Enhanced heat dissipation device with pulsating flows and wavy-wall microchannels adopted

Abstract

The invention relates to heat dissipation devices and discloses an enhanced heat dissipation device with pulsating flows and wavy-wall microchannels adopted. The device comprises a microchannel heat dissipation cold plate, a pulsating pump, a cooler, a liquid working medium injection pipeline and a liquid working medium return pipeline, wherein the liquid working medium injection pipeline and the liquid working medium return pipeline are used for connecting the microchannel heat dissipation cold plate, the pulsating pump and the cooler together, the microchannel heat dissipation cold plate is a rectangular thin plate and is composed of a microchannel heat sink and a microchannel heat sink cover plate, communicated liquid cavities are formed in the periphery of the microchannel heat sink, the part surrounded by the liquid cavities is divided into four equal parts by two perpendicular liquid division cavities located on the axis of symmetry of the rectangular thin plate, wavy-wall microchannels are distributed all over each equal part in the diagonal direction of the rectangular thin plate, four liquid working medium outlets are formed in the microchannel heat sink cover plate and connected with the liquid working medium return pipeline, and a liquid working medium inlet is formed in the microchannel heat sink cover plate and is connected with the liquid working medium injection pipeline. According to the device, the liquid working medium flowing path is fully optimized, and heat exchange efficiency is improved greatly.

Description

technical field [0001] The invention relates to a cooling device, in particular to a micro-channel heat-dissipating cold plate and a device using a combination of pulsating flow and fractal wave-wall micro-channel to enhance heat and mass transfer technology. Background technique [0002] Since the advent of semiconductor devices in 1948, the miniaturization, miniaturization and integration technologies of electronic components have developed rapidly, and the emergence and application of new materials (such as SiC and GaN) have led to an increase in the power density of electronic equipment. Take computer chips as an example. In 1971, the first electronic chip CPU produced by Intel Corporation integrated more than 23 million transistors on the chip at that time. Up to now, the number of transistors integrated on the computer CPU has exceeded 1 billion. Some scholars It is estimated that the number of transistors integrated on the chip doubles every 18 months. This high level...

AI Technical Summary

Problems solved by technology

The traditional micro-channel heat dissipation cold plate mainly has the following defects, such as low heat dissipation capacity, large temperature difference on the wall surface, uneven temperature distribution, and high pumping power required, etc.

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