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Epoxy-resin mould plastic for packing IC circuit and its production
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A technology of epoxy resin and phenolic epoxy resin, used in circuits, electrical components, electrical solid devices, etc., can solve the problems of unsatisfactory packaging materials, and achieve good processability, low water absorption, and high glass transition temperature. Effect
Inactive Publication Date: 2007-09-05
GUANGDONG RONGTAI IND
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At present, most of the packaging materials in our country can not meet the above requirements.
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the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Abstract
An epoxy resin mold plastic and its production are disclosed. The mold plastic consists of liquid-crystalepoxy resin, methyl-phenolic epoxy resin, epoxy resin containing biphenylunit structure, melamine modified linear phenolic resin, silicone micro-powder, imidazo curing improver, toughening agent and silanecoupling agent. The process is carried out by treating silicone micro-powder in mixer by coupling agent for 2-5mins, adding into other components, mixing for 3-5mins, melt milling at 95-135 degree for 3-5mins, cooling, crushing, mesh screening, pressing into material cake and storing below 6degree. Its advantages include low thermal expansion coefficient, excellent heat and fire resistances, better toughness and fluidity, no phosphor, no antimony and environmental pollution. It can be used to pack large-scale circuit and electronic devices.
Description
technical field [0001] The invention relates to an epoxy resin molding compound for integrated circuit packaging, in particular to a low thermal expansion coefficient, high heat resistance, low water absorption, high flame retardancy, halogen-free, phosphorus-free , Antimony-free high-performance packaging materials. [0002] The present invention also relates to a method for preparing the above-mentioned epoxy resin molding compound. technical background [0003] Epoxy molding compound, also known as epoxy molding compound (EMC, Epoxy Molding Compound), is one of the main raw materials for integrated circuit (IC) back-end packaging. Its development is closely following the development of integrated circuit and packaging technology. With the rapid development of integrated circuit and packaging technology, it is increasingly showing its basic and supporting role. At present, epoxy molding compound manufacturers in the world are mainly concentrated in Japan, the United Stat...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Application Information
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