Thermosetting resin composition and prepreg and laminate prepared therefrom

A resin composition and thermosetting technology, applied in the field of laminates, can solve the problems of difficult to meet the requirements of green environmental protection, high curing temperature of bismaleimide, environmental pollution, etc., to improve heat resistance and dielectric properties , Reduce the dielectric constant, improve the effect of processing performance

Inactive Publication Date: 2015-02-25
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the epoxy composition uses brominated flame retardants for flame retardancy. Although it has excellent comprehensive performance, these flame retardants containing bromine components are easy to cause pollution to the environment when the product is manufactured, used, or even recycled or discarded. Difficult to meet the use requirements of green environmental protection
[0006] CN103013110A proposes to use the cured product of cyanate ester, styrene-maleic anhydride, polyphenylene ether and bismaleimide, and use phosphorus nitrogen-based compound as flame retardant to achieve low dielectric constant and low dielectric loss , high heat resistance and high flame resistance, but the curing temperature of bismaleimide is high, and its cured product is brittle, so there are many shortcomings in the process of processing and use

Method used

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  • Thermosetting resin composition and prepreg and laminate prepared therefrom
  • Thermosetting resin composition and prepreg and laminate prepared therefrom
  • Thermosetting resin composition and prepreg and laminate prepared therefrom

Examples

Experimental program
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Effect test

preparation example

[0046] Preparation example, the synthesis of phenylpropylene-maleic anhydride

[0047] Under the condition of nitrogen protection and stirring, add monomer maleic anhydride and initiator into the medium to dissolve, and when heated to 60-80°C, add monomer styrene and molecular weight regulator dropwise, continue stirring after dropwise addition React for 1-8h to obtain a dispersion system of low molecular weight styrene / maleic anhydride polymer particles, centrifuge and dry the dispersion to obtain a low molecular weight styrene / maleic anhydride alternating copolymer; wherein the initiator is Organic peroxides or azo compounds; the medium is a mixed solution of organic acid alkyl esters and alkanes; the molecular weight regulator is vinyl acetate; the amount of maleic anhydride and propylene is 1: 0.90-0.96; the sum of the mass concentrations of the two monomers maleic anhydride and phenylpropylene in the reaction system is 2.0-7.5%; the mass concentration of the initiator in ...

Embodiment

[0051] Embodiment, the preparation method of copper clad laminate

[0052] Put cyanate ester, epoxy resin, styrene-maleic anhydride, polyphenylene ether, halogen-free flame retardant, curing accelerator, filler and solvent into a container, stir to mix evenly, and make glue. Use a solvent to adjust the solid content of the solution to 60%-70% to make a glue solution, that is, to obtain a thermosetting resin composition glue solution, impregnate the glue with 2116 electronic grade glass fiber cloth, bake in an oven to form a prepreg, and take 6 2116 prepregs, Cover both sides with 35μm thick electrolytic copper foil, vacuum laminate in a hot press, and cure at 190°C / 120min to make a copper clad laminate.

[0053] Each component used in Examples 1-6 and Comparative Examples 1-5 and its content (by weight) are as shown in Table 1, and each component code and its corresponding component name are as follows:

[0054] (A) Cyanate: HF-10 (Shanghai Huifeng Science and Trade Trade Nam...

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Abstract

The invention relates to a thermosetting resin composition and prepreg and laminate prepared therefrom. The thermosetting resin composition contains the following ingredients in parts by weight: 50-150 parts of cyanate, 30-120 parts of epoxy resin, 20-70 parts of allyl benzene-maleic anhydride, 20-100 parts of polyphenyl ether, 30-100 parts of halogen-free flame retardant, 0.05-5 parts of curing accelerator and 50-200 parts of filler. The prepreg and the laminate, which are manufactured from the thermosetting resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent flame retardance, heat resistance and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.

Description

technical field [0001] The invention relates to the technical field of laminated boards, in particular to a resin composition, in particular to a thermosetting resin composition and a prepreg made of it, a laminated board and a printed circuit board. Background technique [0002] With the rapid development of the electronics industry, electronic products are developing toward lightness, thinness, shortness, high density, safety, and high functionality. The circuit board puts forward higher performance requirements, the high-speed and multi-functionalization of electronic product information processing, and the continuous increase in application frequency. Above 3GHz will gradually become the mainstream. In addition to maintaining higher requirements for the heat resistance of laminate materials , the requirements for its dielectric constant and dielectric loss value will be lower and lower. [0003] The existing traditional FR-4 is difficult to meet the high-frequency and h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08L63/00C08L35/06C08L71/12B32B15/08B32B15/092B32B27/04H05K1/03
CPCB32B15/08B32B15/092C08L79/04H05K1/03C08L2201/08C08L2201/22C08L2201/02C08L2205/035C08L2203/20C08K2201/003B32B2260/046B32B2457/08C08L63/00C08L35/06C08L71/12C08K3/36B32B27/04C08G59/4261B32B27/06C08G59/4028C08J5/043C08J5/24C08K5/10C08K5/3445H05K1/0366C08J2363/00C08J2335/06C08J2371/12C08J2379/04B32B27/40C08K5/098C08K5/13C08K7/14C08L75/04
Inventor 方克洪李辉
Owner GUANGDONG SHENGYI SCI TECH
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