Integrated heat pipe and its method of heat exchange

Abstract

The present invention relates to a kind of integrated heat pipe and a method of heat exchange. The heat pipe includes a tank (1-2) as a heating potion and a lot of heat carriers (1-4) as a radiating portion. The tank (1-2) and the heat carriers (1-4) have same cavity in which a coolant (1-3) is partially filled. The tank (1-2) is held in close contact with a heat source (such as electronic elements). The heat carriers (1-4) are arranged at an interval so that the radiating channels (1-4a) are formed between them. The coolant (1-3) in the tank (1-2) is heated by the heat sources, vaporized coolant moves to the heat carriers (1-4) and condenses in there. According to the invention, the heat pipe can be increased its radiating surface significantly with the varied arrangement of the heat carriers (1-4).

Description

FIELD OF INVENTION

[0001] This invention is related to heat exchange technology and method, specifically, an integrated heat pipe and its heat exchange method. BACKGROUND OF THE INVENTION

[0002] The development of LSI, mainframe computer and electrical and electronic technologies has imposed higher requirements on the heat elimination of electronic elements and components. For example, the integration level of CPU chips of computers has risen by nearly 20,000 folds just within 30 years with its consumption power rising up to a few dozen watts from its initial a few watts and with the resulting heat flux being up to 100 W / cm2 in some cases. The working reliability and life of computer is closely related to its working temperature and the required maximum temperature (internal) of chips ≦130° C. and the required surface temperature ≦80° C. However, its working reliability will decrease by 3.8% whenever the temperature of chip rises by 1° C., and its life will increase by 50% whenever ...

Examples

application example 1

[0080] As shown in FIG. 1, Application Example 1 is a kind of heat pipe applicable to integrated heat pipe coolers with an in-line finned structure for cooling CPU of computers, express cards, high-power power electronic components.

[0081] It is a kind of integrated heat pipe composed of a shell 1-1 with an enclosed chamber 1-2, featuring a heat carrier on the outer side of the enclosed vacuum chamber; the heat carrier 1-4 has a thin-wall fluid passage 1-4a with radial in-line distribution of 12 long fins and 12 fins matching with the axis of the heat pipe, the inner side of each group of long fin and short fin is the internal chamber of the heat carrier 14, and is connected with the vacuum chamber 1-2 and the extension to the vacuum chamber 1-2; the outer side of each long fin and short fin is cooling surface of the fluid passage 1-4a of the heat carrier 1-4, which contacts with the cool fluid; each group of the heat carrier shares an enclosed chamber 1-2 and the heat transfer medi...

application example 2

[0084] As shown in FIG. 2, Application Example 2 is a kind of integrated heat pipe applicable to integrated heat pipe coolers with an in-line finned structure for cooling CPU of computers, or high-power power electronic components.

[0085] It is a kind of integrated heat pipe composed of a shell 2-1 with an enclosed chamber 2-2 that is vacuumed to fill in a heat transfer medium 2-3. It features a heat carrier 2-4 on the outer side of the vacuum chamber 2-2; The heat carrier 2-4 has a fluid passage 2-4a structure with parallel array of 13 groups of finned thin-wall fluid passage 2-4a from heat-in of the shell to its opposite end; the internal side of each group of finned thin-wall fluid passage 2-4a is the inner chamber of the heat carrier and is connected with the enclosed vacuum chamber 2-2 and an extension to the enclosed vacuum chamber 2-2; the outer side of each group of finned thin wall fluid passage 2-4a is the cooling surface of the heat carrier 2-4, which contacts with the co...

application example 3

[0088] As shown in FIG. 3, Application Example 3 is a kind of heat pipe applicable to integrated heat pipe coolers with a thin-wall rectangle pipe structure for cooling CPU of computers, or high-power power electronic components.

