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47results about How to "Lattice integrity" patented technology

Rapid preparation methods of graphene oxide and graphene

The invention provides a preparation method of graphene oxide. The method comprises the following steps: firstly, mixing graphite, an intercalator and an oxidizing agent under an airtight condition and then carrying out a reaction to obtain a reaction mixture; separating the reaction mixture obtained in the previous step to obtain a reaction product; finally, stripping the reaction product, obtained in the previous step, in a dispersing agent to obtain graphene oxide dispersion liquid. According to the preparation method, the intercalator is inserted into the parts among graphene sheet layers under the action of pressure and under the airtight condition, so that the acting force among layers is reduced, and the distances among the layers are increased; then, the oxidizing agent enters the parts among the graphene sheet layers and has an oxidation reaction, so that the graphene oxide is formed; due to the action of the pressure, the intercalator and the oxidizing agent are enabled to enter the parts among graphene layers more rapidly, and the reaction is promoted to be completed within a short time, so that first-order intercalating for the graphite is realized; furthermore, the preparation method is less in energy consumption in a reaction process, environmentally-friendly, convenient and fast to operate as well as safe and controllable, thus being more suitable for industrial mass production.
Owner:SHANDONG OBO NEW MATERIAL CO LTD

P-type heavily-doped silicon carbide film extension preparation method

The invention discloses a P-type heavily-doped silicon carbide film extension preparation method, which mainly solves the problem that in the prior art, high-quality heavy doping of silicon carbide cannot be realized. The method comprises the following steps that: a silicon carbide underlay is firstly placed into a reaction chamber; the reaction chamber is heated in the hydrogen stream, and after the temperature reaches 1,400 DEG C, propane (C3H8) is added into the hydrogen stream; after the temperature reaches 1,580 DEG C, in-situ etching is performed on the underlay for 10 to 30 minutes; then the temperature of the reaction chamber is maintained at 1,580 DEG C, the air pressure is maintained at 100mbar, silane (SiH4) with a flow rate of 15 to 24 mL/min, C3H8 with a flow rate of 5 to 10 mL/min and trimethyl aluminium with a flow rate of 3.2*10<minus 5 mol/min) are added into the hydrogen stream of 20L/min to grow an extension layer; after the growth is completed, the extension layer is cooled in the hydrogen stream; and finally, argon is charged into the reaction chamber to the normal pressure. The doping concentration of the prepared silicon carbide extension layer is 4*1019cm<-3> to 4.6*1019cm<-3>, the doping is uniform, the surface is smooth, and the prepared silicon carbide extension layer can be used for producing a silicon carbide device.
Owner:陕西半导体先导技术中心有限公司

Horizontal growth device and growth method of phosphorus silicon cadmium mono-crystal

The invention discloses a horizontal growth device and growth method of a phosphorus silicon cadmium mono-crystal, belonging to the technical field of phosphorus silicon cadmium mono-crystal preparation. The device comprises an outer layer quartz tube, an inner layer quartz tube sleeved in the outer layer quartz tube, and a PBN boat-shaped crucible sleeved in the inner layer quartz tube, wherein the PBN boat-shaped crucible comprises a crystal nucleus growth section, a transition section and a mono-crystal growth section which are connected with one another in sequence; a first end part of the crystal nucleus growth section is set to be spire-shaped so as to improve the uniformity of crystal orientation in spontaneous nucleation. By virtue of the design of a double-layer quartz tube, inert gas is introduced between the quartz tubes, so that the problems of tube explosion extremely easily generated in the crystal growth process can be solved, and the stability of a thermal field and the durability of the growth device can be improved. The method is used for preparing the phosphorus silicon cadmium mono-crystal on a horizontal crystal growth furnace with the growth device by using a horizontal gradient freezing method so as to ensure a more stable crystallization process and reduce the defects of parasitic nucleation; the method is beneficial for obtaining a CSP mono-crystal with good mono-crystal performance and complete crystal lattice, and is simple in operation, easy in control and low in cost.
Owner:北京雷生强式科技有限责任公司 +1

