Solar silicon wafer cutting liquid

Abstract

The invention discloses solar silicon wafer cutting liquid. The solar silicon wafer cutting liquid contains polyethylene glycol, a dispersant, a surfactant, a defoamer and a chelating reagent. The solar silicon wafer cutting liquid can improve the dispersibility and the redispersibility of silicon carbide so as to ensure the stability and the durability of slurry, can realize 100 percent recovery of the silicon carbide, greatly reduces the cost, can reduce the surface damage of a slice and the pollution of mechanical stress, thermal stress and metal ions to a silicon wafer, contributes to subsequent cleaning of the silicon wafer, improves the conversion efficiency of a rear-end solar battery, can effectively improve the thickness error of the silicon wafer and improves cutting yield.

Description

technical field [0001] The invention relates to a solar silicon wafer cutting fluid, in particular to a solar silicon wafer cutting fluid containing polyethylene glycol, a dispersant, a surfactant, a defoamer and a chelating agent. Background technique [0002] Solar silicon wafer cutting generally uses silicon carbide micropowder with high hardness, small particle size and concentrated particle size distribution as the main cutting medium. Usually, carbonized micropowder should be added to the cutting fluid in a certain proportion, and fully dispersed, and then configured into a uniform and stable cutting mortar, which can then be used for silicon wafer cutting. Using silicon carbide micropowder as the medium in the wire cutting process of solar silicon wafers, the whole mechanism is to make the silicon carbide micropowder particles continuously and rapidly impact the surface of the silicon rod, and use the hard characteristics and sharp corners of the silicon carbide parti...

AI Technical Summary

Problems solved by technology

However, due to the limitations of the recycling process and technology, as well as the wear of the edges and corners of the recycled sand, the recycled sand will contain a small amount of metal ions and silicon particles in addition to the reduced cutting ability.

For the existing cutting fluid, for the existing recycled sand, it is difficult to solve the problems of the quality reduction of silicon wafers caused by the presence of metal ions and silicon powder, it is not easy to clean, and the conductivity conversion is low.