Semiconductor silicon material water base cutting liquid

A silicon material and cutting fluid technology, applied in the field of high-efficiency alkaline semiconductor silicon material water-based cutting fluid, can solve problems affecting VLSI, waste materials, increase processing volume, etc., to facilitate cleaning and subsequent processing, avoid Chemical bonding adsorption, the effect of solving stress problems

Inactive Publication Date: 2006-11-08
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This processing method results in rough knife marks on the section section, deep broken and damaged layers, large residual stress, serious problems such as debris, chipping, and broken roots, and the damaged layer is as deep as 30-60 microns. The processing volume of the process not only wastes materials but also reduces the processing efficiency and yield
Due to the effect of the surface energy of the chip and the new cut surface, the chip and the surface will have a strong adsorption effect, the chip is not easy to peel off and is taken away by the cutting fluid, and it also hinders the cutting speed
In addition, due to cutting tools and environmental factors, metal ion pollution, mainly iron ions, will occur. Metal ions will adhere to the surface of the slice and penetrate into the interior of the wafer, causing metal pollution and seriously affecting the quality of the VLSI manufacturing process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Example 1: Prepare 1000 g of cutting fluid at a production concentration. The polyethylene glycol in this example has a low molecular weight, and the resulting cutting fluid is suitable for cutting semiconductor materials.

[0023] Take 900g of polyethylene glycol (PEG200), 90g of amine base --- hydroxyethylethylenediamine, 10g of chelating agent-FA / O, and the balance is deionized water.

[0024] In the polyethylene glycol (PEG200) under continuous stirring, add the above-mentioned amount of hydroxyethylethylenediamine and chelating agent FA / O slowly and sequentially, and stir until uniform to obtain 1000g of cutting fluid with a production concentration. When used in production, it is used with deionized water at a weight percentage of 1:20.

Embodiment 2

[0025] Embodiment 2: Prepare 1000g cutting fluid

[0026] Take 500g of polyethylene glycol (PEG600) in paste form, 300g of amine base-triethanolamine, 100g of chelating agent-FA / O, and the balance is deionized water.

[0027] At a temperature of 40-60°C, under continuous stirring, dissolve the paste-like polyethylene glycol (PEG600) in deionized water, and slowly add the above-mentioned amount of triethanolamine and chelating agent FA / O in sequence under continuous stirring, Stir until uniform to obtain 1000g cutting fluid.

[0028] The polyethylene glycol in this embodiment is still low molecular weight, and the resulting cutting fluid is suitable for cutting semiconductor materials. When used in production, it is used with deionized water at a weight percentage of 1:15.

Embodiment 3

[0029] Embodiment 3: Prepare 1000g cutting fluid

[0030] Get 300g of solid polyethylene glycol (PEG1000), 200g of amine base-triethanolamine, 50g of chelating agent-FA / O, and the balance is deionized water.

[0031] Dissolve solid polyethylene glycol (PEG1000) in deionized water, slowly add the above-mentioned amount of triethanolamine and chelating agent FA / O under continuous stirring, and stir until uniform to obtain 1000g of cutting fluid.

[0032] The polyethylene glycol in this embodiment has a high molecular weight, and the resulting cutting fluid is not only suitable for cutting semiconductor materials, but also suitable for cutting high-hardness materials, such as diamonds. When used in production, it is used with deionized water at a weight percentage of 1:10.

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PUM

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Abstract

The alkaline water-base cutting liquid for silicon wafer and other semiconductor material consists of polyglycol of molecular weight 200-1000 in 30-90 weight portions, pH regulator 9-30 weight portions, chelating agent 1-10 weight portions and deionized water for the rest. The present invention has the beneficial effects of homogeneous stable chemical splitting effect coexisting with the mechanical effect, less stress, lowered damage of the semiconductor material, raised chip cutting efficiency and quality, simple post-treatment, and avoiding the chemical bonding and adsorption on the surface of silicon wafer.

Description

technical field [0001] The invention belongs to cutting fluids, in particular to a high-efficiency alkaline semiconductor silicon material water-based cutting fluid used for cutting the inner circle of crystal blocks of single crystal silicon and polycrystalline silicon semiconductor materials. Background technique [0002] When cutting monocrystalline silicon, polycrystalline silicon and other compound semiconductor materials with inner circle cutting blades, neutral cutting fluid is generally used to lubricate between the blade and the workpiece to cool down, reduce frictional heat and wash away cutting chips. Rust inhibitors are added to some cutting fluids to prevent equipment and blades from rusting. Cutting semiconductor crystal blocks mainly depends on the strong mechanical action of high-speed rotating blades. This processing method results in rough knife marks on the section section, deep broken and damaged layers, large residual stress, serious problems such as de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/00C10M107/32C10N40/22
Inventor 刘玉岭周建伟张伟
Owner HEBEI UNIV OF TECH
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