Halogen-free and phosphorus-free epoxy resin composition and prepreg and laminated board produced therefrom

Abstract

The invention discloses a halogen-free and phosphorus-free epoxy resin composition, which comprises: (a) epoxy resin: 40-80 parts; (b) cyanate resin: 1-15 parts; (c) benzene Oxazine resin: 10-45 parts; (d) aromatic amine compound: 5-30 parts; (e) inorganic filler; the total amount of the above-mentioned components a, b, c, and d is 100 parts; component e Content: the total amount of the first four components is 70~150:100; the monomer of the epoxy resin contains 2 or more benzene rings. The halogen-free and phosphorus-free epoxy resin composition, prepreg and laminate obtained in the present invention can meet the requirements of halogen-free and phosphorus-free flame retardancy, and the flame retardancy reaches UL94V-O level. It not only has environmental protection characteristics, but also has high heat resistance, low Dielectric constant, low dielectric loss, low thermal expansion coefficient, good drilling processability, low water absorption and other excellent characteristics.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a halogen-free and phosphorus-free epoxy resin composition and a prepreg and a laminate made by using the same. The resin composition can be applied to integrated circuit packaging, high-frequency high-speed and high-density interconnection, etc. field. Background technique [0002] In the current production of flame-retardant copper-clad laminates, the main resin used for substrate materials is brominated epoxy resin. [0003] People in the industry generally believe that brominated epoxy resins will produce toxic gases during combustion, so they have been replaced by other halogen-free flame retardants. [0004] On July 1, 2006, the EU's two environmental protection directives "Regarding Waste Electrical and Electronic Equipment" and "Restricting the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" came into effect. [0005] The implement...

AI Technical Summary

Problems solved by technology

[0008] In traditional resin compositions for copper-clad laminates, aluminum hydroxide, silicon dioxide and other inorganic fillers are generally added to reduce costs, improve flame retardancy, mechanical properties, etc., so that the proportion of inorganic fillers in the resin composition is increasing. However, the dispersibility of inorganic fillers in resin components has been difficult to improve, and the amount of inorganic fillers used and their particle size and shape will affect their dispersibility, thus limiting the application of inorganic fillers

[0011] The cost of these phosphorus-containing modified epoxy resins is quite high, and this problem is also raised in US6353080

[0012] In addition to the problem of high cost, the addition of phosphorus compounds often reduces the properties of the composition such as water absorption or sheet tolerance; and, using phosphorus to flame retardant, various intermediates and production processes of phosphorus-based flame retardants have certain toxicity

[0013] Phosphorus-based flame retardants may produce toxic gases (such as methylphosphine) and toxic substances (such as triphenylphosphine) during combustion, and their waste may cause potential harm to the aquatic environment

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