Positive type photosensitive polyimide resin composition

A technology of polyimide resin and polyimide, which is applied in the direction of optics, optomechanical equipment, instruments, etc., can solve the problem of Tg drop of aromatic polyimide resin, achieve low dielectric constant, simple preparation, The effect of good photosensitivity

Active Publication Date: 2016-02-03
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the introduction of siloxane groups in the polyimide skeleton can endow the aromatic polyimide resin with excellent flexi

Method used

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  • Positive type photosensitive polyimide resin composition
  • Positive type photosensitive polyimide resin composition
  • Positive type photosensitive polyimide resin composition

Examples

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preparation example Construction

[0046] Preparation of photosensitive polyimide varnish: In the obtained alkali-soluble polyimide resin, add a certain amount of epoxy resin or benzoxazine crosslinking agent, and add solvent γ-butyrolactone at the same time, at room temperature Stir and dissolve. After the dissolution is uniform, add a certain amount of quinonediazide compound under dark light, stir and dissolve, dissolve evenly and filter to obtain a photosensitive polyimide varnish, and store it in dark light for future use.

[0047] Coating, exposure, development and curing of photosensitive polyimide. The specific steps are as follows: first, the film is coated by spin coating, and then pre-baked for 7 minutes (at 150° C.). After the pre-baked, exposure is carried out for 3 minutes respectively. Subsequently, a developing experiment was carried out (the developing solution was 2.38wt% tetramethylammonium hydroxide aqueous solution), and the developing time was 3 minutes, and then the developed samples were...

Embodiment 1

[0051] Under dry nitrogen flow, first make 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (hereinafter referred to as BAHF) 2.75g (7.5mmo), 1,3-bis(3-aminopropyl ) Tetramethyldisiloxane 0.124g (0.5mmol) was dissolved in 8g of N-methyl-2-pyrrolidone (NMP), then 3.12g (10mmol) of bis(3,4-dicarboxyphenyl) was added thereto ) ether dianhydride (ODPA), add 2g of NMP, make it react at 60°C for 45min, then add 0.327g (3mmol) of 4-aminophenol as an end-capping agent, and react for 0.5h. This was followed by stirring at 180° C. for 4 hours. After stirring, the solution was poured into 300 mL of water to obtain a white precipitate. Collect the precipitate by filtration, wash it with water three times, then wash it three times with hot water, and finally dry it in a vacuum dryer at 80°C for 20 hours to obtain a white alkali-soluble polyimide resin powder A-1.

[0052] Preparation of photosensitive polyimide varnish: Add 0.6 g of bisphenol A type epoxy resin to 3 g of the obtained r...

Embodiment 2

[0055] Under dry nitrogen flow, first make 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (hereinafter referred to as BAHF) 2.93g (8mmo), 3,3-di-tert-butylbenzidine 0.1468g (0.5mmol), be dissolved in the N-methyl-2-pyrrolidone (NMP) of 8g, then add 3.12g (10mmol) bis(3,4-dicarboxyphenyl) ether dianhydride (ODPA) to it subsequently, in Add 2g of NMP, make it react at 60°C for 45min, then add 0.327g (3mmol) of 4-aminophenol as an end-capping agent, and react for 0.5h. This was followed by stirring at 180° C. for 4 hours. After stirring, the solution was poured into 300 mL of water to obtain a white precipitate. Collect the precipitate by filtration, wash it with water three times, then wash it three times with hot water, and finally dry it in a vacuum dryer at 80°C for 20 hours to obtain a white alkali-soluble polyimide resin powder (A-2).

[0056]The preparation of photosensitive polyimide varnish: in the resin alkali-soluble polyimide resin (A-2) 3g that obtains, add bis...

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Abstract

The invention discloses a positive type photosensitive polyimide resin composition. The composition includes alkaline solubility polyimide (a), a photosensitizer (b) and a cross-linking agent (c). The cross-linking agent is composed of one or two of a benzoxazine compound and a compound with two or more epoxy groups contained in one molecule according to any ratio. The weight percentage of the alkaline solubility polyimide (a), the photosensitizer (b) and the cross-linking agent (c) is 100:10-50:5-20. According to the composition, 2,2-bis[4-(5-amino-2-pyridyloxy)phenyl]hexafluoropropane or 2,2-bis[4-(5-amino-2-pyridyloxy)phenyl] propane, 3,3-di-tert-butyl benzidine and siloxane diamine are used as diamine components for preparing the alkaline solubility polyimide resin. The prepared positive photosensitive polyimide resin composition is high in transmittance, low in coefficient of thermal expansion, high in heat resistance and excellent in photosensitive property.

Description

technical field [0001] The present invention relates to a photosensitive polyimide resin composition, in particular to a photosensitive polyimide resin composition that can be positively developed in an alkaline aqueous solution and is soluble in commonly used organic solvents such as amides and lactones and a positive-type photosensitive resin composition suitable for protective layers of flexible printed circuit boards, surface protective films of semiconductor elements, interlayer insulating films, and insulating layers of organic electroluminescent elements. Background technique [0002] Photosensitive polyimide, which is a polymer material with dual properties of light sensitivity and heat resistance, is widely used in flexible printed circuit boards and integrated circuits due to its unique properties. With the miniaturization of various electronic products in life, various smart phones, thin TVs and high-performance microprocessors are flooding today's life, flexible ...

Claims

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Application Information

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IPC IPC(8): G03F7/039C08G73/10
Inventor 童荣柏周光大林建华周慧李琦琳曹肖
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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