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Lotus-type regular porous metal microchannel heat sink using liquid metal working medium

A technology of liquid metal and porous metal, applied in cooling/ventilation/heating transformation, semiconductor/solid-state device components, lasers, etc., can solve problems such as difficult processing, large pressure drop at import and export, complex structure, etc., and achieve a wide range of applications , The effect of small pressure drop at the inlet and outlet, and small size

Inactive Publication Date: 2013-07-03
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The object of the present invention is to provide a microchannel heat sink for high heat flux electronic components and semiconductor lasers, which solves the problems of existing microchannel heat sinks, such as large pressure drop at the inlet and outlet, complex structure, and difficult processing, and can achieve Higher cooling efficiency

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  • Lotus-type regular porous metal microchannel heat sink using liquid metal working medium
  • Lotus-type regular porous metal microchannel heat sink using liquid metal working medium
  • Lotus-type regular porous metal microchannel heat sink using liquid metal working medium

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Embodiment Construction

[0036] Below in conjunction with accompanying drawing, the patent of the present invention is further described.

[0037] Such as figure 1 As shown, the electromagnetic pump 6, the liquid storage tank 7, and the microchannel module 3 are connected by pipelines to form a closed path, and the surface of the microchannel module 3 is connected to the copper cover plate 2 by diffusion welding, and is in contact with the chip 1 using thermal conductive silicone grease. To dissipate heat from the chip 1, the working medium liquid metal passes through the microchannel module 3 to take away the heat from the chip 1. The chip 1 can be a high heat flux electronic component chip or a semiconductor laser heating element, and flows to the liquid storage tank through the outlet 5 7. For remote heat dissipation, a cooling plate can be installed inside the liquid storage tank 7 to facilitate heat dissipation. The working medium flows through the liquid storage tank 7 and then enters the electr...

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Abstract

The invention discloses a lotus-type regular porous metal microchannel heat sink using a liquid metal working medium for an electronic component with high heating flux or a semiconductor laser, and belongs to a heat-dissipation device of a microelectronic device. The lotus-type regular porous metal microchannel heat sink solves the problems that inlet and outlet pressure drop is high, a structure is complicated, the processing is difficult, and the cost is high in the existing microchannel heat sink, and an excellent heat-dissipation effect can be obtained. The lotus-type regular porous metal microchannel heat sink is characterized in that a microchannel module 3, a micro pump 6 and a far-end heat-dissipation device 7 are connected by pipelines to form a closed circuit, wherein the core of the microchannel module is a porous material formed in a manner that cylindrical air holes obtained by a metal-gas eutectic directional solidification method are directionally arranged in a metal matrix, and the liquid working medium is low-melting-point liquid metal or an alloy. The lotus-type regular porous metal microchannel heat sink is simple in structure, simple and convenient in manufacturing technology, convenient to mount, small in inlet and outlet pressure drop, and high in heat-dissipation efficiency, and is suitable for the electronic component with the high heating flux or a laser diode arrayed heat-dissipation device.

Description

technical field [0001] The invention relates to a microchannel heat dissipation device for high heat flux density electronic components or semiconductor lasers, in particular to a lotus-shaped regular porous metal microchannel heat dissipation device using liquid metal working fluid. Background technique [0002] In recent years, the thermal barrier problem caused by highly integrated computer chips and optoelectronic devices has become one of the important problems and technical bottlenecks restricting their development. How to efficiently and safely dissipate heat from chips has become one of the important topics in the research of electronic devices. one. [0003] In 1971, Intel Corporation launched the world's first microprocessor 4004, which has an integration level of 2300 transistors. Until 2004, Intel Corporation launched 64-bit processors Madison 9M and Deerfield, and its integration level has exceeded 500 million units. The feature size of the CPU was reduced from...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/36H01S5/024
Inventor 刘源陈海锋
Owner TSINGHUA UNIV
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