Metal-based composite material as well as preparation method and application thereof

A composite material and metal-based technology, applied in the field of metal composite materials, can solve the problems of high drilling difficulty of aluminum silicon carbide, many substrate failures, large internal stress, etc., to improve thermal deformation problems, less equipment and processes, and better heat. The effect of fatigue performance

Pending Publication Date: 2022-04-19
深圳市知行新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to prevent the substrate from cracking during the mechanical drilling process, aluminum alloy is often used to prepare this part, but it is unavoidable that the remaining aluminum alloy must have an interface with the composite material. This position has a large stress and a small area, and it is most likely to occur. fracture
This is also the place where the substrate has the most faults

Method used

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  • Metal-based composite material as well as preparation method and application thereof
  • Metal-based composite material as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] In this example, a metal matrix composite material is prepared, and the specific preparation process is as follows:

[0061] Using 30μm aluminum powder and 27μm silicon carbide powder as raw materials, the cold isostatic pressed green body is made through powder mixing, cold isostatic pressing and vacuum sintering. The specific process is: after dry mixing, 15wt.% SiC / Al mixed powder, the mixed powder is cold isostatically pressed at 400MPa for 1min to obtain a cold isostatic pressed green body of the composite material, the density of the green body is between 95% and 97%, and the green body is vacuum sintered at 600°C;

[0062] Use the filter extrusion test device to heat the green body. After the temperature rises to 660°C, keep it warm for 20 minutes. After the heating process is over, the hydraulic press pushes the extrusion plate to filter and extrude the molten green body under the set program. At this time, the extrusion displacement is 4 mm, the extrusion spee...

Embodiment 2

[0069] In this example, a metal matrix composite material is prepared, and the specific preparation process is as follows:

[0070] Using aluminum ingots and 50μm silicon carbide powder as raw materials, 30wt.% SiC / Al ingots are made by liquid stirring method. In order to eliminate casting defects, the patterns are hot-pressed. The hot-pressing parameters are heating to 500°C, holding the temperature for 20Min, applying a force of 30T for hot-pressing, and the density of the sample is between 95% and 97%;

[0071] The composite material ingot is heated by the filter extrusion test device, and the temperature is raised to 700°C and then kept for 20 minutes. After the heating process is completed, the hydraulic press pushes the filter mold under the set program to filter and extrude the test sample. The extrusion displacement is 8mm, the extrusion speed is 1mm / s, the liquid Al solution flows into the cavity through the filter plate, and the SiC particles remain at the bottom of ...

Embodiment approach

[0080] As an implementation manner, the object to be dissipated includes a chip.

[0081] The heat sink has a heat dissipation substrate that matches the thermal performance of the contact surface of the chip, which can improve the problem of thermal deformation caused by temperature gradients during the operation of electronic devices.

[0082] At present, the heat dissipation bottom plate of electronic devices prepared by impregnation method on the market has a thin layer of metal matrix on the surface, which increases the thermal resistance. However, in the radiator of the present invention, the heat dissipation substrate is made of metal-based ceramic reinforced composite material as a whole, which has better thermal fatigue performance and prolongs the service life.

[0083] The composite material of the invention is used to prepare the heat sink, and the required equipment and process are less than those of the impregnation method, which reduces the packaging cost of the...

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Abstract

The invention provides a metal-based composite material and a preparation method and application thereof. According to the metal-based composite material disclosed by the invention, the reinforcement particles are distributed in the metal matrix in a gradient manner, so that the metal-based composite material has excellent comprehensive performance, including relatively high heat conductivity coefficient, adjustable thermal expansion coefficient, relatively high hardness, relatively low density and good and long-term stable performance, and is an ideal heat dissipation packaging material. According to the metal-based composite material, in the metal-based composite material, the reinforcement particles are distributed in the metal matrix in a gradient mode, the gradient material can relieve the internal thermal stress of the material under the cyclic change of the high-temperature and low-temperature environment, and the failure of electronic components due to the thermal problem can be solved. For example, a silicon carbide aluminum-based composite material (SiCp/Al) with a high volume fraction ratio has excellent comprehensive performance, including relatively high heat conductivity coefficient, adjustable thermal expansion coefficient, relatively high hardness and relatively low density, and is an ideal material in the field of electronic packaging.

Description

technical field [0001] The invention belongs to the technical field of metal composite materials, and in particular relates to a metal matrix composite material and its preparation method and application. Background technique [0002] In electronic and photonic systems, effective thermal management has always been a key technology for product size miniaturization, performance optimization, functional diversification and effective enhancement of reliability. Semiconductor technology trends indicate that heat dissipation in electronic equipment has continued to increase in recent decades, and heat dissipation will become a limiting factor in the manufacture of high-end electronic equipment for the foreseeable future. Failure to dissipate heat effectively will lead to overheating of electronic equipment, increased temperature, and even failure. With the development of chip technology, the integration level of electronic devices is increasing at a rate of 40% to 50% per year. ...

Claims

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Application Information

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IPC IPC(8): C22C32/00C22C26/00C22C21/00C22C9/00C22C29/06C22C1/10B22D18/02F28F21/08H01L23/373
CPCC22C32/0063C22C32/0057C22C32/0084C22C32/0047C22C26/00C22C21/00C22C9/00C22C29/062C22C29/065C22C29/06C22C1/1036C22C1/1068B22D27/00B22D18/02F28F21/081H01L23/3736C22C2026/006C22C1/1073
Inventor 赵军峰李丘林王靓
Owner 深圳市知行新材料科技有限公司
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