32results about How to "The same time" patented technology

A controlling device comprises: a temperature ramp-up time estimating portion for estimating a required temperature ramp-up time for the controlled quantity in each individual control loop to reach a set point when the operating quantity output upper limit value of each individual control loop has been sent to a specified output upper limit value; a required output estimating portion for estimating, for each individual control loop, a required operating quantity output for the controlled quantity to reach the set point within the temperature ramp-up time; an output upper limit value setting portion for setting, temporarily, the operating quantity output as the operating quantity output upper limit value of the individual control loop; and a controlling portion that is provided for each individual control loop.

The invention provides a task allocation method and apparatus. The task allocation method comprises the steps of determining a delivery region; establishing a directed connection relationship by taking a delivery center in the delivery region as a starting point, wherein the directed connection relationship connects parking points of the delivery region in sequence; determining a total delivery task quantity of the delivery region according to the directed connection relationship; obtaining a total quantity of delivery vehicles of the delivery region; and determining an average task quantity of each delivery vehicle according to the total delivery task quantity and the total quantity of the delivery vehicles. According to the method and the apparatus, the balance of task allocation can be improved.

The invention relates to a control method of a heat pump water heater and a control device thereof. According to the method, firstly, the environment temperature Te of the located environment of an outdoor unit of the heat pump water heater is detected; then, the practical heat generating quantity Q (Te) of the heat pump water heater is calculated according to the environment temperature Te; the rated heat generating quantity Q0 of the heat pump water heater and the rated frequency f0 of a compressor are obtained; then, the operation frequency f of the heat pump water heater is calculated in accordance with the proportion relationship of the practical heat generating quantity Q(Te) and the rated heat generating quantity Q0 according to the rated frequency f0; finally, the compressor of the heat pump water heater is driven to work at the operation frequency f. The heat pump water heater has the advantages that the work frequency of a variable-frequency compressor is regulated, so that the time of the heat pump water heater for reaching the rated heat generating quantity Q0 at different environment temperatures is identical; the condition that the hot water waiting time of a user in different seasons is different is avoided; the efficiency of the heat pump water heater is improved.

The invention discloses a data balancing method. The method comprises the following steps: respectively counting hot data volumes of all disks in the storage device and determining hot data balance values of all disks; and migrating hot data in a first category of disks into a second category of disks till the difference value between the hot data volume of each disk in the storage device and hotdata balance value is less than first pre-set threshold value. The invention further provides a storage device capable of achieving the data balancing method. The problem that non-uniform IO requestsare hosted by the disks is resolved. Therefore, time spent on processing the IO requests by all the disks is the basically the same. The storage device responses more quickly to the IO requests.

The invention discloses an automobile part grinding device. The automobile part grinding device comprises an inverted-L-shaped supporting plate and a motor fixed to the supporting plate. The supporting plate is internally provided with an inverted-L-shaped mounting cavity. The output end of the motor penetrates through the sidewall of the supporting plate to extend into the mounting cavity and befixedly connected with a first gear. The first gear is rotatably connected with a grinding mechanism. The output end of the motor is fixedly connected with a first bevel gear. The first bevel gear isrotatably connected with a transmission mechanism. The transmission mechanism is connected with a fixing mechanism. When the automobile part grinding device conducts grinding on a contact surface of ahub, the hub is placed on a rotary block, the distance between an upper abutting plate and a lower abutting plate in a mounting groove is adjusted by controlling rotation of a threaded rod and a threaded column to conduct supporting on the hub to be machined. The automobile part grinding device drives the hub to regularly rotate through a second bevel gear rotatably connected with the motor, an incomplete gear, a transmission gear, a third gear and a rotary shaft and ensures that the hub rotating time is equal.

The invention discloses a neural network distributed training method capable of dynamically adjusting Batch-size. The neural network distributed training method relates to the technical field of distributed training of computer neural networks, and dynamically adjusts the Batch-size and divides subdata sets according to computing power of each computing node in a distributed cluster from the perspective of processing a training data set. Therefore, load balancing processing of the distributed training cluster is realized. According to the distributed neural network training method for dynamically adjusting the Batch-size, the computing power of each computing node can be fully utilized, and the time for each computing node to complete local data set training can further be ensured to be approximately the same, thereby reducing the synchronization overhead of the cluster, improving the distributed training efficiency of the neural network and shortening the neural network training time.

