Steady-state method-based heat conductivity coefficient measurement device

Abstract

The invention discloses a steady-state method-based heat conductivity coefficient measurement device, and belongs to the technical field of physical performance tests of materials. The steady-state method-based heat conductivity coefficient measurement device comprises a main heater, an upper standard test piece, a lower standard test piece, a to-be-measured test piece holding cavity, a heat preservation layer, an upper shell, a lower shell, a heat insulation ring arranged between the upper shell and the lower shell, electric heating wires connected with a temperature compensation regulator, heating devices for thermocouple groups arranged in the upper standard test piece, the lower standard test piece and the heat preservation layer, a micro-channel cooling device, a temperature acquisition device, and a processing controller, and a pressurizing and fixing frame which consists of an upright post, a bottom plate, a lever and a weight, wherein the middle part of the lever is provided with a pressure rod. According to the steady-state method-based heat conductivity coefficient measurement device, an integrated heating device is used, meanwhile, the electric heating wires connected with the temperature compensation regulator are additionally arranged on the upper shell and the lower shell, and the main heater and the micro-channel cooling device are respectively arranged on the bottom and the top, so that the device has the characteristics that the measurement precision of a heat conductivity coefficient measurement is high, the consistency of repeated measurement and results is high, the stability is high, the measurement range is wide, the measurement can be performed under different heating conditions, and the like.

Description

technical field [0001] The invention belongs to the technical field of physical performance testing of materials, and in particular relates to a measuring device for measuring thermal conductivity of materials by a steady-state method (comparison method) including microchannel cooling and temperature compensation. Background technique: [0002] Thermal conductivity is widely used in electronics and other industries, and it is an indispensable basic data in engineering thermal design. Any electronic device and circuit will inevitably be accompanied by heat generation during the working process. With the improvement of packaging density of microelectronic devices, the energy consumption of chips is getting higher and higher. In order to enhance the heat dissipation capacity of devices and improve the reliability and electrical performance of electronic products, the generated heat must be released quickly and effectively. Radiator And thermal interface materials should have hi...

AI Technical Summary

Problems solved by technology

This kind of structure, one. Although it overcomes the disadvantages of heat flow loss and affecting the accuracy of the measurement when the two contact interfaces of the sample to be tested in the previous background technology are overcome, the structure is too complicated, and the disassembly and installation before and after the measurement are difficult. Difficult disadvantages; two. when the tester measures, the surroundings of the test piece are exposed in the space, and when the heat flows through the test piece, due to the temperature gradient between the test piece and the surrounding environment, the heat flow is inevitably transmitted along the lateral direction, resulting in Uncertainty errors in temperature measurement are reduced, whic...

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