267results about How to "Reduce surface damage" patented technology

The invention discloses a method for preparing nano cerium oxide composite abrasive particle polishing solution. The method is characterized by taking inorganic abrasive particles as the inner core and a cerium oxide coating as the shell to form the nano cerium oxide composite abrasive particle polishing solution with a core/shell structure, and belongs to the high-precision polishing material preparation technique technical field. The preparation process of the polishing solution is as follows: firstly, the nano cerium oxide composite abrasive particles are prepared by the homogeneous precipitation method; secondly, the polishing solution is prepared through the cerium oxide composite abrasive particles. During the preparation process of the polishing solution, the weight percent of the cerium oxide composite abrasive particles and water is between 2 and 10 percent, and 0.5 to 2 percent of dispersant is added; after further ultrasonic dispersion or ball milling dispersion of mixture, uniform dispersion liquid is formed; and the nano cerium oxide composite abrasive particle polishing solution is obtained after addition of 0.5 to 5 percent of oxidant, 0.05 to 0.1 percent of corrosion inhibitor and 0.05 to 0.1 percent of lubricant (the addition of various materials takes 100 percent of water as the reference basis). The polishing solution is represented by low surface roughness and scratch level, and then an ultra-smooth surface is obtained.

An apparatus and method for characterizing cavitation that occurs in a fluid exposed to acoustic energy. The apparatus comprises a vessel for holding the fluid; an acoustic energy generating means for generating acoustic energy, the acoustic energy generating means being positioned to transmit the acoustic energy into the fluid while the fluid is held in the vessel; and a cavitation detection means for detecting cavitation in the fluid held in the vessel. In a preferred embodiment, the cavitation detection means comprises a light detection means, such as a photomultiplier tube, that detects sonoluminescent emission from the fluid. The method comprises the steps of exposing a volume of process fluid to acoustic energy at a specified power level; measuring the photon output from the fluid over a period of time; and when the photon output deviates from a desired level, initiating a remedial step to bring the photon output back to approximately the desired level.

The present invention provides a film for the protection of the surface of polarizer film. Said film surface has anti-static coated layer. The coating solution contains polythiophene, surfactant, binding resin and water. According to the present invention, said protection film on the surface on the polarizer film has the excellent anti-static, transmittance, anti-foul and water repellence. It is able to prevent the invasion of imbuing with dust, accumulative anti-static and water vapor from the processing of assembling and transportation so as to influence the quality of polarizer film.

The invention belongs to semiconductor integrated circuit manufacture technology, and especially relates to a silicon chip thinning method. The silicon chip thinning method comprises a step 1 of arranging a protection material on the front side of a silicon chip; a step 2 of thinning the back side of the silicon chip in a phased grinding mode with a specific thinning process being divided into two phases; a step 3 of putting the silicon chip being thinned in the grinding mode into a corrosive liquid, and carrying out wet etching to the silicon chip through an abrasive wheel at a corrosion rate v3; and a step 4 of removing the protection material from the silicon chip. According to the invention, defects, of the silicon chip, generated in the thinning process are reduced, not only can a batch of silicon chips be thinned, but also back side defects and damaged layers caused by the thinning process are effectively reduced; the thickness proportions and the rates in the thinning process and the corrosion process can be subtly controlled, and therefore less defects and damages are generated on the surface of the silicon chip in the thinning process, and the effect of defect reduction is verified through ion implantation after the thinning process.

A direction changing device for flat glass minimizes the load on the flat glass by floating in the air, so that the flat glass is rotated in place and transferred in a specified direction. The flat glass direction changing device of the present invention comprises: an air ejector, comprising an air chamber and a fan box, the air chamber has an ejection plate for the air to float the flat glass, and the fan box is provided with an air jet fan for supplying air to the air chamber The roller transfer machine is arranged on the adjacent part of the outer peripheral surface of the air ejector, and has a plurality of rollers for transferring the flat glass in a prescribed direction; the rotary machine is arranged in the central part of the air ejector, so that the The flat glass is rotated in place. In the state of the flat glass floating in the air, the shaft rotates and transfers the flat glass, which not only minimizes the contact area between the flat glass and the roller and reduces the surface damage of the flat glass, but also simplifies the structure of the direction changing device regardless of the size of the flat glass , thereby miniaturizing the power and structure of the rotating equipment.

The invention discloses a method for processing soft and crisp LBO crystals based on a consolidated abrasive polishing pad, which is characterized by comprising the following steps: firstly, roughly polishing and machining LBO crystals by the polishing pad of diamond consolidated abrasive of which the granularity is less than or equal to 14 micrometers, wherein in the polishing and machining process, the polishing pressure is controlled to 50-600g/cm<2>, the revolving speed of a polisher is controlled to 10-200 rpm, the pH value of a polishing solution adopted by polishing is controlled to 2-6, and the temperature of the polishing solution is 20-30DEG C to roughly polish the LBO crystals; and then, finely polishing and machining the LBO crystals obtained from the rough machining by the polishing pad of cerium oxide consolidated abrasive of which the granularity is not more than 3 micrometers, wherein the polishing pressure is controlled to 50-600g/cm<2> in the fine polishing and machining process, the revolving speed for polishing is controlled to 10-200rpm, the pH value of a polishing solution adopted by polishing is controlled to 2-6, and the temperature of the polishing solution is 20-30DEG C until the surface quality satisfies a set requirement. The method has the advantages of high processing efficiency and high finished product rate and does not cause environmental pollution.