The invention discloses a wet etching device for an oxide thin film. The wet etching device comprises an etching groove and a carrier for containing a thin film substrate,; the bottom of the etching groove takes an arc shape; the bottom of the carrier is equipped with a wheel, the etching groove is internally equipped with an orbit, the wheel enters in and out of the etching groove along the orbit, a cover plate is arranged on the etching groove, and the cover plate does not interfere with the carrier to enter in and out of the etching groove. The device further comprises a control unit for controlling the motion of the carrier, and a substrate clamp is arranged on the carrier to fix the thin film substrate. The flow line production design idea of the motion of the carrier in the etching groove ensures the equal stay time of each thin film substrate in an acid liquor tank and the small variation range of the concentration of the acid liquor, increases the utilization rate of the acid liquor, enhances quality of the product and speeds up the production efficiency.

The invention provides a flow-type electroporation device. The device includes a pipe body, a first electrode, a second electrode, a support for fixing the first electrode, and a support for fixing the second electrode; and the device is characterized in that pipe openings of two ends of the pipe body are provided with grooves, the support for fixing the first electrode and the support for fixingthe second electrode are respectively arranged in the grooves, the shapes of the first electrode and the second electrode are the same as the shape of the cross section of the middle part of the pipebody, the pipe body forms a cavity with the first electrode and the second electrode, a gap is arranged between the support for fixing the first electrode and the support for fixing the second electrode, and a liquid enters and/or flows out of the cavity through the gap. The flow-type electroporation device provided by the invention can form an electroporation only when the cavity is filled with the liquid, ensures the same time for the cell electroporation, and improves the cell processing capacity while improving the electroporation efficiency.

The invention relates to a PVD coating method and a PVD coating device. According to the method, the coating time is controlled by controlling the number of rotating turns of coating workpieces in thecoating process. According to the method, due to the fact that the coating time is controlled by controlling the number of rotating turns of the coating workpieces in the coating process, it can be effectively guaranteed that the times for the coating workpieces to pass through a deposition source effective area within the deposition starting time are the same, and therefore the film thickness uniformity of a film layer in the circumferential direction of a rotating stand is improved.

The invention discloses equipment for assisting in reading an image which comprises an upper shell and a lower shell, wherein the upper shell and the lower shell form an outer shell, the upper shell and the lower shell are connected together through four sets of limiting devices which are arranged in the outer shell in a bilateral symmetry mode, a power cavity is formed in the upper shell, a motoris fixedly arranged on the left wall of the power cavity, and a first rotating shaft is installed on the right side face of a motor. The equipment is simple, easy and convenient to use, influence onimage scanning caused by external environment factors such as illumination is avoided, it is guaranteed that the scanning time of each part of images is the same, later image processing is facilitated, a pawl and a ratchet bar can be adjusted within a certain length, and a scanner is suitable for scanning of the images of different sizes by being matched with photo frames of different specifications.

The invention discloses a shooting control method, which comprises the following steps of: transmitting a shooting instruction to one or more shooting terminals, and receiving an equipment identifiercorresponding to each shooting terminal returned by the shooting terminal in response to the shooting instruction; determining shooting index values of the shooting terminals based on the equipment identifiers corresponding to the shooting terminals, and transmitting the shooting index values to the shooting terminals so as to set the shooting terminals based on the shooting index values; and transmitting predetermined shooting time to each shooting terminal, so that each shooting terminal requests to obtain the current time from a time server based on the predetermined shooting time, recordsthe response time of the time server, determines the shooting countdown based on the predetermined shooting time, the current time and the response time, and performs shooting based on the shooting countdown. The invention further discloses a corresponding shooting system and computing equipment. According to the shooting control method provided by the invention, the shooting terminals can be ensured to trigger shooting at the same time, and the time for generating the pictures by the shooting terminals is consistent.

The invention provides a corrosion process for reducing the thickness deviation value of a damaged layer of a wafer. The process comprises the steps that: a plurality of wafers are made to synchronously enter a solution and are stably placed, and the V-shaped grooves of all the wafers face the same direction; the wafers are controlled to synchronously rotate (N+ 0.5) circles in the solution at a set rotating speed, wherein N is an integer greater than 1; and the wafers are extracted to leave the solution. The duration from a time point when the wafers enter the solution to a time point when the wafers are stably placed is the same as the duration from a time point when the still standing of the wafers is completed to a time point when the wafers are completely taken out of the solution. According to the corrosion process of the invention, the parts of the wafers, which firstly enter the solution in a groove body, firstly leave the solution, so that the difference value of the corrosion thicknesses of two sides of each wafer is reduced to the greatest extent, the uniformity and consistency of the corrosion thickness of the wafers are improved, a foundation is laid for obtaining qualified geometric parameters for subsequent polishing processing, and the production efficiency is improved.