The invention relates to the technical field of
polyimide materials, and discloses a
polyimide film with a low
thermal expansion coefficient and a preparation method thereof, the
polyimide film comprises the following raw materials by
mass: 6-10 parts of dianhydride, 6-10 parts of
diamine, 3-5 parts of a composite reinforcing filler, and 80-120 parts of a polar
solvent. The composite reinforcing filler contains a modified layered
composite material, and the in-situ synthesized
silicon carbide nanowire can be connected with the layered
composite material in disordered distribution to form a three-dimensional
network structure, so that a heat conduction path is remarkably enhanced, and the
thermal expansion coefficient of the polyimide film is reduced; the formed three-dimensional
network structure containing the
silicon carbide nanowires can absorb and weaken
gravitation generated by external force, the
mechanical strength is improved, in addition, the composite reinforcing filler comprises
bacterial cellulose and
chitosan, and can be combined with polyimide resin through
hydrogen bonds, so that the composite reinforcing filler is uniformly distributed in the polyimide resin, and the
mechanical strength is improved. The prepared polyimide film has excellent heat-conducting property and lower
thermal expansion coefficient.