A method of using finishing aids for advanced finishing control is described. A finishing surface is used generally to induce frictional wear. The finishing aids with preferred in situ control can improve control of the coefficient of friction, the tangential force of friction, a finishing rate, a regional finishing rate(s), a differential finishing rate, and help reduce unwanted defects. A finishing aid can reduce friction. A lubricant is an illustrative finishing aid. The method uses finishing control subsystem having a multiplicity of operative process sensors along with tracked information to improve in situ control of finishing. Differential finishing rate methods are described to differentially finish semiconductor wafers. Differential lubricating film methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing with improved real time control.

The alkaline water-base cutting liquid for silicon wafer and other semiconductor material consists of polyglycol of molecular weight 200-1000 in 30-90 weight portions, pH regulator 9-30 weight portions, chelating agent 1-10 weight portions and deionized water for the rest. The present invention has the beneficial effects of homogeneous stable chemical splitting effect coexisting with the mechanical effect, less stress, lowered damage of the semiconductor material, raised chip cutting efficiency and quality, simple post-treatment, and avoiding the chemical bonding and adsorption on the surface of silicon wafer.

The invention discloses solar silicon wafer cutting liquid. The solar silicon wafer cutting liquid contains polyethylene glycol, a dispersant, a surfactant, a defoamer and a chelating reagent. The solar silicon wafer cutting liquid can improve the dispersibility and the redispersibility of silicon carbide so as to ensure the stability and the durability of slurry, can realize 100 percent recovery of the silicon carbide, greatly reduces the cost, can reduce the surface damage of a slice and the pollution of mechanical stress, thermal stress and metal ions to a silicon wafer, contributes to subsequent cleaning of the silicon wafer, improves the conversion efficiency of a rear-end solar battery, can effectively improve the thickness error of the silicon wafer and improves cutting yield.

The invention relates to a method for cleaning quartz material parts, which is as follows: wiping with organic solvent, soaking in H2O2, cleaning in solvent containing ammonium persulfate and non-ionic surface active agent such as polyethylene glycol or methoxy polyethylene glycol, etc. wiping again with an emery cloth and ultrasonic cleaning with ultrapure water. In the steps that do not adopt ultrapure water to clean, rinse with ultrapure water needs to be carried out. The invention is a harmless, quick and effective method to clean the surfaces of quartz parts in etching machines, which can realize cleaning of surfaces of quartz material parts and causes little or no harm to the surfaces of parts; the operation thereof is simple and convenient.

The invention discloses a processing method for ultrathin plain glass based on consolidated abrasive, which is characterized by comprising the following steps: firstly, taking ground plain glass of which the thickness is less than or equal to 0.5mm as a raw material; secondly, adopting a polishing pad of diamond consolidated abrasive of which the granularity is less than or equal to 28 micrometers, controlling the polishing temperature to 20-40oC, polishing pressure of 100-1000g/cm<2>, pH value of a polishing solution of 8-11, flow velocity of 100-500ml/min and polishing rotation speed of 10-500r/min to obtain a middle glass product of which the thickness is 0.2-0.3mm; thirdly, polishing the polishing pad of diamond consolidated abrasive of which the granularity is less than or equal to 10 micrometers, controlling the polishing temperature to 20-40oC, polishing pressure of 100-500g/cm<2>, pH value of a polishing solution of 8-11, flow velocity of 100-500ml/min and polishing rotation speed of 10-300r/min; and putting the middle glass product onto a polisher to polish to obtain ultrathin glass of which the thickness is less than or equal to 0.15mm. The processing method has the advantages of simple process, no pollution, high efficiency and low cost, and size material with a larger length or width and thickness ratio can be processed.

The invention discloses abrasive material-free polishing fluid free for chemical mechanical polishing of a rigid fragile material. The polishing fluid is characterized by consisting of 0.5 to 40 percent of corrosive, 0.5 to 20 percent of corrosion inhibitor, 0.5 to 15 percent of surfactant, 0.1 to 10 percent of pH regulator and de-ionized water. The abrasive material-free polishing fluid has the advantages of no abrasive material, small damage to the surface of a polished material, capability of obtaining a non-damage super smooth surface, no precipitate, capability of being stored and used for a long time, high stability, difficult volatilization, high fluidity, easy cleaning and small corrosion to equipment. The abrasive material-free polishing fluid is prepared special for the chemical mechanical polishing of the rigid fragile material, so the abrasive material-free polishing fluid has the advantages of conventional abrasive material-free polishing fluid, has high removal ratio for the rigid fragile material, can obtain high surface quality and has low cost and a simple and easy method.

