Semiconductor silicon material water base cutting liquid

Abstract

The alkaline water-base cutting liquid for silicon wafer and other semiconductor material consists of polyglycol of molecular weight 200-1000 in 30-90 weight portions, pH regulator 9-30 weight portions, chelating agent 1-10 weight portions and deionized water for the rest. The present invention has the beneficial effects of homogeneous stable chemical splitting effect coexisting with the mechanical effect, less stress, lowered damage of the semiconductor material, raised chip cutting efficiency and quality, simple post-treatment, and avoiding the chemical bonding and adsorption on the surface of silicon wafer.

Description

technical field [0001] The invention belongs to cutting fluids, in particular to a high-efficiency alkaline semiconductor silicon material water-based cutting fluid used for cutting the inner circle of crystal blocks of single crystal silicon and polycrystalline silicon semiconductor materials. Background technique [0002] When cutting monocrystalline silicon, polycrystalline silicon and other compound semiconductor materials with inner circle cutting blades, neutral cutting fluid is generally used to lubricate between the blade and the workpiece to cool down, reduce frictional heat and wash away cutting chips. Rust inhibitors are added to some cutting fluids to prevent equipment and blades from rusting. Cutting semiconductor crystal blocks mainly depends on the strong mechanical action of high-speed rotating blades. This processing method results in rough knife marks on the section section, deep broken and damaged layers, large residual stress, serious problems such as de...

AI Technical Summary

Problems solved by technology

This processing method results in rough knife marks on the section section, deep broken and damaged layers, large residual stress, serious problems such as debris, chipping, and broken roots, and the damaged layer is as deep as 30-60 microns. The processing volume of the process not only wastes materials but also reduces the processing efficiency and yield

Due to the effect of the surface energy of the chip and the new cut surface, the chip and the surface will have a strong adsorption effect, the chip is not easy to peel off and is taken away by the cutting fluid, and it also hinders the cutting speed

In addition, due to cutting tools and environmental factors, metal ion pollution, mainly iron ions, will occur. Metal ions will adhere to the surface of the slice and penetrate into the interior of the wafer, causing metal pollution and seriously affecting the quality of the VLSI manufacturing process.