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A low-resistance enhanced heat transfer structure based on nano-superwetting interface

A technology to strengthen heat transfer and interface, which is applied in the direction of modification by conduction heat transfer, indirect heat exchanger, heat exchanger type, etc., can solve the problems of high flow resistance, high power consumption, etc. The critical heat flux density and the effect of improving the surface heat transfer coefficient

Active Publication Date: 2021-02-09
CHINA ACADEMY OF SPACE TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, while having high heat dissipation efficiency, it brings relatively high flow resistance and requires large power consumption

Method used

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  • A low-resistance enhanced heat transfer structure based on nano-superwetting interface
  • A low-resistance enhanced heat transfer structure based on nano-superwetting interface
  • A low-resistance enhanced heat transfer structure based on nano-superwetting interface

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Embodiment Construction

[0029] The present invention will be further described below in conjunction with the accompanying drawings.

[0030] The significant increase in the specific surface area brought about by the tiny channels can greatly enhance the single-phase and two-phase convective heat transfer capabilities, but at the same time it will also generate greater flow resistance, and the contradiction between heat transfer enhancement and resistance increase has not been effectively resolved. In addition, interfacial wettability refers to the wetting of solids by liquids and is an important feature of solid surfaces. As an important factor affecting boiling heat transfer, interfacial wettability has been a hot spot in boiling heat transfer enhancement technology for many years. The interface wettability has different effects on boiling heat transfer: on the one hand, the hydrophilic surface can significantly increase the critical heat flux; on the other hand, the hydrophobicity can significantly...

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Abstract

The invention discloses a low-resistance enhanced heat transfer structure based on a nano-superwetting interface, which includes a lower embedded microchannel layer and an upper manifold channel layer, the embedded microchannel and the manifold channel are vertically arranged, and the lower embedded microchannel The layer is composed of several embedded microchannel units. The cross section of the embedded microchannel of each unit is a rectangular gradually expanding section along the flow direction of the cooling medium. The shape of the embedded microchannel of each unit is isosceles trapezoidal. The tube channel layer is composed of serpentine manifold channels, and two adjacent serpentine channels constitute the inlet and outlet of the manifold channel. The present invention utilizes a hierarchical flow structure to construct a microchannel heat sink. By combining the microchannel heat sink with a nano-superwetting interface and a gradually expanding microchannel section, the heat transfer characteristics and resistance characteristics can be improved at the same time. In the case of high efficiency, the low resistance of the micro-channel heat sink can be realized to enhance heat transfer.

Description

technical field [0001] The invention belongs to the field of microelectronic device systems, and in particular relates to a low-resistance enhanced heat transfer structure based on a nanometer super-wetting interface. Background technique [0002] With the development of microelectronics technology and the improvement of chip integration, the requirements of electronic devices are becoming more and more stringent, the feature size is getting smaller and smaller, and the performance is gradually improving. The rapid development of microelectronic device systems and aerospace technology has led to the rapid development of micro-scale technology, and the emergence of ultra-large-scale integrated circuits. At the same time, the scale of devices has been further reduced, resulting in a rapid increase in the heat generation of chips on integrated circuits. The heat flux of the chip in the integrated circuit is increased to 10 7 W / m 2 , and the heat flux continues to increase. T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D9/00H05K7/20
CPCF28D9/0062F28F2245/02F28F2245/04H05K7/2039
Inventor 吕晓辰李龙谢文远姚伟
Owner CHINA ACADEMY OF SPACE TECHNOLOGY
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