Low-resistance enhanced heat transfer structure based on nanometer super-wetting interface

Abstract

The invention discloses a low-resistance enhanced heat transfer structure based on a nanometer super-wetting interface. The low-resistance enhanced heat transfer structure comprises a lower embedded microchannel layer and an upper manifold channel layer, wherein embedded microchannels are perpendicular to manifold channels; the lower embedded microchannel layer consists of a plurality of embeddedmicrochannel units; the cross section of each embedded microchannel of each unit is a rectangular divergent cross section along the flowing direction of a cooling working medium; the shape of each embedded microchannel of each unit is isosceles trapezoid; the upper manifold channel layer is composed of the S-shaped manifold channels; and two adjacent S-shaped manifold channels form inlets and outlets of the manifold channels. According to the low-resistance enhanced heat transfer structure, a microchannel radiator is constructed by utilizing a layered flow structure, the heat transfer characteristic and the resistance characteristic can be simultaneously improved by combining the microchannel radiator with the nano super-wetting interface and the divergent microchannel section, and the low-resistance enhanced heat exchange of the microchannel radiator is achieved under the condition of higher heat dissipation efficiency.

Description

technical field [0001] The invention belongs to the field of microelectronic device systems, and in particular relates to a low-resistance enhanced heat transfer structure based on a nanometer super-wetting interface. Background technique [0002] With the development of microelectronics technology and the improvement of chip integration, the requirements of electronic devices are becoming more and more stringent, the feature size is getting smaller and smaller, and the performance is gradually improving. The rapid development of microelectronic device systems and aerospace technology has led to the rapid development of micro-scale technology, and the emergence of ultra-large-scale integrated circuits. At the same time, the scale of devices has been further reduced, resulting in a rapid increase in the heat generation of chips on integrated circuits. The heat flux of the chip in the integrated circuit is increased to 10 7 W / m 2 , and the heat flux continues to increase. T...

AI Technical Summary

Problems solved by technology

However, while having high heat dissipation efficiency, it brings relatively high flow resistance and requires large power consumption

Images