Preparing method of oxidized graphene and high-conductivity graphene

InactiveCN106564891AAchieving a self-boosting reactionReduced interlayer forceSingle layer grapheneGraphiteGraphene
The invention provides a preparing method of oxidized graphene. The preparing method comprises the following steps that at first, on the condition of pressurization of protective gas, graphite, an intercalator and an oxidizing agent are subjected to low-temperature reaction after being mixed, and a reaction mixture is obtained; then the reaction mixture obtained in the above step is separated, and then a reaction product is obtained; finally, the reaction product obtained in the above step is stripped in a dispersing agent, and oxidized graphene dispersing liquid is obtained. By the adoption of the low-temperature condition, the defect rate is reduced obviously, under the effect of pressure, the intercalator is inserted between graphene sheet layers, the acting force between the layers is reduced, and the distance between the layers is increased; then the oxidizing agent enters the portions between the graphene sheet layers, the oxidizing reaction is carried out, and thus oxidized graphene is formed; and due to the effect of the pressure, the intercalator and the oxidizing agent enter the portions between the graphene sheet layers faster, the reaction is promoted to be more complete within a short time, one-step intercalation to graphene is achieved, and then graphene powder with the low defect rate and high quality is obtained and prepared.
Owner:SHANDONG OBO NEW MATERIAL CO LTD

Method for controlling N-type 4H-SiC homogenous epitaxial doping

The invention discloses a method for controlling N-type 4H-SiC homogenous epitaxial doping. The method includes steps of placing silicon carbide substrates into a reaction chamber; heating the reaction chamber in hydrogen stream; adding C<3>H<8> into the hydrogen stream after the temperature of the reaction chamber reaches 1400 DEG C; performing in-situ etching on the substrates for 10-30 minutes after the temperature of the reaction chamber reaches 1580 DEG C; keeping the temperature of the reaction chamber at the temperature of 1580 DEG C, keeping the pressure of the reaction chamber within the range of 300mbar-700mbar, adding SiH<4> at a flow rate of 15-24mL/min, C<3>H<8> at a flow rate of 5-10mL/min and N<2> at a flow rate of 2L/min into the hydrogen stream at a rate of 80L/min and growing epitaxial layers; cooling the silicon carbide substrates in the hydrogen stream after the epitaxial layers complete growing; filling argon into the reaction chamber until the pressure of the reaction chamber reaches the normal pressure. The method has the advantages that only the pressure of the reaction chamber is changed, operation is simple and convenient, and the manufactured silicon carbide epitaxial layers are doped uniformly, have smooth surfaces and can be used for manufacturing silicon carbide devices.
Owner:XIDIAN UNIV

LED (light-emitting diode) fluorescent powder with broadband gradient and preparation method thereof

The invention provides an LED (light-emitting diode) fluorescent powder with broadband gradient and a preparation method thereof. A single particle of the fluorescent powder sequentially comprises more than three layers of fluorescent materials with the same crystal structure and different chemical components from inside to outside. According to the preparation method, a microwave heating-homogeneous precipitation technology is adopted for preparing several pure phase micro nanoscale or nanoscale fluorescent powders with the same crystal structure and different components, and then the micro-sized fluorescent powder grain is taken as a seed crystal, the micro-sized fluorescent powder grain is mixed with the pure phase micro nanoscale or nanoscale fluorescent powder, epitaxial growth is conducted sequentially step by step at high temperature, or the micro-sized fluorescent power grain is taken as a seed crystal, a mononuclear multilayered shell structure precursor with the same crystal structure and different components is formed through liquid phase coprecipitation, epitaxial growth is conducted sequentially step by step at high temperature, and then the LED fluorescent powder with broadband gradient is obtained through grinding. The LED fluorescent powder with broadband gradient has a special structure and components, good dispersibility, high bulk density, strong scattering intensity, and high luminous efficiency.
Owner:HUNAN SCI & TECH RES & DEV CENT

Doping source flow control N-type heavily-doped silicon carbide film epitaxial making method

