Lead accumulator epoxy resin sealant and preparation method thereof
A technology of epoxy resin and lead storage battery, which is applied in the direction of epoxy resin glue, battery pack parts, circuits, etc., which can solve the problems of low qualified rate of finished products, inability to meet the mass production of new lead storage batteries, and high price, etc. Good, moderate price, excellent heat resistance effect
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Embodiment 1
[0059] 1. The preparation method of component A glue includes:
[0060] 1. Heat 70Kg of bisphenol A epoxy resin (E-51) according to the proportion by mass and pump it into the reactor. Agent butyl glycidyl ether (BGE) 3Kg and polyurethane (K-770) (hydroxyl value 0.4) 5Kg are mixed and dripped into the kettle. A value of zero means the reaction is complete.
[0061] II. Cool the above reactant to 50°C, add reactive diluent o-cresol glycidyl ether (X-691) 8Kg, bisphenol F epoxy resin (F-51) 10Kg, defoamer organic Silicon 0.1Kg and coupling agent silane 0.1Kg, after stirring for 1 hour, filter and package to prepare A component glue.
[0062] 2. Preparation method of component B glue
[0063] Component B glue is prepared by synthesis of aniline formaldehyde resin and curing modification at room temperature.
[0064] Aniline-formaldehyde resin is obtained by polycondensation of aniline and polyoxymethylene at a ratio of 400:70-76 (mass parts), using formic acid as a catalyst, ...
Embodiment 2
[0068] 1. The preparation method of component A glue includes:
[0069] 1. Heat 75Kg of bisphenol A epoxy resin (E-51) according to the proportion by mass and pump it into the reactor. The temperature is controlled at 72°C and protected with nitrogen. Agent butyl glycidyl ether (BGE) 4Kg and polyurethane (K-770) 6Kg, the hydroxyl value is 0.4, mixed and dropped into the kettle, the temperature is controlled at 70 ° C, after the dripping, keep warm for 5 hours, and the color is transparent for sampling inspection. The hydroxyl value is zero, which means the reaction is complete.
[0070] II. Cool the above reactants to 50°C, add reactive diluent o-cresol glycidyl ether (X-691) 10Kg, bisphenol F epoxy resin (F-51) 12Kg, defoamer silicon Oxyethane 0.1Kg and coupling agent carbonate 0.1Kg, stirred for 1.2 hours, filtered and packaged to prepare component A glue.
[0071] 2. Preparation method of component B glue
[0072] Component B glue is prepared by synthesis of aniline form...
Embodiment 3
[0077] 1. The preparation method of component A glue includes:
[0078] 1. Heat 80Kg of bisphenol A epoxy resin (E-51) according to the proportion by mass and pump it into the reactor. The temperature is controlled at 75°C and protected with nitrogen. Agent butyl glycidyl ether (BGE) 5Kg and polyurethane (K-770) 8Kg, the hydroxyl value is 0.4, mixed and dropped into the kettle, the temperature is controlled at 72 ° C, kept warm for 6 hours after the drop, the color is transparent for sampling inspection, The hydroxyl value is zero, which means the reaction is complete.
[0079] II. Cool the above reactant to 50°C, add reactive diluent o-cresol glycidyl ether (X-691) 12Kg, bisphenol F epoxy resin (F-51) 15Kg, defoamer organic Silicone 80Kg and coupling agent silane 80Kg, after stirring for 1.5 hours, filter and package to obtain component A glue.
[0080] 2. Preparation method of component B glue
[0081] Component B glue is prepared by synthesis of aniline formaldehyde resi...
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