Photo-cured heat-cured resin composition and printed circuit board produced with the same

A resin composition, thermosetting technology, applied in printed circuits, printed circuit manufacturing, optics, etc., can solve the problems of reduced resist developability, high reactivity, residue residues, etc., and achieve excellent developability and operability. Excellent effect with excellent pattern accuracy
CN101320212BActive Publication Date: 2014-07-09TAIYO HLDG CO LTD
7 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TAIYO HLDG CO LTD
Publication Date
2014-07-09

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

A light-curing thermo-curing resin composition and a printed circuit board obtained using the same are provided, the composition has high light sensitivity and excellent curing depth in ultraviolet ray and laser exposure, thus further having great developing ability to pass through diluted alkaline aqueous solution while being excellent in storage stability and operability, so the composition is suitable for solder resisting agent. The light-curing thermo-curing resin composition comprises (A) carboxyl-containing resin, (B) mercaptobutyric acid or derivatives thereof, (C) photopolymerization initiator, (D) compounds having 2 or more of olefinic unsaturated groups in the molecules, and (E) thermo-curing components. The suitable (A) carboxyl-containing resin is preferably the carboxyl-containing resin capable of free radical polymerization and having unsaturated double bond. In addition, the (C) photopolymerization initiator is preferably oximes photopolymerization initiator (C1), particularly preferably proxetil photopolymerization initiator, aminoacetophenone photopolymerization initiator and / or acyl phosphine oxide photopolymerization initiator.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a photocurable / thermosetting resin composition developable with a dilute alkaline aqueous solution, a cured product thereof, and a printed wiring board having a resist pattern obtained by using the same. Background technique

[0002] Recently, in the exposure of the solder resist for printed wiring boards, laser scanning exposure has become widespread from the viewpoint of excellent alignment accuracy.

[0003] Laser exposure forms an image while scanning the solder resist on a patterned wiring board without using a photomask. Therefore, in the case of using an existing commercially available solder resist, the appropriate exposure amount is 200mJ / cm 2 The above, therefore, has a disadvantage that exposure takes a lot of time. Therefore, very high sensitivity is required for the solder resist corresponding to laser exposure.

[0004] From the viewpoints described above, oxime-based photopolymerization initiators capab...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More