Integrated cooling device of silicon-based micro-channel radiator

Abstract

The invention provides an integrated cooling device of a silicon-based micro-channel radiator, which is composed of a box body, a silicon-based micro-channel radiator and a cover plate. The box body is a cavity with an opening at the upper end; a flow channel is arranged inside the bottom plate of the box body; a unit cooling liquid inlet and outlet, and an externally connected opening of an internal electronic chip are arrange on the outer side face of the box body; multiple small grooves are formed in the bottom plate of the box body; the silicon-based micro-channel radiator is arranged in the small grooves; two openings are formed in the bottom of each small groove to realize communication between the cooling liquid inlet and outlet of the silicon-based micro-channel radiator and the flow channel at the bottom of the box body; the silicon-based micro-channel radiator is composed of a silicon bottom plate and a silicon cover plate; radiating fins are formed on the silicon bottom plate; both the thickness of the fins and the distance among the fins are less than 0.1 mm. Through such the integration way, the radiator can be arranged and expanded based on the number and positions of high heating flux density chips, the disadvantage that the silicon-based radiator cannot be enlarged is overcome, and strong universality is achieved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic equipment, in particular to a silicon-based microchannel radiator integrated cooling device. Background technique [0002] For power electronic systems with high heat flux density, liquid cooling is often used to dissipate heat, such as liquid-cooled chassis and liquid-cooled modules. These traditional liquid cooling and heat dissipation methods usually use copper, aluminum and other materials to make liquid flow channels, and then seal and weld them to form radiators. The size of the flow channels is usually above 1mm. Between the radiator and the chip, there is usually a problem that the thermal expansion coefficient of the radiator material does not match that of the chip material. The conventional method is to relieve the thermal expansion stress by soldering transitional plates such as molybdenum copper sheets, which undoubtedly increases the heat dissipation from the c...

AI Technical Summary

Problems solved by technology

At present, there are many patents on micro-channel heat dissipation technology, and patents on micro-machining technology on silicon substrates are also extensive, but the combination of the two-the patents on silicon-based micro-channel heat dissipation technology are very few, only CN1558448A, CN103839905A, etc.

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