Modified epoxy resin adhesive used under low temperature

An epoxy resin and adhesive technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of high thermal expansion coefficient, low glass transition temperature, poor impact toughness, etc., to improve mechanical properties, room temperature impact The effect of improving strength and tensile strength and reducing thermal expansion coefficient

Inactive Publication Date: 2005-09-21
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to overcome the defects of low tensile strength, poor impact toughness, low glass transition temperature and high thermal expansion coefficient of existing epoxy resin low temperature adhesives at low temperature, thereby providing a kind of adhesive with higher low temperature tensile strength. Modified epoxy resin adhesive for low temperature with tensile strength, better impact toughness, higher glass transition temperature and lower thermal expansion coefficient

Method used

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  • Modified epoxy resin adhesive used under low temperature
  • Modified epoxy resin adhesive used under low temperature
  • Modified epoxy resin adhesive used under low temperature

Examples

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Effect test

Embodiment 1

[0026] Embodiment 1, preparation of the introduction of 2wt% SiO of the present invention 2 Modified Epoxy Adhesives for Low Temperatures

[0027] Weigh 39.2 g of bisphenol F epoxy resin (viscosity 3000 cP.s, epoxy equivalent 160 g / mol), measure 40 ml of acetone, and dissolve bisphenol F epoxy resin in acetone. After stirring for 3-5 minutes, 4.2 ml of 25% ammonia water was added dropwise to the above solution, and after the stirring state was maintained for 10 minutes, 5.8 g of tetraethyl orthosilicate (TEOS) was slowly added dropwise to the above solution. After the dropwise addition, stir at a speed of 1000 rpm for 4 hours, and then use vacuum degassing to remove organic solvents, excess precursors or catalysts, and by-products generated during the reaction to obtain viscous liquid modified epoxy resins. Resin, namely component A;

[0028] From 50 parts by weight of the above component A, 18 parts by weight of component C—2,4-diethyl-5-methyl-1,3-phenylenediamine and 50 p...

Embodiment 2

[0032] Embodiment 2, preparation of introducing 4wt% SiO of the present invention 2 Modified Epoxy Adhesives for Low Temperatures

[0033] Weigh 39.2 g of bisphenol F epoxy resin (viscosity 5000 cP.s, epoxy equivalent 180 g / mol), measure 40 ml of acetone, and dissolve bisphenol F epoxy resin in acetone. After stirring for 3 to 5 minutes, 8.4 ml of 25% ammonia water was added dropwise to the above solution, and after maintaining the stirring state for 10 minutes, 11.6 g of tetraethyl orthosilicate (TEOS) was slowly added dropwise to the above solution. After the dropwise addition, stir at a speed of 3000 rpm for 1 hour, and then use vacuum degassing to remove organic solvents, excess precursors or catalysts, and by-products generated during the reaction to obtain viscous liquid modified epoxy resins. Resin, namely component A;

[0034] By the above-mentioned component A, 15.7g component C and 26.1g component B (same as component B and C in embodiment 1) form the introduction ...

Embodiment 3

[0038] Embodiment 3, preparation of introducing 3wt% SiO of the present invention 2 Modified Epoxy Adhesives for Low Temperatures

[0039] Weigh 54g of bisphenol F epoxy resin (viscosity 3000cP.s, epoxy equivalent 170g / mol), measure 40ml of acetone, and dissolve bisphenol F epoxy resin in acetone. After stirring for 3 to 5 minutes, 6.3 ml of 25% ammonia water was added dropwise to the above solution, and after maintaining the stirring state for 10 minutes, 8.7 g of tetraethyl orthosilicate (TEOS) was slowly added dropwise to the above solution. After the dropwise addition, stir at a speed of 2000 rpm for 2 hours, and then use vacuum degassing to remove organic solvents, excess precursors or catalysts, and by-products generated during the reaction to obtain viscous liquid modified epoxy resins. Resin, namely component A;

[0040] By the above-mentioned component A, 13.5g component B and 13.5g component C (same as component B and C in embodiment 1) form the introduction 3wt% S...

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Abstract

The invention relates to a modified epoxide resin adhesive agent used in low temperature and comprises in the weight proportion of modified epoxide resin of 50-80 shares, toughening agent of 50-20 shears and curing agent of 18-24 shears. The said modified epoxide resin is produced using TEOS as a precursor and original position introducing inorganic earth silicon particles in the weight proportion of 2-4 wt% in the bisphenol F epoxide resin by a sol-gel processing. The said toughening agent is low molecular weight epoxide resin, and the said curing agent is liquid aromaticamine. When it is used, mixing the said components homogeneously, spreading on the adhered substance by a vacuum pressure impregnation technology or directly, holding the temperature of 70-80 Deg. C for 24 h, then heating to the temperature of 130-140 Deg. C and holding for 12 h to make the adhesive agent cure completely. The said adhesive agent can be used in the temperature of -269-50 Deg. C and has higher tensile strength in low temperature, better impact flexibility, higher glass transition temperature and lower thermal-expansion coefficient.

Description

technical field [0001] The invention relates to an adhesive, in particular to a modified epoxy resin adhesive for low temperature. technical background [0002] Epoxy resins have excellent mechanical, thermal and electrical insulating properties. The commonly used adhesive is to use bisphenol F epoxy resin, low molecular weight epoxy resin as a toughening agent and liquid aromatic diamine as a curing agent. The reaction mechanism is as follows: [0003] The molecular structure of bisphenol F epoxy resin is as follows: [0004] [0005] Formula I [0006] The equation of reaction between bisphenol F epoxy resin and curing agent is: [0007] [0008] [0009] The toughening agent is a low molecular weight epoxy resin, which is similar to the curing agent and also undergoes a curing reaction with the bisphenol F epoxy resin. After the curing reaction, the bisphenol F epoxy resin forms a cured epoxy resin with a cross-link...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00
Inventor 付绍云黄传军张以河潘勤彦
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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