The invention relates to a doping source flow control N-type heavily-doped silicon carbide film epitaxial making method. The making method comprises the following steps: 1, placing a silicon carbide substrate in a reaction chamber of a silicon carbide CVD apparatus, and vacuumizing the reaction chamber; 2, introducing H2 to the reaction chamber until the pressure in the reaction chamber reaches 100mbar, maintaining the pressure in the reaction chamber unchanged, gradually increasing the H2 flow to 60L/min, and continuously introducing H2 to the reaction chamber; 3, starting a high frequency coil induction heater RF, gradually increasing the power of the heater, and carrying out in situ etching when the temperature of the reaction chamber gradually rises to 1400DEG C; and 4, maintaining the temperature and the pressure unchanged when the temperature of the reaction chamber reaches 1580-1600DEG C, introducing C3H8 and SiH4 to the reaction chamber, introducing highly pure N2 to the reaction chamber as an N-type doping source, stopping the introduction of SiH4, C3H8 and highly pure N2 to the reaction chamber and maintaining for 1min after a first-layer N-type doping layer grows, adjusting the flow of the highly pure N2, and continuously introducing SiH4, C3H8 and the highly pure N2 to the reaction chamber to grow a second-layer N-type doping layer.
Owner:XIDIAN UNIV

Method for preparing base-region graded doped silicon carbide thin film epitaxy layer

The invention relates to a method for preparing a base-region graded doped silicon carbide thin film epitaxy layer. The method comprises the steps that 1, a silicon carbide substrate is placed in a reaction chamber of silicon carbide CVD equipment, and the reaction chamber is vacuated; 2, H2 is introduced into the reaction chamber till the air pressure of the reaction chamber reaches 100 mbar, the air pressure of the reaction chamber is kept constant, the flow of H2 is gradually increased to 60 L / min, and gas continues to be introduced into the reaction chamber; 3, a high-frequency coil induction heater RF is started, the power of the heater is gradually increased, and when the temperature of the reaction chamber gradually rises to 1,400 DEG C, in-situ etching is carried out; and 4, when the temperature of the reaction chamber reaches 1,580 DEG C to 1,600 DEG C, the temperature and pressure are kept constant, the flow of an Al source is set, C3H8 and SiH4 are introduced into the reaction chamber, and the P-type graded doped silicon carbide thin film epitaxy layer is slowly grown by gradually adjusting the flow of the Al source introduced into the reaction chamber. According to the method, the CVD equipment of silicon carbide is utilized, the silicon carbide epitaxy layer with the controllable longitudinal doping concentration gradient is prepared, and the requirement for preparation of the gradient low-doped epitaxy layer is met.
Owner:GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2

Method for eliminating residual lithium by lithium transition metal oxide and application thereof

ActiveCN111943272AHigh active lithium contentReduce residual lithium on the surfaceCell electrodesCobalt compoundsPhysical chemistryElectrochemistry
The invention provides a method for removing residual lithium from lithium transition metal oxide and application of the method. The method comprises the following steps: coating lithium transition metal oxide with a lithium absorbing agent, and carrying out heat treatment to form an amorphous surface layer; the amorphous surface layer is converted into a crystalline surface layer through crystallization treatment; the lithium absorbing agent comprises an amorphous substance. The method at least has the following beneficial effects that after the lithium transition metal oxide is coated with the amorphous substance, the amorphous substance has a very strong tendency of combining residual lithium under a heat treatment condition, the content of the residual lithium on the surface of the material can be greatly reduced, and meanwhile, the capacity reduction caused by lithium loss is avoided by absorbing the residual lithium on the surface; and then the amorphous state is converted into the crystalline state, so that crystal lattices are more complete, and the problem that the surface structure of the material is damaged due to energy release in the process of converting the amorphouslong-range disordered metastable state into the crystalline state and the resulting problem of battery attenuation are avoided; therefore, the electrochemical performance of the material is effectively ensured not to be reduced due to elimination of residual lithium on the surface.
Owner:GUANGDONG BRUNP RECYCLING TECH +2

Cobalt-free positive electrode material, preparation method thereof and lithium ion battery

