Integrated heat pipe and its method of heat exchange

a heat exchange pipe and heat exchange technology, applied in indirect heat exchangers, lighting and heating apparatus, stationary conduit assemblies, etc., can solve the problems of poor heat elimination effect, low cost, and major problems of heat elimination, and achieve the effect of increasing heat transfer efficiency
US20050061486A1Inactive Publication Date: 2005-03-24YANG HONGWU
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
YANG HONGWU
Publication Date
2005-03-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention relates to a kind of integrated heat pipe and a method of heat exchange. The heat pipe includes a tank (1-2) as a heating potion and a lot of heat carriers (1-4) as a radiating portion. The tank (1-2) and the heat carriers (1-4) have same cavity in which a coolant (1-3) is partially filled. The tank (1-2) is held in close contact with a heat source (such as electronic elements). The heat carriers (1-4) are arranged at an interval so that the radiating channels (1-4a) are formed between them. The coolant (1-3) in the tank (1-2) is heated by the heat sources, vaporized coolant moves to the heat carriers (1-4) and condenses in there. According to the invention, the heat pipe can be increased its radiating surface significantly with the varied arrangement of the heat carriers (1-4).
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Description

FIELD OF INVENTION

[0001] This invention is related to heat exchange technology and method, specifically, an integrated heat pipe and its heat exchange method. BACKGROUND OF THE INVENTION

[0002] The development of LSI, mainframe computer and electrical and electronic technologies has imposed higher requirements on the heat elimination of electronic elements and components. For example, the integration level of CPU chips of computers has risen by nearly 20,000 folds just within 30 years with its consumption power rising up to a few dozen watts from its initial a few watts and with the resulting heat flux being up to 100 W / cm2 in some cases. The working reliability and life of computer is closely related to its working temperature and the required maximum temperature (internal) of chips ≦130° C. and the required surface temperature ≦80° C. However, its working reliability will decrease by 3.8% whenever the temperature of chip rises by 1° C., and its life will increase by 50% whenever ...

Claims

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