Epoxy-resin mould plastic for packing IC circuit and its production

Abstract

An epoxy resin mold plastic and its production are disclosed. The mold plastic consists of liquid-crystal epoxy resin, methyl-phenolic epoxy resin, epoxy resin containing biphenyl unit structure, melamine modified linear phenolic resin, silicone micro-powder, imidazo curing improver, toughening agent and silane coupling agent. The process is carried out by treating silicone micro-powder in mixer by coupling agent for 2-5mins, adding into other components, mixing for 3-5mins, melt milling at 95-135 degree for 3-5mins, cooling, crushing, mesh screening, pressing into material cake and storing below 6degree. Its advantages include low thermal expansion coefficient, excellent heat and fire resistances, better toughness and fluidity, no phosphor, no antimony and environmental pollution. It can be used to pack large-scale circuit and electronic devices.

Description

technical field

[0001] The invention relates to an epoxy resin molding compound for integrated circuit packaging, in particular to a low thermal expansion coefficient, high heat resistance, low water absorption, high flame retardancy, halogen-free, phosphorus-free , Antimony-free high-performance packaging materials.

[0002] The present invention also relates to a method for preparing the above-mentioned epoxy resin molding compound. technical background

[0003] Epoxy molding compound, also known as epoxy molding compound (EMC, Epoxy Molding Compound), is one of the main raw materials for integrated circuit (IC) back-end packaging. Its development is closely following the development of integrated circuit and packaging technology. With the rapid development of integrated circuit and packaging technology, it is increasingly showing its basic and supporting role. At present, epoxy molding compound manufacturers in the world are mainly concentrated in Japan, the United Stat...

Examples

Embodiment 1

[0052] formula:

[0053] Liquid crystal epoxy resin 10 parts

[0054] 10 parts o-cresol novolac epoxy resin

[0055] 5 parts of epoxy resin containing biphenyl structural unit

[0056] 15 parts of melamine modified novolac resin

[0057] Silica powder (quartz powder) 150 parts

[0058] Curing accelerator 2-methylimidazole 0.5 parts

[0059] Toughener CTBN 6 parts

[0060] Coupling agent KH-560 1.5 parts

[0061] 0.8 parts of stearic acid

[0062] The process is shown in Figure 1.

[0063] project

Embodiment 2

[0065] formula:

[0066] Liquid crystal epoxy resin 8 parts

[0067] 16 parts o-cresol novolac epoxy resin

[0068] 3 parts of epoxy resin containing biphenyl structural unit

[0069] 20 parts of melamine modified novolac resin

[0070] Silica powder (quartz powder) 150 parts

[0071] Curing accelerator 1-cyanoethyl-2-methylimidazole 0.4 parts

[0072] Toughener CTBN 5 parts

[0073] Coupling agent KH-560 1.5 parts

[0074] 0.6 parts of stearic acid

[0075] The process is shown in Figure 2.

[0076] project

Embodiment 3

[0078] formula:

[0079] Liquid crystal epoxy resin 15 parts

[0080] 8 parts o-cresol novolak epoxy resin

[0081] 10 parts of epoxy resin containing biphenyl structural unit

[0082] 15 parts of melamine modified novolac resin

[0083] Silica powder (quartz powder) 180 parts

[0084] Curing accelerator 2-methylimidazole 0.8 parts

[0085] Toughener CTBN 5 parts

[0086] Coupling agent KH-560 1.8 parts

[0087] 0.8 parts of stearic acid

[0088] The process is shown in Figure 1.

[0089] project

technical field

[0001] The invention relates to an epoxy resin molding compound for integrated circuit packaging, in particular to a low thermal expansion coefficient, high heat resistance, low water absorption, high flame retardancy, halogen-free, phosphorus-free , Antimony-free high-performance packaging materials.

[0002] The present invention also relates to a method for preparing the above-mentioned epoxy resin molding compound. technical background

[0003] Epoxy molding compound, also known as epoxy molding compound (EMC, Epoxy Molding Compound), is one of the main raw materials for integrated circuit (IC) back-end packaging. Its development is closely following the development of integrated circuit and packaging technology. With the rapid development of integrated circuit and packaging technology, it is increasingly showing its basic and supporting role. At present, epoxy molding compound manufacturers in the world are mainly concentrated in Japan, the United Stat...

Examples

Embodiment 1

[0052] formula:

[0053] Liquid crystal epoxy resin 10 parts

[0054] 10 parts o-cresol novolac epoxy resin

[0055] 5 parts of epoxy resin containing biphenyl structural unit

[0056] 15 parts of melamine modified novolac resin

[0057] Silica powder (quartz powder) 150 parts

[0058] Curing accelerator 2-methylimidazole 0.5 parts

[0059] Toughener CTBN 6 parts

[0060] Coupling agent KH-560 1.5 parts

[0061] 0.8 parts of stearic acid

[0062] The process is shown in Figure 1.

[0063] project

Embodiment 2

[0065] formula:

[0066] Liquid crystal epoxy resin 8 parts

[0067] 16 parts o-cresol novolac epoxy resin

[0068] 3 parts of epoxy resin containing biphenyl structural unit

[0069] 20 parts of melamine modified novolac resin

[0070] Silica powder (quartz powder) 150 parts

[0071] Curing accelerator 1-cyanoethyl-2-methylimidazole 0.4 parts

[0072] Toughener CTBN 5 parts

[0073] Coupling agent KH-560 1.5 parts

[0074] 0.6 parts of stearic acid

[0075] The process is shown in Figure 2.

[0076] project

Embodiment 3

[0078] formula:

[0079] Liquid crystal epoxy resin 15 parts

[0080] 8 parts o-cresol novolak epoxy resin

[0081] 10 parts of epoxy resin containing biphenyl structural unit

[0082] 15 parts of melamine modified novolac resin

[0083] Silica powder (quartz powder) 180 parts

[0084] Curing accelerator 2-methylimidazole 0.8 parts

[0085] Toughener CTBN 5 parts

[0086] Coupling agent KH-560 1.8 parts

[0087] 0.8 parts of stearic acid

[0088] The process is shown in Figure 1.

[0089] project

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