PendingCN114715955ADissolution controlIncreased reactive surface areaCell electrodesSecondary cellsLithium-ion batteryChemical stability
The invention discloses a cobalt-free positive electrode material, a preparation method thereof and a lithium ion battery. The molecular formula of the cobalt-free positive electrode material is Li1 + nNixMnyMzO2, wherein x + y + z = 1, 0.5 < = x < 1.0, 0 < y < 0.5, 0 < = z < = 0.1,-0.1 < = n < = 0.5; m is one or more of Al, Mg, Sr, Ti, Fe, Sc, V, Y, Zr, Nb and Mo except Co. The preparation method comprises the following steps: mixing raw materials including a nickel source, a manganese source, a lithium source, an M source, a nucleating agent graphene oxide hydrogel, a precipitator and a complexing agent to prepare a mixed solution, and applying a microwave field in the hydrothermal process of the raw material mixed solution; performing hydrothermal reaction in a protective atmosphere to obtain a positive electrode material process sample; and sintering the process sample in an oxygen-containing atmosphere to obtain the cobalt-free positive electrode material. According to the preparation method, the material performance is improved by regulating and controlling the microstructure and optimizing the preparation process, meanwhile, the cost is saved, and the manufacturing process is simplified; the lithium battery prepared from the cobalt-free positive electrode material has excellent chemical stability and electrical performance.
Owner:湖南桑瑞新材料有限公司

Method for preparing P-type lightly-doped silicon carbide thin film epitaxy by controlling hydrogen flow

The invention relates to a method for preparing a P-type lightly-doped silicon carbide thin film epitaxy by controlling hydrogen flow. The preparation method comprises the following steps: (1) placing a silicon carbide substrate into a reaction chamber of silicon carbide CVD (Chemical Vapor Deposition) equipment, and vacuumizing the reaction chamber; (2) introducing H2 into the reaction chamber till the air pressure of the reaction chamber reaches 100 mbar, keeping the air pressure of the reaction chamber constant, then gradually increasing the H2 flow to 60 L / minute, and continuously introducing the H2 into the reaction chamber; (3) starting a high-frequency coil induction heater RF, greatly enhancing the power of the high-frequency coil induction heater RF, and etching in situ when the temperature of the reaction chamber is gradually increased to 1400 DEG C; and (4) when the temperature of the reaction chamber reaches 1580-1600 DEG C, keeping the temperature and pressure constant, introducing C3H8 and SiH4 into the reaction chamber, placing liquid trimethyl aluminum used as a doped source into a bubbler, and introducing a certain amount of H2 into the bubbler so that the H2 carried with the trimethyl aluminum is introduced into the reaction chamber.
Owner:XIDIAN UNIV

A kind of horizontal growth device and growth method of phosphorus silicon cadmium single crystal

The invention discloses a horizontal growth device and growth method of a phosphorus silicon cadmium mono-crystal, belonging to the technical field of phosphorus silicon cadmium mono-crystal preparation. The device comprises an outer layer quartz tube, an inner layer quartz tube sleeved in the outer layer quartz tube, and a PBN boat-shaped crucible sleeved in the inner layer quartz tube, wherein the PBN boat-shaped crucible comprises a crystal nucleus growth section, a transition section and a mono-crystal growth section which are connected with one another in sequence; a first end part of the crystal nucleus growth section is set to be spire-shaped so as to improve the uniformity of crystal orientation in spontaneous nucleation. By virtue of the design of a double-layer quartz tube, inert gas is introduced between the quartz tubes, so that the problems of tube explosion extremely easily generated in the crystal growth process can be solved, and the stability of a thermal field and the durability of the growth device can be improved. The method is used for preparing the phosphorus silicon cadmium mono-crystal on a horizontal crystal growth furnace with the growth device by using a horizontal gradient freezing method so as to ensure a more stable crystallization process and reduce the defects of parasitic nucleation; the method is beneficial for obtaining a CSP mono-crystal with good mono-crystal performance and complete crystal lattice, and is simple in operation, easy in control and low in cost.
Owner:北京雷生强式科技有限责任公司 +1

Hydrogen flow control N-type low-doped silicon carbide film epitaxial making method

The invention relates to a hydrogen flow control N-type low-doped silicon carbide film epitaxial making method. The making method comprises the following steps: 1, placing a silicon carbide substrate in a reaction chamber of a silicon carbide CVD apparatus, and vacuumizing the reaction chamber; 2, introducing H2 to the reaction chamber until the pressure in the reaction chamber reaches 100mbar, maintaining the pressure in the reaction chamber unchanged, gradually increasing the H2 flow to 60L/min, and continuously introducing H2 to the reaction chamber; 3, starting a high frequency coil induction heater RF, gradually increasing the power of the heater, and carrying out in situ etching when the temperature of the reaction chamber gradually rises to 1400DEG C; and 4, maintaining the temperature and the pressure unchanged when the temperature of the reaction chamber reaches 1580-1600DEG C, introducing C3H8 and SiH4 to the reaction chamber, introducing highly pure N2 to the reaction chamber as an N-type doping source, stopping the introduction of SiH4, C3H8 and highly pure N2 to the reaction chamber and maintaining for 1min after a first-layer N-type doping layer grows, reducing the H2 flow from 60L/min to 40L/min, and continuously introducing SiH4, C3H8 and the highly pure N2 to the reaction chamber to grow a second-layer N-type doping layer.
Owner:XIDIAN UNIV

