The invention relates to a microfluidic MEMS
chip packaging method, applied to packaging an upper substrate with a micro-channel structure and a lower substrate connected with the upper substrate in a stacking manner to acquire a microfluidic MEMS
chip. The method comprises the following steps of 1, preparing the lower substrate; 2, preparing the upper substrate; 3, preparing the semi-finished
chip; 4, pre-heating the semi-finished chip; and 5, bombarding the semi-finished chip by using a
radio frequency power source. The microfluidic MEMS chip packaging method has the advantages that a
radio frequency technology is used for acting on
metal films on the upper and lower substrates, so that the surfaces of the
metal films are partially subjected to high temperature, the surfaces of the substrates are melted with the
metal films after melting, and thus the upper and lower substrates can be well tightly combined, bonding accuracy of a product is greatly improved, the micro-channel structure is prevented from being obstructed by a packaging process, a finished product ratio of chip packaging is improved, a
production cycle is shortened, and production cost is reduced.