Processing method for ultrathin plain glass based on consolidated abrasive
A technology of consolidating abrasives and glass, which is applied to machine tools, metal processing equipment, chemical instruments and methods suitable for grinding workpiece planes, etc. It can solve problems such as difficult control of parallelism, uneven thickness, variability, etc., and achieve operational Low difficulty, uniform thickness, easy to clean
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Embodiment 1
[0024] Embodiment 1: A method for processing ultra-thin flat glass based on consolidated abrasives, which includes the following steps: 1) W28 is used for rough polishing (that is, the diamond particle size is between 20 and 28 microns, not greater than 28 microns, the same below) The diamond-fixed abrasive polishing pad, the preparation method and ingredients of the diamond-fixed abrasive polishing pad can be realized by the method and formula of patent No. 2008100227414 and 2008102440960 (the same below), and the polishing temperature is controlled at 25 o C, the polishing pressure is controlled at 800g / cm 2 , the pH value of the polishing solution is 8, the flow rate is 300ml / min, the polishing speed is 150r / min, and the double-sided polishing of the glass is removed to 0.2~0.3mm. 2) W10 (that is, the diamond particle size is between 5 and 10 microns, not greater than 10 microns, the same below) diamond-bonded abrasive polishing pad is used for fine polishing, and the polis...
Embodiment 2
[0025] Embodiment 2: a kind of processing method based on the ultra-thin plane glass of fixed abrasive, it comprises the following steps: 1) rough polishing adopts the diamond fixed abrasive polishing pad of W28, and polishing temperature is controlled at 30 o C, the polishing pressure is controlled at 800g / cm 2 , the pH value of the polishing solution is 10, the flow rate is 300ml / min, the polishing speed is 200r / min, and the double-sided polishing of the glass is removed to 0.2~0.3mm. 2) W10 diamond bonded abrasive polishing pad is used for fine polishing, and the polishing temperature is controlled at 30 oC , the polishing pressure is controlled at 300g / cm 2 , the polishing liquid adjusts the PH value to 9, the flow rate is 300ml / min, the polishing speed is 100r / min, and the glass is polished to 0.15mm on both sides, and the surface accuracy meets the requirements.
Embodiment 3
[0026] Embodiment 3: a kind of processing method based on the ultra-thin flat glass of fixed abrasive, it comprises the following steps: 1) rough polishing adopts the diamond fixed abrasive polishing pad of W28, and polishing temperature is controlled at 35 o C, the polishing pressure is controlled at 800g / cm 2 , the pH value of the polishing solution is 11, the flow rate is 300ml / min, the polishing speed is 150r / min, and the double-sided polishing of the glass is removed to 0.2~0.3mm. 2) W10 diamond bonded abrasive polishing pad is used for fine polishing, and the polishing temperature is controlled at 35 oC , the polishing pressure is controlled at 300g / cm 2 , the polishing liquid adjusts the PH value to 11, the flow rate is 300ml / min, the polishing speed is 150r / min, and the glass is polished to 0.15mm on both sides, and the surface accuracy meets the requirements.
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