A floating disc suspension polishing device comprises a polishing base disc and a floating disc, wherein wedge grooves and processing stations for placing workpieces to be processed are formed and arranged on the surface, opposite to the floating disc, of the polishing base disc in the circumferential direction; the wedge grooves are filled with polishing solutions; the wedge grooves and the processing stations are arranged at intervals; the polishing device further comprises a spring, a force sensor, a lifting platform and a master driver; the polishing base disc and the master driver are connected and can rotate around a spindle; the polishing base disc is positioned on the floating disc; the floating disc is connected with the upper end of the spring; the lower end of the spring is connected with the force sensor; and the force sensor is fixedly connected with the lifting platform. The floating disc suspension polishing device presses precisely, grinds stably, and is small in surface damage and high in quality.

This invention relates to a method for manufacturing cathode foils of aluminium electrolytic condensers including corrosion, middle treatment and post treatment characterizing in the technical process: pretreatmentí·corrosioní·burnetí·middle treatmentí·post treatmentí·dried. The burning is done in a dry oven under 300-550deg.c, for 30-80sec. forming and oxide film on the A1 foil surface and solidifying the surface holes eroded on the foil for reducing damage to the surface of the negative foil. Premiddle treatment can beaded after corrosion and before burning, the solution can be applied with0.5~0.9mol/L HNO3 under 28-35deg.c for 25-50sec.

The invention relates to a novel production method for a mixed grinding material. The method comprises the following steps: mixing zirconium silicate and alumina; carrying out ball milling on the mixture so as to obtain mixed micro-powder; putting the mixed micro-powder, water and a dispersant into a sorting barrel and standing the mixture for settlement after stirring; carrying out sorting, wherein two sub-steps are included, namely, a) sucking out a slurry on the upper layer of the sorting barrel with a siphon, adding clear water to the sorting barrel until the mixture reaches the initial liquid level before siphoning, and carrying out stirring, settling and siphoning so as to obtain particles of a grade, and b) adding the dispersant and clear water into the sorting barrel until the mixture reaches the initial liquid level before siphoning and repeating the steps of stirring, settling and siphoning so as to obtain particles of another grade; drying the obtained particles with different grades so as to obtain a finished product. The mixed grinding material produced in the invention enables damage of micro-powder to the surface of a ground material in grinding to be substantially reduced and plays a very critical role in improving the quality of surface polishing of an object and in reducing polishing cost.

A safety device for a turbine blade is provided. The safety device includes a shear pin, a clamping piece and a securing element, wherein the shear pin is arranged in a corresponding bore in the turbine blade foot and the clamping piece is designed having an upper limb and a lower limb, wherein the clamping piece exerts a radial force on the turbine blade foot for radial safeguarding.

A cleaning solution is provided. The cleaning solution includes (a) 0.01-0.1 wt % of hydrofluoric acid (HF); (b) 1-5 wt % of a strong acid, wherein the strong acid is an inorganic acid; (c) 0.05-0.5 wt % of ammonium fluoride (NH₄F); (d) a chelating agent containing a carboxylic group; (e) triethanolamine (TEA); (f) ethylenediaminetetraacetic acid (EDTA); and (g) water for balance.

The invention provides a film lithium niobate optical waveguide chip polishing device and a polishing method thereof. A magnetic stirring table is used for driving a magnetic rotor to rotate in a polishing solution, then the polishing solution is stirred to generate flowing contact with the surface of a chip, polishing particles in the polishing solution generate half contact or sliding contact with the surface of the chip subjected to dry etching, slight particle bombardment is associated, meanwhile, alkali ions in a polishing solvent and the etched surface generate a chemical etching reaction, chemical etching and particle bombardment in the direction parallel to the etched surface are achieved through instant stirring of the polishing solution, then etching products deposited on the dryetched surface and spikes and protrusions generated by dry etching are removed, and the effect that the etched surface and the waveguide side wall are smooth is achieved. Compared with traditional contact type mechanical grinding and polishing and chemical-mechanical grinding methods, the device and the method have the advantages that the structure is simple, operation is simple and convenient, cost is low, and surface damage is small.

The invention discloses a spherical consolidation abrasive grinding and polishing pad for processing an optical element, which is characterized in that an abrasive is uniformly mixed with thermosetting resin, and the spherical consolidation abrasive grinding and polishing pad is formed after consolidation, wherein the mass percent of the abrasive to the thermosetting resin is (5-50 percent):(50-95 percent). The abrasive is one or the combination of more of diamond, silica, cerium oxide, aluminum oxide, aluminum oxide, silicon carbide, boron carbide and zirconium oxide, and has the grain of 50nanometers-100micrometers; the thermosetting resin is one or the combination of unsaturated polyester resin, epoxy resin, phenolic resin and polybutadiene; a spherical surface is a convex spherical surface or concave spherical surface and has a diameter of 3.5-1000 micrometers and a radius of curvature of 2.5-infinity. The grinding and polishing of the spherical surface of the consolidation abrasive has the characteristics of stable grinding and polishing properties, simple process, high processing efficiency, low processing cost, no environment pollution and the like.