Epitaxial preparation method of P type heavily-doped silicon carbide film by controlling flow rate of hydrogen gas

The invention relates to an epitaxial preparation method of a P type heavily-doped silicon carbide film by controlling a flow rate of a hydrogen gas. The preparation method comprises the following steps: (1) placing a silicon carbide substrate into a reaction chamber of silicon carbide CVD (chemical vapor deposition) equipment, and vacuating the reaction chamber; (2) introducing H2 into the reaction chamber until the gas pressure of the reaction chamber reaches 100mbar, keeping the gas pressure of the reaction chamber constant, gradually increasing the flow rate of the H2 to 60 L / min, and continuously introducing H2 into the reaction chamber; (3) switching on a high-frequency coil induction heater RF, gradually increasing the power of the heater, and carrying out in-situ etching when the temperature of the reaction chamber is greatly increased to 1400 DEG C; and (4) keeping the temperature and the pressure intensity constant while the temperature of the reaction chamber is 1580-1600 DEG C, and introducing C3H8 and SiH4 into the reaction chamber; placing liquid-state trimethyl aluminum into a bubbler as a doping source, introducing a certain amount of H2 into the bubbler and introducing the H2 into the reaction chamber along with the trimethyl aluminum.
Owner:XIDIAN UNIV

Preparation method of high-temperature resistant red fluorescent powder for CCFL (cold cathode fluorescent lamp)

The invention relates to a preparation method of high-temperature resistant red fluorescent powder for CCFL (cold cathode fluorescent lamp), belonging to the technical field of preparation for luminescent materials. The preparation method comprises the following steps: dissolving urea in water to obtain urea solution; performing classification process to ytterbium europium oxide and controlling particle size of the ytterbium europium oxide to obtain first powders; adding the first powders into a stirring container filled with deionized water and stirring to obtain first slurries; cleaning the first slurries with the deionized water, sieving, and removing clear liquids after precipitating to obtain second slurries; adding the urea solution into the second slurries and stirring to obtain first mixtures; standing and precipitating the first mixtures, then pouring and removing the clear liquids to obtain second mixtures; dehydrating and drying the second mixtures, and sieving to obtain to-be-baked raw materials; putting the to-be-baked raw materials into the container and conveying into furnaces to bake, taking out of the furnaces and cooling to obtain the finished products. Lattices are completer; particles are more uniform; surface coating effects are excellent; heat stability is ideal; radiation resistance and aging resistance are excellent.
Owner:英特美光电(苏州)有限公司

LED (light-emitting diode) fluorescent powder with broadband gradient and preparation method thereof

The invention provides an LED (light-emitting diode) fluorescent powder with broadband gradient and a preparation method thereof. A single particle of the fluorescent powder sequentially comprises more than three layers of fluorescent materials with the same crystal structure and different chemical components from inside to outside. According to the preparation method, a microwave heating-homogeneous precipitation technology is adopted for preparing several pure phase micro nanoscale or nanoscale fluorescent powders with the same crystal structure and different components, and then the micro-sized fluorescent powder grain is taken as a seed crystal, the micro-sized fluorescent powder grain is mixed with the pure phase micro nanoscale or nanoscale fluorescent powder, epitaxial growth is conducted sequentially step by step at high temperature, or the micro-sized fluorescent power grain is taken as a seed crystal, a mononuclear multilayered shell structure precursor with the same crystal structure and different components is formed through liquid phase coprecipitation, epitaxial growth is conducted sequentially step by step at high temperature, and then the LED fluorescent powder with broadband gradient is obtained through grinding. The LED fluorescent powder with broadband gradient has a special structure and components, good dispersibility, high bulk density, strong scattering intensity, and high luminous efficiency.
Owner:HUNAN SCI & TECH RES & DEV CENT
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