[0089] It is a kind of integrated heat pipe composed of a shell 3-1 with an enclosed chamber 3-2 that is vacuumed to fill in a heat transfer medium 3-3. It features 11 groups of heat carrier 3-4 in the inner side of the enclosed vacuum chamber 3-2 that is enclosed by the rectangle shell, and the left and right end plates 3-6 of the shell; the heat carrier is a fluid passage 3-4a structure composed of thin-wall pipes with a rectangle cross section and runs through both ends of the end plates 3-6 of the shell; the outer wall of each thin-wall pipe with rectangle cross section constitutes the inner chamber of the heat carrier 3-4 and is connected with the enclosed vacuum chamber 3-2 and inside the enclosed vacuum chamber 3-2; the inner wall of each rectangle t...

FIELD OF INVENTION

[0001] This invention is related to heat exchange technology and method, specifically, an integrated heat pipe and its heat exchange method. BACKGROUND OF THE INVENTION

[0002] The development of LSI, mainframe computer and electrical and electronic technologies has imposed higher requirements on the heat elimination of electronic elements and components. For example, the integration level of CPU chips of computers has risen by nearly 20,000 folds just within 30 years with its consumption power rising up to a few dozen watts from its initial a few watts and with the resulting heat flux being up to 100 W / cm2 in some cases. The working reliability and life of computer is closely related to its working temperature and the required maximum temperature (internal) of chips ≦130° C. and the required surface temperature ≦80° C. However, its working reliability will decrease by 3.8% whenever the temperature of chip rises by 1° C., and its life will increase by 50% whenever ...

Examples

application example 1

[0080] As shown in FIG. 1, Application Example 1 is a kind of heat pipe applicable to integrated heat pipe coolers with an in-line finned structure for cooling CPU of computers, express cards, high-power power electronic components.

[0081] It is a kind of integrated heat pipe composed of a shell 1-1 with an enclosed chamber 1-2, featuring a heat carrier on the outer side of the enclosed vacuum chamber; the heat carrier 1-4 has a thin-wall fluid passage 1-4a with radial in-line distribution of 12 long fins and 12 fins matching with the axis of the heat pipe, the inner side of each group of long fin and short fin is the internal chamber of the heat carrier 14, and is connected with the vacuum chamber 1-2 and the extension to the vacuum chamber 1-2; the outer side of each long fin and short fin is cooling surface of the fluid passage 1-4a of the heat carrier 1-4, which contacts with the cool fluid; each group of the heat carrier shares an enclosed chamber 1-2 and the heat transfer medi...

application example 2

[0084] As shown in FIG. 2, Application Example 2 is a kind of integrated heat pipe applicable to integrated heat pipe coolers with an in-line finned structure for cooling CPU of computers, or high-power power electronic components.

[0085] It is a kind of integrated heat pipe composed of a shell 2-1 with an enclosed chamber 2-2 that is vacuumed to fill in a heat transfer medium 2-3. It features a heat carrier 2-4 on the outer side of the vacuum chamber 2-2; The heat carrier 2-4 has a fluid passage 2-4a structure with parallel array of 13 groups of finned thin-wall fluid passage 2-4a from heat-in of the shell to its opposite end; the internal side of each group of finned thin-wall fluid passage 2-4a is the inner chamber of the heat carrier and is connected with the enclosed vacuum chamber 2-2 and an extension to the enclosed vacuum chamber 2-2; the outer side of each group of finned thin wall fluid passage 2-4a is the cooling surface of the heat carrier 2-4, which contacts with the co...

application example 3

[0088] As shown in FIG. 3, Application Example 3 is a kind of heat pipe applicable to integrated heat pipe coolers with a thin-wall rectangle pipe structure for cooling CPU of computers, or high-power power electronic components.

[0089] It is a kind of integrated heat pipe composed of a shell 3-1 with an enclosed chamber 3-2 that is vacuumed to fill in a heat transfer medium 3-3. It features 11 groups of heat carrier 3-4 in the inner side of the enclosed vacuum chamber 3-2 that is enclosed by the rectangle shell, and the left and right end plates 3-6 of the shell; the heat carrier is a fluid passage 3-4a structure composed of thin-wall pipes with a rectangle cross section and runs through both ends of the end plates 3-6 of the shell; the outer wall of each thin-wall pipe with rectangle cross section constitutes the inner chamber of the heat carrier 3-4 and is connected with the enclosed vacuum chamber 3-2 and inside the enclosed vacuum chamber 3-2; the inner wall of each rectangle t...

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