Epoxy molding compound and preparation method thereof

An epoxy molding compound and epoxy technology, applied in the field of integrated circuit packaging, can solve the problems of unsatisfactory thermal properties, mechanical properties and electrical properties of epoxy molding compounds

Active Publication Date: 2015-06-03
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the thermal, mechanical and electrical pr

Method used

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  • Epoxy molding compound and preparation method thereof
  • Epoxy molding compound and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0037] Example 1

[0038] The purpose of this example is to study the influence of the amount of fused silicon micropowder on the thermal, mechanical, electrical and other properties of EMC. That is, 5% (mass percentage) of coupling agent solution was used to couple and modify the molten silicon micropowder that was ball-milled for 24h (2μm) (the silicon micropowder with an average particle size of 2μm obtained after ball-milling for 24h). The linear expansion coefficient, thermal conductivity, flexural strength, elastic modulus, dielectric constant and dielectric loss of EMC of the amount of silicon micro-powder.

[0039]

[0040] Electronic analytical balance; JJ-3 constant temperature electric stirrer; DK-8B type electric heating constant temperature water tank; KQ5200DE type numerical control ultrasonic cleaner; NP-C-20-1500 in-line ultrasonic disperser; DZF-6020 vacuum drying oven.

[0041] Experimental steps:

[0042] 1. Weigh a certain amount of silicon micropowder...

Example Embodiment

[0057] Example 2

[0058] The purpose of this example is to study the effect of the particle size of the fused silica micropowder on the thermal and mechanical properties of EMC. That is, 5% coupling agent solution was used to couple and modify the molten silicon micropowder ball milled for 16h, 24h, 30h, 38h, 48h, and the linear expansion coefficient, flexural strength, elastic modulus of EMC with an addition amount of 50% were tested. quantity.

[0059] Experimental materials and procedures:

[0060] Except that the addition amount of molten silicon micropowder is fixed at 50%, the rest is the same as that in Example 1.

[0061] Experimental results and discussion:

[0062] Table 2 Influence of particle size of fused silica micropowder on thermal and mechanical properties of EMC

[0063] Silica powder particle size (μm)

[0064] no filler

[0065] In terms of thermal properties, it can be seen from Table 2 that under the same addition amount of 50%, t...

Example Embodiment

[0068] Example 3

[0069] The purpose of this example is to study the influence of different types of silicon micropowder on the EMC linear expansion coefficient. That is, 5% coupling agent solution is used to couple and modify kaolin tailings silicon micropowder, high-purity crystalline silicon powder, molten silicon micropowder, and silicon micropowder after secondary firing, and the test dosage is 60%. When the EMC coefficient of linear expansion and thermal conductivity.

[0070] Experimental materials and procedures

[0071] Except that the addition amount of various types of silicon micropowder is fixed at 60%, the others are the same as in Example 1.

[0072] Experimental Results and Discussion

[0073] Table 3 Effects of different silicon micropowders on EMC linear expansion coefficient and thermal conductivity

[0074] Types of microsilica

[0075] Silicon powder after secondary firing (10μm)

[0076] It can be seen from Table 3 that the effect...

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Abstract

The invention discloses an epoxy molding compound and a preparation method thereof. The epoxy molding compound comprises the following components: epoxy resin, a coupling agent, a curing agent, a curing accelerator and filler, wherein the epoxy resin is o-cresol formaldehyde epoxy resin (ECN); a diluent is an epoxyactive diluent; the coupling agent is a silane coupling reagent; the curing agent is a latent curing agent; the curing accelerator is a latent curing accelerator; and the filler is silica powder. The thermal property, the mechanical property, the electric property and the like of the epoxy molding compound reach a balanced and relatively good level and can meet the requirements of the modern microelectronics packaging technology.

Description

【Technical field】 [0001] The invention relates to the field of integrated circuit packaging, in particular to an epoxy molding compound and a preparation method thereof. 【Background technique】 [0002] In the 1950s, with the rapid development of semiconductor devices and integrated circuits, packaging such as ceramics, metals, and glass was difficult to meet the requirements of industrialization, and the cost was high. People wanted to use plastics to replace the above packages. The United States first started research in this area, and then spread to Japan. By 1962, plastic packaged transistors had begun to take shape in the industry. Companies such as Japan and the United States continue to select raw materials and production processes, and finally determine the epoxy molding compound processed with o-cresol epoxy resin as the main material. At present, the main manufacturers of epoxy molding compound in the world include Nitto Denko, Sumitomo Bakelite (including Singapor...

Claims

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Application Information

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IPC IPC(8): C08L63/04C08K9/06C08K3/36
Inventor 张双庆刘萍
Owner GUANGDONG DANBOND TECH
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