Preparation of nano-cerium oxide composite abrasive grain polishing solution

Abstract

The invention discloses a method for preparing nano cerium oxide composite abrasive particle polishing solution. The method is characterized by taking inorganic abrasive particles as the inner core and a cerium oxide coating as the shell to form the nano cerium oxide composite abrasive particle polishing solution with a core / shell structure, and belongs to the high-precision polishing material preparation technique technical field. The preparation process of the polishing solution is as follows: firstly, the nano cerium oxide composite abrasive particles are prepared by the homogeneous precipitation method; secondly, the polishing solution is prepared through the cerium oxide composite abrasive particles. During the preparation process of the polishing solution, the weight percent of the cerium oxide composite abrasive particles and water is between 2 and 10 percent, and 0.5 to 2 percent of dispersant is added; after further ultrasonic dispersion or ball milling dispersion of mixture, uniform dispersion liquid is formed; and the nano cerium oxide composite abrasive particle polishing solution is obtained after addition of 0.5 to 5 percent of oxidant, 0.05 to 0.1 percent of corrosion inhibitor and 0.05 to 0.1 percent of lubricant (the addition of various materials takes 100 percent of water as the reference basis). The polishing solution is represented by low surface roughness and scratch level, and then an ultra-smooth surface is obtained.

Description

technical field [0001] The invention relates to a method for preparing a nano-cerium oxide composite abrasive polishing liquid with an inorganic abrasive particle as the core and a cerium oxide coating layer as the outer shell to form a core / shell structure, belonging to the technical field of high-precision polishing material preparation technology. Background technique [0002] Today, with the continuous improvement of the performance of advanced electronic products such as digital discs, optical glass, integrated circuit silicon chips, computer hard disks, etc., it poses a severe challenge to the limit of mechanical manufacturing, and the requirements for processing accuracy and surface quality are getting higher and higher. [0003] Chemical-mechanical polishing (CMP) technology is almost the only global planarization technology suitable for obtaining high-precision surfaces. Nano-abrasive particles are the key and basic component of chemical mechanical polishing fluid, ...

AI Technical Summary

Problems solved by technology

At present, commercial abrasives are mostly single inorganic particles such as alumina, silicon oxide, cerium oxide, zirconia, titanium oxide, diamond, silicon nitride, silicon carbide, etc., but single inorganic abrasives often have unsatisfactory polishing. performance, such as high alumina hardness and fast polishing speed, but many scratches; in addition, commercially available cerium oxide polishing powders tend to have larger particles, mostly in micron or submicron levels, and have problems such as poor dispersion stability, resulting in polishing scratches. mark

These all limit the improvement of surface quality after polishing

Images