Packaging die and packaging method thereof

Abstract

The invention relates to a packaging die and a packaging method. The die is used for packaging a memory card and comprises an upper die and a lower die. The upper die comprises an upper die plate and an upper die core fixed on the upper die plate. The lower die comprises a lower die core, a lower die holder, an injection device and a lower bottom plate. The lower die core is fixed on the lower die holder. The injection device and the lower die holder are arranged on the lower bottom plate. The lower die core is provided with a plurality of sleeves for placing resin material cakes. The positions on the upper die core corresponding to the sleeves are provided with runners. The injection device comprises a plurality of adhesive extruding rods with adhesive extruding heads and an adhesive extruding seat for installing the adhesive extruding rods. The adhesive extruding heads are in fit with the sleeves. The method uses the die to package the memory card. The packaging die of the inventionadopts a plurality of material barrels and a plurality of adhesive extruding rods matched with the material barrels, shortens the length of the runners of the die and avoids conditions that the resingenerates bubbles, pores, is not full filled and the like in the flowing process.

Description

technical field [0001] The invention relates to a packaging mold and a packaging method, more specifically, to a packaging mold and a packaging method for packaging a memory card. Background technique [0002] Memory cards such as ultra-thin USB memory cards, Micro SD cards and RS-MMC (Multi Media Card) cards are generally packaged with single-head packaging molds. This single-head packaging mold is usually called a single-cylinder mold, which has the advantages of large packaging batches and simple packaging forms. But this kind of mold also has its inherent disadvantages. It has only one barrel, and the resin flows from the center of the mold to the cavity through the runner. Since this kind of mold generally has multiple mold boxes, such as 4 to 8 mold boxes, the resin is produced In the process of filling the cavity from near to far, it will change from a viscous flow state to a glass state, and the flow performance will gradually deteriorate. The cavity pressure loss a...

AI Technical Summary

Problems solved by technology

But this kind of mold also has its inherent disadvantages. It has only one barrel, and the resin flows from the center of the mold to the cavity through the runner. Since this kind of mold generally has multiple mold boxes, such as 4 to 8 mold boxes, the resin is produced In the process of filling the cavity from near to far, it will change from a viscous flow state to a glass state, and the flow performance will gradually deteriorate. The cavity pressure loss at the end of the runner is large, and the resin molding conditions in the cavity are relatively harsh. Products far away from the barrel are prone to air bubbles, pores, insufficient filling, and gold wire bending rate exceeding the standard, and the adjustment range of the mold forming process is narrow

In addition, because the runner is too long, the utilization rate of the resin will be low, and the production cost will increase

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