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Manufacturing method for curved surface film circuit based on 3D printing technology

A 3D printing and thin-film circuit technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve problems such as retention, and achieve the effects of low cost, controllable production cost, and high precision

Active Publication Date: 2016-03-30
INST OF DONGGUAN TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, thin-film circuits are all on a plane in terms of process production, that is, only planar thin-film circuits can be developed and produced; for example, in the announcement number: CN103579107A, the Chinese patent "A Method for Cutting Thin-Film Circuits Based on Mask Electroplating" ", the manufacturing method of the planar thin film circuit still stays in the engraved scribing process method, which can only be applied to the planar thin film circuit; if the manufacturing method of the curved surface thin film circuit can be realized in a real sense and can be achieved at low cost The mass production of is an issue that needs to be studied

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A method for manufacturing a curved surface thin film circuit based on 3D printing technology described in this embodiment includes the following steps:

[0033] a. Set the base metal film, and set the base metal film on the curved surface structure; specifically, a thin film deposition layer can be deposited on the substrate through a thin film deposition process. The film deposition methods used in the deposition process include sputtering, Evaporation and chemical vapor deposition. In this embodiment, in order to obtain better uniformity, magnetron sputtering is used for coating.

[0034] B, coat photoresist, spin coat photoresist on the metal film that obtains in a step;

[0035] c. Use a 3D printer to print out a mask plate with a circuit microstructure; a curved mask plate can be produced according to actual needs.

[0036] d. Exposure, placing the mask plate on the curved surface structural member coated with photoresist for exposure treatment, and obtaining th...

Embodiment 2

[0051] The difference between the manufacturing method of a curved thin film circuit based on 3D printing technology described in this embodiment and the first embodiment is that after step f is completed, steps a to f are repeated to manufacture a multilayer curved thin film circuit structure. Utilizing the repeatability of the method in Example 1, the fabrication of multi-layer curved thin film circuits can be realized, which is not only possible, but also has high precision, and the microcircuit structure of each layer can be adjusted at any time before fabrication.

[0052] Likewise, this embodiment still possesses the advantages of Embodiment 1.

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Abstract

The invention discloses a manufacturing method for a curved surface film circuit based on 3D printing technology. The manufacturing method comprises steps of a, arranging a matrix metal film, arranging a matrix metallic film on a curved surface structure, b, coating photoresist, performing spinning coating of the photoresist on the metal film obtained in the step a, c printing out a masking film board with a circuit microstructure through a 3D printer, d exposing, d performing exposure processing by arranging the masking film board on the curved surface coated with the photoresist, and obtaining the curved surface structure after exposure, e developing images, arranging the curved surface structure in the step d in a developing agent for image development and obtaining the curved surface structure after image development, and f corroding, using a corrodent to corrode the curved surface structure obtained from the step 4 after the masking film board is taken off. The invention can realize the film circuit manufacture in a real sense; the cost is low and the batch production can be realized; and the accuracy is high and the realized curved surface film circuit can be in any curved surface shape.

Description

technical field [0001] The invention relates to the field of thin film circuit manufacturing, in particular to a method for manufacturing curved thin film circuits based on 3D printing technology. Background technique [0002] Thin-film circuit is to use metals, semiconductors, metal oxides, mixed phases of various metals, and alloys with a thickness below the micron level for the transistors, diodes, resistors, capacitors, inductors and other components of the entire circuit, as well as the interconnection leads between them. Or insulating dielectric film, and integrated circuits made by vacuum evaporation, sputtering and electroplating. At present, thin-film circuits are all on a plane in terms of process manufacturing, that is, only planar thin-film circuits can be developed and produced; for example, in the announcement number: CN103579107A, the Chinese patent "A Method for Cutting Thin-Film Circuits Based on Mask Electroplating" ", the production method of the planar t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/70H01L21/027H01L21/02
CPCH01L21/02071H01L21/0274H01L21/707
Inventor 李宏强张月新魏泽勇谢乐乐
Owner INST OF DONGGUAN TONGJI UNIV
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