Modified epoxy adhesive for stone combination and preparation method thereof

An epoxy adhesive and composite modification technology, which is applied in the direction of adhesive, epoxy glue, adhesive type, etc., can solve the problems of high energy consumption, low production efficiency, large production site, etc., and achieve good activity and adaptability Strong, simple preparation process

Active Publication Date: 2012-11-21
HUNAN KOSEN NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The adhesive used for stone compounding was originally unsaturated polyester resin, but it is gradually replaced by epoxy adhesive. The mechanical properties of the composite board are relatively ideal. The disadvantage is that the surface material and The substrate is fully baked and dried, with high energy consumption, large production site and low production efficiency
The current adhesives can't completely solve the requirements of compounding under wet conditions, and there is still a need for improvement

Method used

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  • Modified epoxy adhesive for stone combination and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1. The reactor is equipped with a stirring, regulating and condensing device. The condensing device is equipped with 100 parts by mass of calcium oxide water-absorbing agent in the lower part; 80 parts by mass of butanone, 100 parts by mass of diethylenetriamine, and strong acidic cation exchange resin SO 4 2 / TiO2 0.4 mass part, V85-P antioxidant 0.3 mass part, start stirring, raise the temperature to 60°C, then raise the temperature to 74°C within 30 minutes, keep the temperature at 74°C for 60 minutes, and then raise the temperature to 10°C in 15 minutes The speed was raised to 105° C., the temperature was kept for 30 minutes, and the temperature was lowered to 30° C., and the product was filtered through a 200-mesh sieve to obtain the light yellow liquid ketimine of the present invention.

[0026] 2. Add 100 parts by mass of nonylphenol glycidyl ether into a reactor with a stirring, tempering and reflux device, start stirring, and then add 25 parts by mass of diethy...

Embodiment 2

[0032]When preparing ketimine, butanone is 75 parts by mass, and the rest are the same as in Example 1; when preparing modified aliphatic amines, diethylenetriamine is 55 parts by mass, and the rest are the same as in Example 1; when preparing component A of the present invention When, epoxy resin E51 is 15 mass parts, F-51 4 mass parts, barite powder 34 mass parts, other conditions are the same as embodiment 1; When preparing the second component of the present invention, modified fatty amine is 13 mass parts, and first Cyclopentanediamine is 8 parts by mass, and the curing accelerator is changed into N, N-dimethyldipropylenetriamine 1.0 parts by mass, and other conditions are the same as in Example 1.

[0033] Weigh 10 parts by mass of component A and 3.3 parts by mass of component B, and mix them uniformly to obtain the stone composite modified epoxy adhesive of the present invention.

[0034] Product World JC / T "Ultra-thin Natural Stone Composite Board" test physical per...

Embodiment 3

[0037] When preparing ketimine, butanone is 88 parts by mass, and the remaining conditions are the same as in Example 1; when preparing modified fatty amines, diethylenetriamine is 42 parts by mass, and the remaining conditions are the same as in Example 1; to prepare Group A of the present invention 2 parts, bisphenol F epoxy resin F-51 is 3 parts by mass; Butyl glycidyl ether is 7 parts by mass, and wetting agent is 0.1 parts by mass of CA-165, and other conditions are with embodiment 1.

[0038] When preparing component B of the present invention, 18 parts by mass of modified aliphatic amine, 2 parts by mass of ketimine, and 5 parts by mass of methylcyclopentadiamine, and other conditions are the same as in Example 1.

[0039] Weigh 10 parts by mass of component A and 4.2 parts by mass of component B, and mix them uniformly to prepare the stone composite modified epoxy adhesive of the present invention. According to JC / T 1049-2007 "Ultra-thin Natural Stone Composite Board",...

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Abstract

The invention relates to a two-component modified epoxy adhesive for stone combination and a preparation method thereof, which is characterized in that an A component is prepared by bisphenol A epoxy resin, bisphenol F epoxy resin, an active diluent, a bisphenol A, an anti-yellowing additive, a wetting agent, and inorganic powder, and a B component is prepared by self-made ketoimine, nonyl phenolglycidyl ether modified aliphatic amine, alicyclic amine, a coupling agent, a wetting agent, and a curing accelerator; the A and B components are mixed and used according to a mass ratio of 10:2.5-5.In the ketoimine preparation, the mass ratio of butanone to diethylenetriamine is 70-90:100; in the modified aliphatic amine preparation, the mass ratio of nonyl phenol glycidyl ether to diethylenetriamine is 100:21-32; the two-component modified epoxy adhesive for stone combination has the characteristics of good curing performance, and low cost.

Description

[0001] technical field [0002] The invention relates to a modified epoxy adhesive for stone composite and a preparation method thereof, in particular to a stone composite adhesive with lower cost used under humid conditions and a preparation method thereof. Background technique [0003] Stone has been used for building decoration for a long time. Human progress developed to the 1980s, and the composite facing materials with precious natural stone as the surface and denser sheets such as granite and porcelain plates as the base gradually developed relying on high-strength adhesives and high-speed stone slicing technology. stand up. This product reduces the thickness of precious stones from 15-30mm to 3-5mm, saving resources and reducing costs. Due to the high strength of the substrate and the reinforcement of the adhesive, the overall strength of the composite board is greatly improved, which expands the scope of use and improves the service life; the overall thickness ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/04C08G59/50
Inventor 柳雄策沈定忠郑保昌钟雪琴
Owner HUNAN KOSEN NEW MATERIAL
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