Flux activator, adhesive resin composition, adhesive paste, adhesive film, semiconductor device fabrication method, and semiconductor device

A resin composition and compound technology, applied in the fields of flux activators, semiconductor devices, and adhesive resin compositions, can solve the problems of narrow gaps between semiconductor chips and substrates, decreased productivity, and difficulty in cleaning flux activator residues. The effect of good flux activity and high reliability of electrical connection

Inactive Publication Date: 2011-01-05
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent years, as the connection pitch has become narrower, the gap between the semiconductor chip and the substrate has become narrower, making it difficult to remove flux activator residues.
Furthermore, it takes a long time to inject the liquid resin into the narrow space between the semiconductor chip and the substrate, so there is a problem of lower productivity

Method used

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  • Flux activator, adhesive resin composition, adhesive paste, adhesive film, semiconductor device fabrication method, and semiconductor device
  • Flux activator, adhesive resin composition, adhesive paste, adhesive film, semiconductor device fabrication method, and semiconductor device
  • Flux activator, adhesive resin composition, adhesive paste, adhesive film, semiconductor device fabrication method, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1～5

[0109] 25 parts by mass of phenoxy resin FX293 (manufactured by Toto Kasei Co., Ltd., product name) as a thermoplastic resin, and 30 parts by mass of solid polyfunctional epoxy resin EP1032H60 (manufactured by Nippon Epoxy Co., Ltd., product name) as an epoxy resin ) And 45 parts by mass of liquid bisphenol A epoxy resin EP828 (manufactured by Japan Epoxy Resin Co., Ltd., product name), as a condensed polycyclic 5 parts by mass of the compound (flux activator) of the oxazine skeleton shown in Table 1, 100 parts by mass of SE6050 (manufactured by ADMATECHS Co., Ltd., product name, average particle size 2μm) as a spherical silica filler in toluene-ethyl acetate It is dissolved and mixed in an ester solvent to make the solid content concentration 60-70% to make a varnish. Next, the varnish was coated on a separator (PET film) using a knife coater, and then dried in an oven at 70° C. for 10 minutes to produce adhesive films of Production Examples 1 to 5 having a thickness of 40 to ...

Embodiment 1～3 and comparative example 1、2

[0122] 25 parts by mass of phenoxy resin FX293 (manufactured by Toto Kasei Co., Ltd., product name) as a thermoplastic resin, and 30 parts by mass of solid polyfunctional epoxy resin EP1032H60 (manufactured by Nippon Epoxy Co., Ltd., product name) as an epoxy resin ) And 45 parts by mass of liquid bisphenol A epoxy resin EP828 (manufactured by Japan Epoxy Co., Ltd., product name), and 3 parts by mass of 2,4-dihydroxymethyl-5-phenylimidazole 2PHZ (Shikoku) as a curing agent Manufactured by Kasei Co., Ltd., product name), as a condensed polycyclic ring 5 parts by mass of the compound of the azine skeleton (flux activator) shown in Table 2 and 100 parts by mass of SE6050 (manufactured by ADMATECHS Co., Ltd., product name) as a spherical silica filler are dissolved in toluene-ethyl acetate solvent Mix it so that the solid content concentration is 60 to 70% to prepare a varnish. Next, the varnish was coated on a separator (PET film) using a knife coater, and then dried in an oven a...

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Abstract

Disclosed is a flux activator that comprises a compound with a condensed polycyclic oxazine skeleton.

Description

Technical field [0001] The present invention relates to a method for manufacturing a flux activator, an adhesive resin composition, an adhesive paste, an adhesive film, a semiconductor device, and a semiconductor device. Background technique [0002] In recent years, with the progress of miniaturization and high-functionality of electronic equipment, semiconductor devices have also been required to be miniaturized, thinner, and improved in electrical characteristics (for high-frequency transmission, etc.). Therefore, the conventional method of mounting a semiconductor chip on a substrate by wire bonding has begun to shift to a flip-chip connection method in which conductive protrusions called bumps are formed on the semiconductor chip and the substrate electrodes are directly connected. [0003] As the flip-chip connection method, a method of metal bonding using solder, tin, etc., a method of applying ultrasonic vibration to metal bonding, a method of maintaining mechanical contact...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G14/073C08G59/40C08K5/3445C08K5/357C08L101/00H01L21/60
CPCH01L2224/16H01L2224/83192C08K5/3445H01L2224/83856C09J163/00H01L24/90H01L2924/01004H01L2924/01046H01L2924/01012H01L2924/01078H01L24/16H01L2224/90H01L2924/01079C08G14/06C08L2666/28H01L2224/81191
Inventor 榎本哲也本田一尊永井朗
Owner HITACHI CHEM CO LTD
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