Micro-channel radiator with disturbed flow structures in horizontal and vertical directions

Abstract

The invention relates to a micro-channel radiator, belongs to the technical field of the radiator, and discloses a micro-channel radiator with disturbed flow structures in horizontal and vertical directions; the micro-channel radiator is characterized in that disturbed flow structures are arranged on three or four wall surfaces in the micro-channel radiator; the disturbed flow structure on the upper wall surface and the disturbed flow structure on the lower wall surface are arranged in a staggered manner to play a heat dissipation intensifying effect in the vertical direction; the disturbed flow structure on the left wall surface and the disturbed flow structure on the right wall surface are arranged in a staggered manner to play a heat dissipation intensifying effect in the horizontal direction; the disturbed flow structure on the upper wall surface and one of the disturbed flow structures on the left wall surface or the right wall surfaces can be mutually spliced on the same verticalsurface; and the disturbed flow structure on the lower wall surface and one of the disturbed flow structures on the left wall surface or the right wall surfaces can be mutually spliced on the same vertical surface. By virtue of the micro-channel radiator, the convection and heat transfer effects can be intensified synchronously in the horizontal and vertical directions, so that fluid temperatureuniformity and speed uniformity in the micro-channel can be improved, and the heat dissipation effect of the radiator can be intensified.

Description

technical field [0001] The invention relates to a micro-channel radiator, in particular to a micro-channel radiator with a flow-disturbing structure in a horizontal direction and a vertical direction. Background technique [0002] With the rapid development of microelectronic devices in the direction of high power, miniaturization, and high integration, the heat flux per unit area of ​​the device is sharp. For example, laser diode arrays have been operating at 100-400W / cm 2 , will exceed 1000W / cm in the near future 2 . However, traditional heat dissipation technologies (such as natural air cooling, forced air cooling, conventional liquid cooling, etc.) have limited heat dissipation capabilities and cannot meet the heat dissipation requirements of future microelectronic device development. At the same time, every time the chip temperature in microelectronic devices increases by 10°C, its stability will decrease by 50%. Therefore, the heat dissipation problem of microelect...

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Problems solved by technology

However, the fin structure in the vertical direction only strengthens the convective heat transfer in the vert

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