Lead-free environmental-friendly circuit board conductive silver paste and preparation method thereof

Abstract

The invention provides a kind of lead-free environmental-friendly circuit board conductive silver paste, which is prepared by the following raw material by weights: 60 to 70 of silver powder of 20 to 30mum, 5 to 8 of copper powder of 1 to 10nm, 8 to 10 of glass powder, 5 to 7 of SnO2 powder, 5 to 8 of silver powder of 40 to 60nm, 2 to 4 of pentaerythritol tristearate, 4 to 6 of isophorone, 3 to 5 of saturated polyester resin EK410, 4 to 7 of bisphenol F epoxy resin, 1 to 2 of salicylic acid, 3 to 5 of polyurethane resin, 1 to 2 of triallyl isocyanurate, 1 to 2 of microsphere starch, 1 to 2 of fumed silica, 4 to 6 of isobutyl ketone, 6 to 8 of ethanol , 2 to 4 of butanol, and 6 to 8 of butyl acetate. The lead-free environmental-friendly circuit board conductive silver paste and the preparation method thereof are characterized in that the use amount of the silver powder is small, the printing performance is good, the yield of the circuit board is high, the conductive performance is good, lead-free environmental-friendly performance is provided, the technology is simple, the operation is convenient and easy, and the product performance is convenient to control.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a conductive silver paste for a lead-free environment-friendly circuit board and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance