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Graphene radiating apparatus and preparation method therefor

A technology of heat dissipation device and graphene, applied in graphene, lamination device, chemical instrument and method, etc., can solve the problems of inability to greatly reduce the thermal resistance between infrared particle interfaces, endangering environmental protection, safety, and unsatisfactory heat dissipation efficiency, etc. Achieve the effect of improving heat dissipation, low cost, and easy large-scale production

Active Publication Date: 2016-06-29
白德旭
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this patent also has the following defects: the contact performance of graphene in the powder is not good, the thermal resistance generated between the infrared particle interfaces cannot be greatly reduced, the heat dissipation efficiency is not ideal, and the prepared coating needs to be uniform when used. Dispersed into a specific solvent, and then coated on the surface of the target object, and the solvent is removed by heating or natural volatilization, so that the coating itself in the final heat dissipation coating has poor contact, especially the entire treatment process will When the solvent escapes, it may cause environmental protection and safety problems that may harm the human body and the environment

Method used

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  • Graphene radiating apparatus and preparation method therefor
  • Graphene radiating apparatus and preparation method therefor
  • Graphene radiating apparatus and preparation method therefor

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[0044] Another aspect of the present invention also provides a method for preparing a graphene heat sink, the method comprising the following steps: cleaning the substrate 20 with a two-dimensional or three-dimensional structure and drying it for later use. A compound formed of porous graphene and at least one polymer and / or polymer monomer is coated on the first surface of the substrate 20 to form the heat dissipation layer 10 . Hot pressing the composite-coated substrate 20 densifies the composite layer. A multi-layer structure including at least the first film layer 210 , the second film layer 220 , the third film layer 230 , the fourth film layer 240 and the fifth film layer 250 is sequentially arranged on the second surface opposite to the first surface. A plurality of cooling fins 30 are disposed on the surface of the fifth film layer 250 . A plurality of heat dissipation fins 301 are extended on each heat dissipation fin 30 . Preferably, in order to increase the stabi...

Embodiment 1

[0047] Take the formation and pretreatment of the substrate 20 with a two-dimensional or three-dimensional structure as an example.

[0048] The substrate 20 can be any two-dimensional planar structure, and the substrate 20 can also be a three-dimensional structure. Preferably, the material of the substrate 20 is selected from any one or alloys of aluminum, copper, titanium, stainless steel and nickel. The three-dimensional structure of the substrate 20 includes, but is not limited to, a convex structure, a concave structure, a hole structure, a curved surface structure, a grating structure, an optical waveguide structure, a photonic crystal structure and a fishnet structure. The size of the two-dimensional or three-dimensional structure of the substrate 20 is nano-scale, micro-scale or macro-scale.

[0049] According to the material properties of the substrate 20 and the required structural size, select photolithography, dry etching, wet etching, nanoimprinting, masking, ion...

Embodiment 2

[0060] This embodiment is a further improvement on Embodiment 1, and only the improved part will be described.

[0061] The material of the substrate 20 is not limited to metal material, and may also be plastic with high thermal conductivity, or PCB with high thermal conductivity. The material of the substrate 20 may also be a structural polymer with high thermal conductivity, such as polyacetylene, polyaniline, polypyrrole and the like with good thermal conductivity. The material of the substrate 20 can also be a metal with high thermal conductivity or a polymer material filled with inorganic fillers.

[0062] According to a preferred embodiment, the material of the substrate 20 is a metal-filled polymer-based thermally conductive composite material. Preferably, the commonly used metal material is one of silver, copper, tin, aluminum, nickel and iron. Preferably, the material of the substrate 20 is a thermally conductive composite material made by filling HDPE resin with al...

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Abstract

The invention relates to a graphene radiating apparatus. The radiating apparatus comprises a first radiating layer (10) and a substrate (20), wherein the substrate (20) adopts a two-dimensional or three-dimensional structure and is provided with a first surface and a second surface opposite to the first surface, wherein the radiating layer (10) arranged on the first surface is formed by porous graphene, at least one kind of polymer and / or a compound formed by polymer monomers; and a multi-layer structure at least including a first film layer (210), a second film layer (220), a third film layer (230), a fourth film layer (240) and a fifth film layer (250) is arranged on the second surface. The invention also relates to a preparation method for the graphene radiating apparatus. The graphene radiating apparatus provided by the invention has the advantages of simple structure, high thermal conductivity and thermal dissipation, and wide application range.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic components, in particular to a graphene heat dissipation device and a preparation method thereof. Background technique [0002] With the rapid development of miniaturization of electronic devices, especially the increasingly dense components on electronic circuit boards, the surface temperature of electronic products is also rising, and the heat management of electronic products has become an important issue in product design. With the emergence of large-screen touch electronic devices, consumer electronics products have also begun a new design direction, and smaller and thinner designs are becoming more and more popular. 2G, 3G mobile phones, tablet computers, e-books, notebook computers, etc. The dense components of such electronic equipment bring about a rapid rise in the internal temperature of the product, and the components also urgently need a relatively low temperatu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20B32B9/00B32B9/04B32B15/04B32B15/088B32B15/18B32B15/20B32B27/18B32B27/20B32B27/30B32B27/32B32B27/34B32B27/38B32B3/30B32B3/08B32B7/08B32B7/10B32B33/00B32B37/00C04B35/565C01B31/04C22C9/01C22C30/02C22C21/02C22C21/18C22C21/10C22C21/00C08L77/00C08K13/04C08K7/06C08K3/04C08K3/34C04B26/14C04B26/04C04B26/08C04B26/06C04B26/12C04B26/20C04B26/02C04B26/10C04B26/18
CPCB32B3/085B32B3/30B32B7/08B32B7/10B32B9/005B32B9/007B32B9/041B32B9/045B32B15/043B32B15/088B32B15/18B32B15/20B32B27/18B32B27/20B32B27/304B32B27/32B32B27/34B32B27/38B32B33/00B32B37/00B32B2255/06B32B2255/10B32B2255/20B32B2262/10B32B2262/106B32B2264/105B32B2264/108B32B2307/206B32B2307/302B32B2307/306B32B2307/718B32B2457/00C01B2204/04C01P2006/12C01P2006/16C04B26/02C04B26/04C04B26/045C04B26/06C04B26/08C04B26/10C04B26/122C04B26/14C04B26/18C04B26/20C04B35/565C04B2111/00465C04B2111/00482C04B2111/00525C04B2111/00534C04B2235/3206C04B2235/3208C04B2235/3217C04B2235/3224C04B2235/3418C04B2235/349C08K3/04C08K3/34C08K7/06C08K13/04C22C9/01C22C21/00C22C21/02C22C21/10C22C21/14C22C21/16C22C21/18C22C30/02H05K7/2039C08L77/00C04B14/024
Inventor 白德旭
Owner 白德旭
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