Semiconductor encapsulating epoxy resin composition and semiconductor device

A technology of epoxy resin and composition, applied in the direction of semiconductor devices, semiconductor/solid device parts, electric solid devices, etc., can solve the problems of low elastic modulus, low glass transition temperature, low expansion rate, etc., and achieve high Good glass transition temperature, good moisture resistance reliability, and small coefficient of linear expansion

A technology of epoxy resin and composition, applied in the direction of semiconductor devices, semiconductor/solid device parts, electric solid devices, etc., can solve the problems of low elastic modulus, low glass transition temperature, low expansion rate, etc., and achieve high Good glass transition temperature, good moisture resistance reliability, and small coefficient of linear expansion

CN1854186AActive Publication Date: 2006-11-01SHIN ETSU CHEM CO LTD
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  • Semiconductor encapsulating epoxy resin composition and semiconductor device
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
  • Semiconductor encapsulating epoxy resin composition and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0093] "Examples 1-6, Comparative Examples 1-4"

[0094] The components shown in Table 2 were melt-mixed with a hot twin-roller until uniform, cooled, and pulverized to obtain an epoxy resin composition for semiconductor sealing. The raw materials used are as follows.

[0095] (epoxy resin)

[0096] Among the epoxy resins in the above formula (1), for the following structure epoxy resins (i) to (iii) with different values ​​of m and n, according to their compounding ratio, the epoxy resins (1) to (4) and (5) biphenyl aralkyl type epoxy resin (NC3000: trade name manufactured by Nippon Kayaku Co., Ltd.).

[0097] 【chemical 15】

[0098] For G express.

[0099] Epoxy resin (i) (m=0, n=0)

[0100] 【Chemical 16】

[0101]

[0102] Epoxy resin (ii) (m=1 and n=0, m=0 and n=1)

[0103] 【Chemical 17】

[0104]

[0105] Epoxy resin (iii) (m=1, n=1)

[0106] 【chemical 18】

[0107]

[0108] Epoxy Resin Mixing Ratio

(i)

(ii)

(iii)

Epoxy ...

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Abstract

The present invention provides an epoxy resin composition, which is characterized in that it contains: (A) a naphthalene type epoxy resin represented by the following general formula (1), (m, n represent 0 or 1, R represents a hydrogen atom , an alkyl or phenyl group with 1 to 4 carbon atoms, G represents an organic group containing a glycidyl group, but in 100 parts by mass of the above general formula (1), the compound containing m=0 and n=0 is 35~ 85 mass parts, m=1, n=1 compound is 1 to 35 mass parts); (B) a phenolic resin curing agent having at least one substituted or unsubstituted naphthalene ring in one molecule; (C) inorganic matter filling agent and (D) at least one compound selected from rare earth oxides or hydrotalcite compounds. The epoxy resin composition of the present invention has good fluidity, small coefficient of linear expansion, high glass transition temperature, low hygroscopicity, and excellent lead-free solder crack resistance.

Description

technical field [0001] The present invention relates to an epoxy resin for encapsulating semiconductors having good fluidity, low coefficient of linear expansion, high glass transition temperature, low hygroscopicity, crackability of lead-free solder, heat-resistant reliability, and moisture-resistant reliability A composition and a semiconductor device sealed with a cured product of the resin composition. Background technique [0002] Previously, semiconductor devices were dominated by resin-sealed diodes, transistors, ICs, LSIs, and super-LSIs. Compared with other thermosetting resins, epoxy resins have lower etc. are excellent, so epoxy resin compositions are generally used to seal semiconductor devices. However, in recent years, along with the miniaturization, weight reduction, and high-performance market development of electronic equipment, the high integration of semiconductor elements has progressed further. In promoting the mounting technology of semiconductor devic...

Claims

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Application Information

Patent Timeline
01 Nov 2006
Publication
CN1854186A
IPC
C08L63/00; C09K3/10; H01L23/28
CPC
C08G59/245; C08G59/621; C08K3/22; C08K3/26; H01L23/293; H01L23/295; H01L2924/0002; C08L63/00
Inventors
长田将一; 木村靖夫