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Organic silicon prepolymer, organic silicon modified epoxy resin, adhesive, colloid and preparation method thereof

An epoxy adhesive and epoxy resin technology, applied in the field of materials, can solve the problems of reduced bonding strength and inability to meet the bonding requirements of heating devices.

Active Publication Date: 2021-05-07
GUANGZHOU BAIYUN CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, although traditional epoxy adhesives have better bonding strength at low temperatures, the bonding strength decreases significantly at high temperatures, which cannot meet the bonding requirements of heating devices need

Method used

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  • Organic silicon prepolymer, organic silicon modified epoxy resin, adhesive, colloid and preparation method thereof
  • Organic silicon prepolymer, organic silicon modified epoxy resin, adhesive, colloid and preparation method thereof
  • Organic silicon prepolymer, organic silicon modified epoxy resin, adhesive, colloid and preparation method thereof

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preparation example Construction

[0106] The present invention also provides a kind of preparation method of silicone modified epoxy adhesive, comprising the following steps:

[0107] S101: preparing component A of the silicone-modified epoxy adhesive;

[0108] Further, step S101 includes the following steps:

[0109] S1011: Mix siloxane, silicone oil, catalyst and water, and react at 110°C-130°C (preferably 115°C-125°C, more preferably 120°C) (preferably react for 1-3h, more preferably react 1.5-2.5h), to obtain silicone prepolymer.

[0110] The siloxane, silicone oil and catalyst in step S1011 are as above.

[0111] In one embodiment, step S1011 performs the following reaction:

[0112]

[0113] The definitions of each group in the above reaction formula are as described above.

[0114] S1012: Mix the silicone prepolymer and epoxy resin, and react under the conditions of 110°C-130°C (preferably 115°C-125°C, more preferably 120°C) to obtain silicone-modified epoxy resin A component.

[0115] In one e...

Embodiment 1

[0132] Silicone modified epoxy adhesive

[0133] A component: silicone modified epoxy resin, its reaction raw materials: 40 parts of epoxy resin, 10 parts of siloxane, 10 parts of silicone oil, 1 part of 35% hydrochloric acid, 5 parts of deionized water;

[0134] Component B: 10 parts of 1,3-cyclohexanedimethylamine, 1 part of accelerator.

[0135] Preparation:

[0136] (1) Mix siloxane, silicone oil, catalyst and water, stir evenly, heat to 120°C at the same time, stir and reflux for 2 hours to obtain prepolymer a, set aside;

[0137] (2) Mix the epoxy resin with the prepolymer a obtained in step (1), stir, mix evenly, and heat to 120°C at the same time, stir and reflux for 2 hours, then open to stir and keep warm for 3 hours to obtain organic Silicon modified epoxy resin, as A component;

[0138] (3) Mix component A and component B at a mass ratio of 10:1 and stir evenly to prepare a mixture.

[0139] (4) Coating the mixture obtained in step (3) on the substrate and curi...

Embodiment 2

[0141] Silicone modified epoxy adhesive

[0142] A component: silicone modified epoxy resin, its reaction raw materials: 40 parts of epoxy resin, 5 parts of siloxane, 15 parts of silicone oil, 1 part of 35% hydrochloric acid, 5 parts of deionized water;

[0143] Component B: 10 parts of 1,3-cyclohexanedimethylamine, 1 part of accelerator.

[0144] Preparation:

[0145] (1) Mix siloxane, silicone oil, catalyst and water, stir evenly, heat to 120°C at the same time, stir and reflux for 2 hours to obtain prepolymer a, set aside;

[0146] (2) Mix the epoxy resin with the prepolymer a obtained in step (1), stir, mix evenly, and heat to 120°C at the same time, stir and reflux for 2 hours, then open to stir and keep warm for 3 hours to obtain organic Silicon modified epoxy resin, as A component;

[0147] (3) Mix component A and component B at a mass ratio of 10:1 and stir evenly to prepare a mixture.

[0148] (4) Coating the mixture obtained in step (3) on the substrate and curin...

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Abstract

The invention relates to an organic silicon prepolymer, organic silicon modified epoxy resin, an adhesive, colloid and a preparation method thereof, and the organic silicon modified epoxy resin is mainly prepared from the following reaction raw materials in parts by weight: 35-55 parts of epoxy resin, 5-20 parts of siloxane, 5-20 parts of silicone oil, 0.1-3 parts of a catalyst and 0-10 parts of water. The organic silicon modified epoxy resin has high temperature resistance, still has excellent mechanical properties under high temperature conditions, and can meet the bonding requirements of devices with high calorific value.

Description

technical field [0001] The invention relates to the technical field of materials, in particular to organosilicon prepolymers, organosilicon modified epoxy resins, adhesives, colloids and preparation methods thereof. Background technique [0002] Epoxy adhesive is a curing system formulated with epoxy resin (as a matrix) and curing agent in a certain proportion. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can undergo cross-linking reactions with various types of curing agents to form insoluble polymers with a three-way network structure. The cured epoxy resin (that is, epoxy adhesive) has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metal materials, and has the advantages of high mechanical strength ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/14C09J183/10C09J163/00C09J11/06C08G77/42C08G59/50
CPCC08G77/14C09J183/10C09J163/00C09J11/06C08G77/42C08G59/5026C08K5/17
Inventor 娄星原冯朝波黎灿光侯甫文陈建军刘光华
Owner GUANGZHOU BAIYUN CHEM IND
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