly improved, and the brittleness between different plates is poor

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